| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 03/13/2007 | US7190054 Semiconductor module having inner pressure release portion |
| 03/13/2007 | US7189596 Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures |
| 03/13/2007 | US7189593 Elimination of RDL using tape base flip chip on flex for die stacking |
| 03/08/2007 | WO2007027759A2 Polarization beam splitter and combiner |
| 03/08/2007 | WO2007026945A1 Circuit device and method for manufacturing same |
| 03/08/2007 | WO2007026944A1 Circuit device and method for manufacturing same |
| 03/08/2007 | WO2007026392A1 Semiconductor device and method for manufacturing same |
| 03/08/2007 | WO2007025489A1 Power semiconductor module comprising load connection elements applied to circuit carriers |
| 03/08/2007 | WO2005122250B1 High power mcm package with improved planarity and heat dissipation |
| 03/08/2007 | US20070055410 Control device, control method, and computer product |
| 03/08/2007 | US20070052112 Support with solder ball elements and a method for populating substrates with solder balls |
| 03/08/2007 | US20070051964 High density led array |
| 03/08/2007 | US20070051894 X-ray detector |
| 03/08/2007 | US20070051890 Sensor having differential polarization capability and a network comprised of several such sensors |
| 03/08/2007 | DE102006004031B3 Power semiconductor module for inverter etc., has connection points for low and high potentials in sequence that corresponds to that of external connection terminals on two bus rails |
| 03/08/2007 | DE102005059189B3 Arrangement of semiconductor memory devices for module, has conductive tracks connecting contacts of flexible substrate and stacked semiconductor devices |
| 03/07/2007 | EP1760784A2 Low temperatur Co-Fired ceramic (LTCC) tape compositons, light-Emitting diode(LED) modules, lighting devices and methods of forming thereof |
| 03/07/2007 | EP1623450A4 High power allngan based mulit-chip light emitting diode |
| 03/07/2007 | EP1451872B1 Light emitting diode-based luminous panel and carrier plate |
| 03/07/2007 | EP1399963B1 High temperature electrostatic chuck |
| 03/07/2007 | CN2877037Y Integrated element containing LED and circuitboard |
| 03/07/2007 | CN2877036Y LED module |
| 03/07/2007 | CN1926928A Circuit device and method for manufacturing same |
| 03/07/2007 | CN1926685A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 03/07/2007 | CN1926684A Capacitor built-in semiconductor device and method for manufacturing same |
| 03/07/2007 | CN1925155A 集成电路装置 The integrated circuit device |
| 03/07/2007 | CN1925153A Luminescent diode chip crystal fusing technology |
| 03/07/2007 | CN1925152A Carrying structure for electron element |
| 03/07/2007 | CN1303688C Electronic installation, manufacturing method thereof and electronic equipment |
| 03/07/2007 | CN1303660C Semiconductor packaging method for attaching semiconductor duct core to substrate by using adhesive wafers |
| 03/07/2007 | CN1303659C Semiconductor device and stacked semiconductor device and its manufacturing method |
| 03/06/2007 | US7187559 Circuit board device and its manufacturing method |
| 03/06/2007 | US7187558 Leadframe-based module DC bus design to reduce module inductance |
| 03/06/2007 | US7187551 Module for solid state relay for engine cooling fan control |
| 03/06/2007 | US7187203 Cascadable memory |
| 03/06/2007 | US7187202 Circuit for reducing programmable logic pin counts for large scale logic |
| 03/06/2007 | US7187119 Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| 03/06/2007 | US7187074 Semiconductor and electronic device with spring terminal |
| 03/06/2007 | US7187070 Stacked package module |
| 03/06/2007 | US7187009 Light emitting diode device for illumination objects |
| 03/06/2007 | US7186921 Circuit device and manufacturing method thereof |
| 03/06/2007 | US7186586 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 03/06/2007 | US7186576 Stacked die module and techniques for forming a stacked die module |
| 03/01/2007 | WO2007025127A2 Microelectronic device packages, stacked microlecetronic device packages, and methods for manufacturing microelectronic devices |
| 03/01/2007 | WO2007025023A2 Apparatus and methods for optical switching using nanoscale optics |
| 03/01/2007 | WO2007025013A2 Nanoscale optical microscope |
| 03/01/2007 | WO2007025004A2 Apparatus and methods for nanolithography using nanoscale optics |
| 03/01/2007 | WO2007024334A1 Infrared detector for a mobile display |
| 03/01/2007 | WO2007024022A1 Semiconductor device manufacturing method, semiconductor device and wafer |
| 03/01/2007 | WO2007024009A1 Semiconductor integrated circuit device and method for manufacturing same |
| 03/01/2007 | WO2007023963A1 Semiconductor device |
| 03/01/2007 | WO2007023852A1 Semiconductor device and method for manufacturing same |
| 03/01/2007 | WO2007023825A1 Electronic component mounting method |
| 03/01/2007 | WO2007023747A1 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device |
| 03/01/2007 | WO2006129232A3 Flexible display device |
| 03/01/2007 | WO2005091854A3 Ventilated photovoltaic module frame |
| 03/01/2007 | US20070048903 Multi-chip package type semiconductor device |
| 03/01/2007 | US20070048891 Device transferring method, and device arraying method |
| 03/01/2007 | US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology |
| 03/01/2007 | US20070045868 Lsi package provided with interface module |
| 03/01/2007 | US20070045806 Structure of an ultra-thin wafer level stack package |
| 03/01/2007 | US20070045547 Method and apparatus for radiation detection |
| 03/01/2007 | DE102006036541A1 Unterschiedliche Chipleistungsfähigkeit innerhalb eines Mehrchipgehäuses Different chip performance within a multi-chip package |
| 03/01/2007 | DE102005053974B3 Electrical circuit arrangement has heat sink thermally coupled to a circuit carrier for electronic components and a second carrier within the first having an electronic component between it and the heat sink |
| 03/01/2007 | DE102005043557B4 Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten zwischen Oberseite und Rückseite A process for producing a semiconductor device with vias between the upper side and back |
| 03/01/2007 | DE102005039947A1 Leistungshalbleitermodul mit Befestigungseinrichtung Power semiconductor module with mounting means |
| 02/28/2007 | EP1758440A2 Semiconductor device and power conversion apparatus using the same |
| 02/28/2007 | EP1758176A1 Terminal box for solar cell module |
| 02/28/2007 | EP1756876A2 High density led array |
| 02/28/2007 | EP1756867A1 Method and system for stacking integrated circuits |
| 02/28/2007 | CN2874772Y Integrated light emitting unit |
| 02/28/2007 | CN2873923Y Solar energy generation and light emitting tile |
| 02/28/2007 | CN1922437A Method and apparatus for led panel lamp systems |
| 02/28/2007 | CN1921111A Solar battery LED interlayer for photoelectric curtain wall glass |
| 02/28/2007 | CN1921110A Assembly with a power semiconductor module and a connector |
| 02/28/2007 | CN1921109A Power semiconductor module with mounting device |
| 02/28/2007 | CN1921108A Semiconductor package and manufacturing method thereof |
| 02/28/2007 | CN1921107A Image sensor module, method of manufacturing the same, and camera module using the same |
| 02/28/2007 | CN1921106A Opto-electronic package, and methods and systems for making and using same |
| 02/28/2007 | CN1921105A Semiconductor device and power conversion apparatus using the same |
| 02/28/2007 | CN1921104A Double-core light-emitting diode for traffic light |
| 02/28/2007 | CN1302516C Method of manufacturing modules with an integrated circuit |
| 02/27/2007 | US7184276 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 02/27/2007 | US7183796 Configuration memory implementation for LUT-based reconfigurable logic architectures |
| 02/27/2007 | US7183718 Light-emitting device |
| 02/27/2007 | US7183655 Packaged semiconductor device |
| 02/27/2007 | US7183654 Providing a via with an increased via contact area |
| 02/27/2007 | US7183648 Method and apparatus for low temperature copper to copper bonding |
| 02/27/2007 | US7183616 High speed switching MOSFETS using multi-parallel die packages with/without special leadframes |
| 02/27/2007 | US7183611 SRAM constructions, and electronic systems comprising SRAM constructions |
| 02/27/2007 | US7183581 Optical transmission module for use in high-speed optical fiber communication |
| 02/22/2007 | WO2006131209A3 Photodiode with integrated semiconductor circuit and method for the production thereof |
| 02/22/2007 | US20070042594 Semiconductor device and method of manufacturing the same |
| 02/22/2007 | US20070042562 Integrated circuit device |
| 02/22/2007 | US20070042561 Semiconductor device and productioin method thereof |
| 02/22/2007 | US20070042531 Method for producing semiconductor device and semiconductor device |
| 02/22/2007 | US20070040261 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 02/22/2007 | US20070040251 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
| 02/22/2007 | US20070040189 Bi-directional switch, and use of said switch |
| 02/22/2007 | US20070040185 Semiconductor device and capacitance regulation circuit |