H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2006
11/23/2006	DE102005041490A1 Vorrichtung mit einem Kunststoffbauteil und mit einer Leuchtdiode A device with a plastic component and a light-emitting diode
11/23/2006	DE102005023210A1 Vorrichtung zur Erzeugung von Strahlung sowie Nachtsichtgerät mit einer solchen Vorrichtung A device for generating radiation as well as night vision device having such a device
11/23/2006	DE10163799B4 Halbleiterchip-Aufbausubstrat und Verfahren zum Herstellen eines solchen Aufbausubstrates A semiconductor chip mounting substrate and method for manufacturing such a substrate structure
11/23/2006	DE10125341B4 Bestrahlungsvorrichtung und Lichthärtgerät Irradiation apparatus and light curing device
11/23/2006	CA2608323A1 Integrated circuit with signal bus formed by cell abutment of logic cells
11/22/2006	EP1724835A1 Electronic module comprising a layer containing integrated circuit die and a method for making the same
11/22/2006	EP1724834A1 Radiation generating device and night vision apparatus comprising such device
11/22/2006	EP1724833A2 SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
11/22/2006	EP1724832A2 Multilayer module formed of modules stacked on top of each other and method of manufacturing the same
11/22/2006	EP1723689A2 Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications
11/22/2006	EP1350290B1 Silicon wafer with embedded optoelectronic material for monolithic oeic
11/22/2006	EP1139705B1 Printed wiring board and method of producing the same
11/22/2006	EP1137332B1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board
11/22/2006	EP0803174B1 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
11/22/2006	CN2840501Y Pipe bundle plate combined rectifier
11/22/2006	CN1868071A Light-emitting device
11/22/2006	CN1868062A Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
11/22/2006	CN1866563A Apparatus with a plastic member and a LED
11/22/2006	CN1866556A Light type power led
11/22/2006	CN1866553A LED chip package and packaging method thereof
11/22/2006	CN1866552A Light going direction changing unit, module and LED assembly comprising the same
11/22/2006	CN1866551A Light emitting device with LED flipped side-structure
11/22/2006	CN1866529A Semiconductor wafer, semiconductor device and manufacturing method of semiconductor device
11/22/2006	CN1866516A LED lamp and LED lamp apparatus
11/22/2006	CN1866515A SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
11/22/2006	CN1866514A Pluggable module and cage
11/22/2006	CN1866513A Packaging structure with mixed circuitry and composite substrate
11/22/2006	CN1866512A Memory module assembly and manufacturing method thereof
11/22/2006	CN1866484A Method for manufacturing photoelectric chip packaging structure with control chip
11/22/2006	CN1286175C Light-emitting device of high-power light-emitting diode
11/22/2006	CN1286158C Method of manufacturing semiconductor device and electronic device
11/21/2006	US7138828 FPGA architecture with mixed interconnect resources optimized for fast and low-power routing and methods of utilizing the same
11/21/2006	US7138723 Deformable semiconductor device
11/21/2006	US7138722 Semiconductor device
11/21/2006	US7138721 Memory module
11/21/2006	US7138712 Receptacle for a programmable, electronic processing device
11/21/2006	US7138710 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/21/2006	US7138709 Microelectronic package array
11/21/2006	US7138708 Electronic system for fixing power and signal semiconductor chips
11/21/2006	US7138706 Semiconductor device and method for manufacturing the same
11/21/2006	US7138635 Detector module for CT and/or PET and/or SPECT tomography
11/21/2006	US7138578 Roof cover type solar cell module
11/21/2006	US7138298 Semiconductor chip with external connecting terminal
11/21/2006	US7137193 Programmed material consolidation methods for fabricating printed circuit board
11/21/2006	CA2261864C Integrated circuit device manufacture
11/16/2006	WO2006121593A1 Method and apparatus for electronically aligning capacitively coupled mini-bars
11/16/2006	WO2006120849A1 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
11/16/2006	US20060259892 R-cells containing CDM clamps
11/16/2006	US20060259888 Method of tiling analog circuits that include resistors and capacitors
11/16/2006	US20060259887 Integrated circuit design utilizing array of functionally interchangeable dynamic logic cells
11/16/2006	US20060258052 Wafer level pre-packaged flip chip
11/16/2006	US20060257822 Illuminated electric toothbrushes and methods of use
11/16/2006	US20060255475 Wafer level pre-packaged flip chip system
11/16/2006	US20060255458 Semiconductor module provided with contacts extending through the package
11/16/2006	US20060255444 System and method for vertically stacking computer memory components
11/16/2006	US20060255347 Multi element, multi color solid state LED/laser
11/16/2006	US20060254809 Modular integrated circuit chip carrier
11/16/2006	US20060254712 Method for making a flat-top pad
11/16/2006	DE202005013344U1 Electrical module unit for sensor, e.g. inertia sensor, has two spraying bodies formed, so that each body surrounds number of conduction cables, and pressing grids freely running between spraying bodies and embedded in spraying bodies
11/16/2006	DE19947044B4 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same
11/16/2006	DE19842481B4 Stapelbarer Halbleiterchip und Verfahren zur Herstellung eines gestapelten Halbleiterchipmoduls A stackable semiconductor chip and method of manufacturing a stacked semiconductor chip module
11/16/2006	DE102005022832A1 Scheinwerfer für Film- und Videoaufnahmen Projector for film and video recordings
11/16/2006	DE10157362B4 Leistungsmodul und Verfahren zu seiner Herstellung Power module and method for its preparation
11/15/2006	EP1722413A2 Terminal connection structure for semiconductor device
11/15/2006	EP1360713A4 Light emitting semiconductor package
11/15/2006	CN1864276A Multi-stack surface mount light emitting diodes
11/15/2006	CN1864266A Spher-supported thin film phosphor electroluminescent devices
11/15/2006	CN1862842A LED element
11/15/2006	CN1862811A 叠置半导体存储器件 Stacked semiconductor memory device
11/15/2006	CN1862810A 半导体器件 Semiconductor devices
11/15/2006	CN1862809A Packaging structure of power chip
11/15/2006	CN1862808A Chip architecture with multiple functions
11/15/2006	CN1862783A Method for preparing transistor and combined improved structure obtained thereby
11/15/2006	CN1285098C Photoelectronic device integration
11/14/2006	US7135888 Programmable routing structures providing shorter timing delays for input/output signals
11/14/2006	US7135780 Semiconductor substrate for build-up packages
11/14/2006	US7135779 Method for packaging integrated circuit chips
11/14/2006	US7135762 Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument
11/14/2006	US7135708 Semiconductor apparatus having conductive layers and semiconductor thin films
11/14/2006	US7135687 Thermoelectrically controlled X-ray detector array statement regarding federally sponsored research
11/14/2006	US7135378 Process for fabricating a semiconductor device having a plurality of encrusted semiconductor chips
11/14/2006	US7135353 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
11/14/2006	US7134775 Vehicular headlamp and light-emitting module therefor
11/14/2006	CA2290801C Electronic power device
11/09/2006	WO2006118994A2 Multi-chip module and method of manufacture
11/09/2006	WO2006118031A1 Insulating circuit board and power module substrate
11/09/2006	WO2006117961A1 Semiconductor package and method for manufacturing same
11/09/2006	WO2006117711A1 Rgb thermal isolation substrate
11/09/2006	US20060252336 Photo-radiation source
11/09/2006	US20060252229 Integrated circuit on high performance chip
11/09/2006	US20060252183 Semiconductor device and method for the fabrication thereof
11/09/2006	US20060252181 Method of forming a stack of packaged memory dice
11/09/2006	US20060252180 Method for a low profile multi-IC chip package connector
11/09/2006	US20060251355 Photoelectric chip array package structure
11/09/2006	US20060250160 Fault-tolerant clock generator
11/09/2006	US20060249823 Semiconductor package having ultra-thin thickness and method of manufacturing the same
11/09/2006	US20060249746 Light emitting device
11/09/2006	US20060249743 Semiconductor light-emitting device and method for manufacturing the device
11/09/2006	US20060249679 Visible light and ir combined image camera
11/09/2006	US20060248715 Manufacturing method of solid-state image sensing device

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