| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/09/2007 | US7161371 Module part |
| 01/09/2007 | US7161292 White light LED with multicolor light-emitting layers of macroscopic structure widths, arranged on a light diffusing glass |
| 01/09/2007 | US7161249 Multi-chip package (MCP) with spacer |
| 01/09/2007 | US7161241 Multi-layer board |
| 01/09/2007 | US7161235 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore |
| 01/09/2007 | US7161234 Semiconductor component and production method suitable therefor |
| 01/09/2007 | US7160796 Method for manufacturing wiring board and semiconductor device |
| 01/09/2007 | US7160743 Using protective cups to fabricate light emitting semiconductor packages |
| 01/09/2007 | US7160478 Method for producing electronic componets |
| 01/09/2007 | CA2393219C Light-emitting or light-receiving semiconductor device and method for making the same |
| 01/09/2007 | CA2377175C Semiconductor memory chip module |
| 01/04/2007 | WO2007002955A1 Interconnection device including one or more embedded vias and method of producing the same |
| 01/04/2007 | WO2007002868A1 Packaging logic and memory integrated circuits |
| 01/04/2007 | WO2007000037A1 Bendable high flux led array |
| 01/04/2007 | US20070004089 Stacked memory and manufacturing method thereof |
| 01/04/2007 | US20070004084 Chip and multi-chip semiconductor device using thereof and method for manufacturing same |
| 01/04/2007 | US20070002203 Apparatuses and methods for forming assemblies |
| 01/04/2007 | US20070001299 Stacked semiconductor package |
| 01/04/2007 | US20070001298 Semiconductor device with built-in capacitor, and method of producing the same |
| 01/04/2007 | US20070001188 Semiconductor device for emitting light and method for fabricating the same |
| 01/04/2007 | US20070001177 Integrated light-emitting diode system |
| 01/04/2007 | DE202006015506U1 Illuminating appliance with numerous LED chips contained in holder with contact pins and of good heat convection from LED chips in radial and symmetrical lay-out on holder, for uniform and fast heat convection |
| 01/04/2007 | DE202006014351U1 LED-Modul mit RGB LED-Chips LED module with RGB LED chips |
| 01/04/2007 | DE102006030132A1 Electrical module unit for sensor, e.g. inertia sensor, has two spraying bodies formed, so that each body surrounds number of conduction cables, and pressing grids freely running between spraying bodies and embedded in spraying bodies |
| 01/04/2007 | DE102005030465A1 Semiconductor stack for use as data processing optical semiconductor component, has semiconductor components stacked on each other with laminar wiring structure on coplanar surface in active upper side of semiconductor chip |
| 01/03/2007 | EP1738417A1 Photovoltaic system and method of making same |
| 01/03/2007 | EP1264298B1 Led light source with field-of-view-controlling optics |
| 01/03/2007 | EP1145314B1 High frequency power transistor device |
| 01/03/2007 | EP0938749B1 Integrated circuit with housing accommodating the latter |
| 01/03/2007 | CN2854810Y Function region structure of surface adhesive LED support |
| 01/03/2007 | CN1890805A Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
| 01/03/2007 | CN1890800A Integrating passive components on spacer in stacked dies |
| 01/03/2007 | CN1889264A Method for integrating red, green and blue three chips into silicon chip |
| 01/03/2007 | CN1889263A Light-emitting diode module |
| 01/03/2007 | CN1889262A Block shape water-cooling electric semiconductor device |
| 01/03/2007 | CN1889261A Large power LED extended light soure |
| 01/03/2007 | CN1889260A Semiconductor device capable of holding large size chip and producing method and relative carrier thereof |
| 01/03/2007 | CN1889259A Anti-electrostatic discharging radiating module and system thereof |
| 01/03/2007 | CN1293790C Built-in module in element and its making process |
| 01/03/2007 | CN1293648C Solar cell assembly |
| 01/03/2007 | CN1293626C Module shell and power semiconductor module |
| 01/03/2007 | CN1293620C High temperature electrostatic chuck |
| 01/02/2007 | US7159203 Differential delay-line |
| 01/02/2007 | US7157973 Layout technique for matched resistors on an integrated circuit substrate |
| 01/02/2007 | US7157937 Structured integrated circuit device |
| 01/02/2007 | US7157936 Utilization of unused IO block for core logic functions |
| 01/02/2007 | US7157794 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
| 01/02/2007 | US7157789 Semiconductor device and method for manufacturing the same |
| 01/02/2007 | US7157787 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
| 01/02/2007 | US7157745 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
| 01/02/2007 | US7157742 Integrated circuit device |
| 01/02/2007 | US7157362 Electronic circuit unit and method of fabricating the same |
| 01/02/2007 | US7157292 Leadframe for a multi-chip package and method for manufacturing the same |
| 12/28/2006 | WO2006137819A2 High density vertically stacked semiconductor device |
| 12/28/2006 | WO2006136893A1 Electronic module assembly with heat spreader |
| 12/28/2006 | WO2005122249A3 Semiconductor device module with flip chip devices on a common lead frame |
| 12/28/2006 | US20060292752 Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer |
| 12/28/2006 | US20060292750 Standoffs for centralizing internals in packaging process |
| 12/28/2006 | US20060292746 Stacked die in die BGA package |
| 12/28/2006 | US20060292745 Stacked die in die BGA package |
| 12/28/2006 | US20060292743 Stacked die in die BGA package |
| 12/28/2006 | US20060292722 Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 12/28/2006 | US20060290004 Semiconductor device |
| 12/28/2006 | US20060289990 Apparatus and method for high density multi-chip structures |
| 12/28/2006 | US20060289760 Using same optics to image, illuminate, and project |
| 12/28/2006 | DE102006022136A1 Halbleiterspeicherbauelement The semiconductor memory device |
| 12/28/2006 | DE102005028951A1 Anordnung zur elektrischen Verbindung einer Halbleiter-Schaltungsanordnung mit einer äusseren Kontakteinrichtung und Verfahren zur Herstellung derselben Arrangement for the electrical connection of a semiconductor circuit arrangement having an outer contact means and methods for making the same |
| 12/28/2006 | DE102005027371A1 Lighting unit construction kit, has lighting units, each with lip plate with lips that can be pressed on web by hand, and light emitting diodes embedded in body of units, where webs have paths formed as switching guides at ends of units |
| 12/28/2006 | DE102005027356A1 Halbleiterleistungsbauteilstapel in Flachleitertechnik mit oberflächenmontierbaren Außenkontakten und ein Verfahren zur Herstellung desselben The same semiconductor power device stack in flat-wire technology with surface-mountable external contacts and a method for producing |
| 12/27/2006 | EP1737050A1 Light-emitting device and illuminating device |
| 12/27/2006 | EP1737039A2 Semiconductor Package |
| 12/27/2006 | EP1736035A2 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| 12/27/2006 | EP1735844A1 Micro-reflectors on a substrate for high-density led array |
| 12/27/2006 | EP1735830A2 Multi-substrate circuit assembly |
| 12/27/2006 | EP1735149A2 Light-emitting panel and optically effective foil |
| 12/27/2006 | CN2852487Y Thyratron valve set mechanical structure of horizontal static reactive-load compensator |
| 12/27/2006 | CN2852395Y Red, green, blue chips integrated silicon chip |
| 12/27/2006 | CN2852391Y Infrared receiving module |
| 12/27/2006 | CN2850965Y Transparent plate and subassembly and conversion device |
| 12/27/2006 | CN1885577A Packaging assembly of SMD light emitting diodes and manufacturing method thereof |
| 12/27/2006 | CN1885537A Photoelectric integrative infrared receiver and packaging method |
| 12/27/2006 | CN1885536A 半导体封装 The semiconductor package |
| 12/27/2006 | CN1885535A Power semiconductor module |
| 12/27/2006 | CN1885534A Semiconductor device, manufacturing method for semiconductor device, and electronic equipment |
| 12/27/2006 | CN1885525A Through-wafer vias and surface metallization for coupling thereto |
| 12/27/2006 | CN1292493C Enhanced light extration in LEDs through the use of internal and external optical elements |
| 12/27/2006 | CN1292490C Regeneration method for solar cell module and solar cell module |
| 12/27/2006 | CN1292481C System combined semiconductor device |
| 12/26/2006 | US7155684 Integrated circuit device and method for forming the same |
| 12/26/2006 | US7154760 Power amplifier module |
| 12/26/2006 | US7154196 Printed circuit board for a three-phase power device having embedded directional impedance control channels |
| 12/26/2006 | US7154189 Semiconductor device and method for fabricating the same |
| 12/26/2006 | US7154186 Multi-flip chip on lead frame on over molded IC package and method of assembly |
| 12/26/2006 | US7154175 Ground plane for integrated circuit package |
| 12/26/2006 | US7154174 Power supply packaging system |
| 12/26/2006 | US7154149 EDS protection configuration and method for light emitting diodes |
| 12/26/2006 | US7154046 Flexible dielectric electronic substrate and method for making same |
| 12/26/2006 | US7153164 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures |
| 12/26/2006 | US7153143 Circuit carrier and production thereof |
| 12/26/2006 | US7153009 Vehicular headlamp |