| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/08/2007 | EP1697987A4 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 08/08/2007 | EP1588424A4 Integrated photovoltaic roofing system |
| 08/08/2007 | EP1547161B1 Packaging structure for imaging detectors |
| 08/08/2007 | EP1419530B1 Method for producing electronic components |
| 08/08/2007 | EP1252654B1 A method for transferring and stacking of semiconductor devices |
| 08/08/2007 | CN2932625Y Lateral LED |
| 08/08/2007 | CN2932624Y A standard voltage-stabilizing tube for silicon plane temperature compensation |
| 08/08/2007 | CN2932623Y Three-dimensional LED |
| 08/08/2007 | CN1331243C Structure of LED base and pins and producing method |
| 08/08/2007 | CN1331228C Mixed type module |
| 08/08/2007 | CN1331227C Circuit board and production method therefor |
| 08/08/2007 | CN1331220C Method of manufacturing an electronic device |
| 08/08/2007 | CN1331205C Large area silicon carbide devices and manufacturing methods therefor |
| 08/08/2007 | CN101015057A Stereoscopic electronic circuit device, electronic device using the same, and method for manufacturing the same |
| 08/08/2007 | CN101015056A Integrated transistor module and method of fabricating same |
| 08/08/2007 | CN101013693A Bidirectional bipolar transistor |
| 08/08/2007 | CN101013692A Bidirectional insulated gate bipolar transistor |
| 08/08/2007 | CN101013691A Insulated gate bipolar transistor module |
| 08/08/2007 | CN101013690A Bidirectional insulated gate field-effect transistor |
| 08/08/2007 | CN101013689A LED packaging structure and packaging method |
| 08/08/2007 | CN101013688A Electronic circuit module and method for fabrication thereof |
| 08/08/2007 | CN101013684A Semiconductor device and method of manufacturing the same |
| 08/07/2007 | US7254030 Heat sink |
| 08/07/2007 | US7253660 Multiplexing device including a hardwired multiplexer in a programmable logic device |
| 08/07/2007 | US7253530 Method for producing chip stacks |
| 08/07/2007 | US7253529 Multi-chip package structure |
| 08/07/2007 | US7253527 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
| 08/07/2007 | US7253517 Method and apparatus for combining multiple integrated circuits |
| 08/07/2007 | US7253514 Self-supporting connecting element for a semiconductor chip |
| 08/07/2007 | US7253510 Ball grid array package construction with raised solder ball pads |
| 08/07/2007 | US7253457 Semiconductor device with external terminals arranged symmetrically with respect to a normal external terminal arrangement |
| 08/07/2007 | US7253027 Method of manufacturing hybrid integrated circuit device |
| 08/07/2007 | US7253026 Ultra-thin semiconductor package device and method for manufacturing the same |
| 08/07/2007 | US7253025 Multiple substrate microelectronic devices and methods of manufacture |
| 08/02/2007 | WO2007086498A1 Substrate with built-in semiconductor element and built-in semiconductor element type multilayered circuit board |
| 08/02/2007 | WO2007086481A1 Electronic device package, module and electronic device |
| 08/02/2007 | WO2007086285A1 Signal transmission system and semiconductor integrated circuit device |
| 08/02/2007 | WO2007036829A3 High brightness light emitting diode device |
| 08/02/2007 | US20070178624 Semiconductor Arrangement |
| 08/02/2007 | US20070176619 Probe For Semiconductor Devices |
| 08/02/2007 | US20070176278 Multi-chips stacked package |
| 08/02/2007 | DE4418426B4 Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls The semiconductor power module and method of manufacturing the semiconductor power module |
| 08/02/2007 | DE19833245B4 Halbleiterlichtemissionseinrichtung mit blasenfreiem Gehäuse Semiconductor light-emitting device with bubble-free housing |
| 08/02/2007 | DE10339762B4 Chipstapel von Halbleiterchips und Verfahren zur Herstellung desselben The same chip stack of semiconductor chips and processes for making |
| 08/02/2007 | DE10238843B4 Halbleiterbauelement Semiconductor device |
| 08/02/2007 | DE10227544B4 Vorrichtung zur optischen Datenübertragung Device for optical data transmission |
| 08/02/2007 | DE102007004579A1 Intermediate product in production of light sources with attached optical beam light guidance elements to narrow beam divergence or form beams from light emitters is mounted on a stiffer carrier |
| 08/01/2007 | EP1814321A1 Digital television receiver circuit module |
| 08/01/2007 | EP1814165A1 Semiconductor device and method of manufacturing semiconductor device |
| 08/01/2007 | EP1461715A4 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 08/01/2007 | CN2929964Y High power LED extension light source |
| 08/01/2007 | CN2929963Y High power LED light source including emergency light source |
| 08/01/2007 | CN1330010C Multi-color light emitting diode package |
| 08/01/2007 | CN1330007C High power LED |
| 08/01/2007 | CN1329977C Method for producing a multichip module and multichip module |
| 08/01/2007 | CN101009351A Semiconductor light emitting device and semiconductor light emitting device assembly |
| 08/01/2007 | CN101009275A Organic light-emitting display device and method for fabricating the same |
| 08/01/2007 | CN101009274A Oganic light-emitting display device and method for fabricating the same |
| 08/01/2007 | CN101009273A Integration encapsulation structure of cantilever stack system and its encapsulation method |
| 08/01/2007 | CN101009272A Cooling apparatus for memory module |
| 08/01/2007 | CN101009271A Stack of semiconductor chips |
| 08/01/2007 | CN101009270A Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein |
| 08/01/2007 | CN101009269A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/01/2007 | CN101009261A Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module |
| 08/01/2007 | CN101008990A 半导体存储卡 The semiconductor memory card |
| 08/01/2007 | CN101008989A Flash memory packaging method and structure thereof |
| 07/31/2007 | US7250787 Digital audio system on a chip with configurable GPIOs |
| 07/31/2007 | US7250686 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
| 07/31/2007 | US7250680 Semiconductor circuitry constructions |
| 07/31/2007 | US7250676 Multi-package module with heat spreader |
| 07/31/2007 | US7250674 Coolant cooled type semiconductor device |
| 07/31/2007 | US7250664 Integrated circuit device packaging structure and packaging method |
| 07/31/2007 | US7250637 Card type LED illumination source |
| 07/31/2007 | US7250355 Multilayered circuit substrate, semiconductor device and method of producing same |
| 07/26/2007 | WO2007083351A1 Semiconductor device and method for manufacturing same |
| 07/26/2007 | WO2007082854A1 Semiconductor devices and methods of manufacture thereof |
| 07/26/2007 | WO2007056013A3 High density three dimensional semiconductor die package |
| 07/26/2007 | WO2007054368A3 Semiconductor device comprising a housing containing a triggering unit |
| 07/26/2007 | WO2005043584A3 Single mask via method and device |
| 07/26/2007 | US20070172102 Imaging apparatus and method for the operation thereof |
| 07/26/2007 | US20070170583 Multilayer integrated circuit for RF communication and method for assembly thereof |
| 07/26/2007 | US20070170576 Wafer level stack structure for system-in-package and method thereof |
| 07/26/2007 | US20070170569 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 07/26/2007 | DE10230105B4 Weiße LED-Lichtquelle White LED light source |
| 07/26/2007 | DE102006003376A1 Memory module has main face of printed board, which is arranged on semiconductor components, where printed board has line, which reaches up to input connections from conductive strip, at some of semiconductor components |
| 07/26/2007 | DE102006002090A1 Memory module radiator box for use in fully buffered dual inline memory module to remove heat produced in memory module, has even metal plate, at which memory module is provided, where metal plate at the outer edge has reinforcing element |
| 07/26/2007 | DE102006001792A1 Semiconductor module, has semiconductor chip stack arranged on wiring substrate, where heat conducting layer e.g. foil with anisotropic heat conducting particles is arranged between semiconductor chips |
| 07/26/2007 | DE102006001767A1 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing |
| 07/26/2007 | DE10142119B4 Elektronisches Bauteil und Verfahren zu seiner Herstellung Electronic component and method for its preparation |
| 07/25/2007 | EP1811575A2 Light-receiving or light emitting device and method of manufacturing the same |
| 07/25/2007 | EP1811569A2 Organic light emitting display |
| 07/25/2007 | EP1811566A2 Three-dimensional Multi-Chips and tri-axial sensors and methods of manufacuring the same |
| 07/25/2007 | EP1810333A1 Ic chip, antenna, and manufacturing method of the ic chip and the antenna |
| 07/25/2007 | CN2927321Y Large-power semiconductor luminescent device |
| 07/25/2007 | CN2927320Y Combined improved structure of transistor |
| 07/25/2007 | CN1328773C Electronic element, method for producing electronic element and electronic apparatus |
| 07/25/2007 | CN1328756C Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
| 07/25/2007 | CN101005729A Interconnect structure for transducer assembly |
| 07/25/2007 | CN101005065A Light emitting semiconductor module with by-path turn-on switch |
| 07/25/2007 | CN101005064A Multichip packaging structure and its production method |