| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/25/2007 | DE10259221B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making |
| 01/25/2007 | DE10251527B4 Verfahren zur Herstellung einer Stapelanordnung eines Speichermoduls A method of manufacturing a stack structure of a memory module |
| 01/25/2007 | DE102006005955B4 Inline-Speichermodul Inline Memory Module |
| 01/24/2007 | EP1745682A2 Apparatus, system, and method for high flux, compact compton x-ray source |
| 01/24/2007 | EP1745510A2 A method of assembly and assembly thus made |
| 01/24/2007 | EP1449268A4 Radial power megasonic transducer |
| 01/24/2007 | CN1902757A Illumination assembly |
| 01/24/2007 | CN1901235A Surface mount type photo-interrupter and method for manufacturing the same |
| 01/24/2007 | CN1901190A Side view led with improved arrangement of protection device |
| 01/24/2007 | CN1901189A Plane flip-chip LED integrated chip and producing method |
| 01/24/2007 | CN1901188A Photoelectric semiconductor element with high light emitting efficiency |
| 01/24/2007 | CN1901187A Semiconductor device |
| 01/24/2007 | CN1901186A Device and method for emitting output light using multiple light sources with photoluminescent material |
| 01/24/2007 | CN1901178A Relay board and semiconductor device having the relay board |
| 01/24/2007 | CN1296998C Semiconductor device, semiconductor package, and method for testing semiconductor device |
| 01/23/2007 | US7167608 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical interconnects and manufacturing methods thereof |
| 01/23/2007 | US7167043 Decoupling circuit for co-packaged semiconductor devices |
| 01/23/2007 | US7167025 Non-sequentially configurable IC |
| 01/23/2007 | US7167023 Multiple data rate interface architecture |
| 01/23/2007 | US7166926 Method for producing semiconductor device and semiconductor device |
| 01/23/2007 | US7166916 Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus |
| 01/23/2007 | US7166495 Method of fabricating a multi-die semiconductor package assembly |
| 01/23/2007 | US7166494 Method of fabricating a semiconductor stacked multi-package module having inverted second package |
| 01/23/2007 | US7166493 Package with integrated inductor and/or capacitor |
| 01/23/2007 | US7165896 Light transmitting modules with optical power monitoring |
| 01/23/2007 | US7165316 Methods for manufacturing resistors using a sacrificial layer |
| 01/18/2007 | WO2007008717A1 Surface mountable light emitting diode assemblies packaged for high temperature operation |
| 01/18/2007 | WO2007008171A2 Integrated circuit device and method of manufacturing thereof |
| 01/18/2007 | WO2007007445A1 Semiconductor device and method for manufacturing same |
| 01/18/2007 | WO2005122250A3 High power mcm package with improved planarity and heat dissipation |
| 01/18/2007 | US20070015340 Method and structure for interfacing electronic devices |
| 01/18/2007 | US20070015314 Adhesive/Spacer Island Structure for Multiple Die Package |
| 01/18/2007 | US20070013060 Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation |
| 01/18/2007 | US20070013048 Electronic parts packaging structure and method of manufacturing the same |
| 01/18/2007 | US20070013044 Packaged integrated circuits and methods of producing thereof |
| 01/18/2007 | US20070011905 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/18/2007 | DE202006017047U1 Gehäuse für Chip mit einem Schutz gegen Überlauf des Versiegelungskunststoffes Housing for chip with protection against overflow of the sealing plastic |
| 01/18/2007 | DE202005014073U1 Chipträgerbaugruppe Chip carrier assembly |
| 01/18/2007 | DE102005031836A1 Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben The semiconductor power module of the same with SiC power diode and methods for preparing |
| 01/17/2007 | EP1744606A2 Printed circuit board and method for producing the printed circuit board |
| 01/17/2007 | EP1744603A1 Signalling or lighting device for a motor vehicle, associated with an electronics of a large întegration level |
| 01/17/2007 | EP1744376A2 Semiconductor device and manufacturing method thereof |
| 01/17/2007 | EP1744368A2 Photodetection system and module |
| 01/17/2007 | EP1744362A2 Semiconductor device and electronic apparatus |
| 01/17/2007 | EP1743369A2 Micropede stacked die component assembly |
| 01/17/2007 | EP1743358A2 Light emitting diode component |
| 01/17/2007 | CN2859809Y Pixel module consist of profiled LED luminous tubes |
| 01/17/2007 | CN2859808Y Digital circuit integrated module |
| 01/17/2007 | CN2859807Y Photoelectricity chip array form packaging constitution |
| 01/17/2007 | CN1898806A Semiconductor module |
| 01/17/2007 | CN1898805A Optical data communication module |
| 01/17/2007 | CN1898794A Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 01/17/2007 | CN1897311A Organic light-coupling device |
| 01/17/2007 | CN1897273A Three-primary color LED pixel module |
| 01/17/2007 | CN1897272A Photodetection system and module |
| 01/17/2007 | CN1897240A Multi-chip device and method for producing a multi-chip device |
| 01/17/2007 | CN1295766C Electronic sealer with three-dimensional stack and assembling method thereof |
| 01/16/2007 | US7164905 High frequency module |
| 01/16/2007 | US7164201 Semiconductor module with scalable construction |
| 01/16/2007 | US7164159 LED package |
| 01/16/2007 | US7164115 Photoelectric conversion apparatus, manufacturing method therefor, and X-ray imaging apparatus |
| 01/16/2007 | US7163893 Advanced barrier liner formation for vias |
| 01/16/2007 | US7163842 Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) |
| 01/16/2007 | US7163155 ASIC-embedded switchable antenna arrays |
| 01/16/2007 | US7163137 Method of manufacturing mounting boards |
| 01/16/2007 | CA2274071C Affinity based self-assembly systems and devices for photonic and electronic applications |
| 01/15/2007 | CA2551729A1 Photodetection system and module |
| 01/11/2007 | WO2007005003A1 Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb |
| 01/11/2007 | WO2007004660A1 Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package |
| 01/11/2007 | US20070009223 Micro-optics on optoelectronics |
| 01/11/2007 | US20070009093 Radiation imaging apparatus, radiation imaging system and radiation imaging method |
| 01/11/2007 | US20070007917 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 01/11/2007 | US20070007898 Integrated lamp with feedback and wireless control |
| 01/11/2007 | US20070007633 Lead frame, resin-encapsulated semiconductor device, and method of producing the same |
| 01/11/2007 | US20070007612 Method of providing an optoelectronic element with a non-protruding lens |
| 01/11/2007 | US20070007458 Conversion apparatus, radiation detection apparatus, and radiation detection system |
| 01/11/2007 | DE102006023123A1 Semiconductor module with components for high-frequency methods in plastic housing especially for vehicle radar and satellite navigation has multilayer alternating conductive rail structure on the surface |
| 01/11/2007 | DE102006009930A1 Lichtaussendeeinrichtung Light emitter |
| 01/11/2007 | DE102005051998B3 Semiconductor memory module has two rows of DRAM chips arranged to give leads of equal length that are as short as possible |
| 01/11/2007 | DE102005030247A1 Housing of power semiconductor module with outwards coupling members contains insulating substrate, whose main surface away from base plate, carries mutually insulated coupling tracks |
| 01/11/2007 | DE102005029784A1 Elektronikbaugruppe und Verfahren zur Herstellung einer Elektronikbaugruppe Electronic assembly and methods of manufacturing an electronics package |
| 01/10/2007 | EP1742294A2 A method and a device for manufacturing a roll of items |
| 01/10/2007 | EP1742265A2 Coolant cooled type semiconductor device |
| 01/10/2007 | EP1741325A1 Mounting plate for electronic components |
| 01/10/2007 | EP1741138A1 An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit |
| 01/10/2007 | EP1741134A2 Stacked module systems and methods |
| 01/10/2007 | EP1427962B1 Variable optics spot module |
| 01/10/2007 | EP1044472A4 Multi-chip module having interconnect dies |
| 01/10/2007 | CN2857223Y Solar cell template having luminous device |
| 01/10/2007 | CN2856708Y Semiconductor luminous bulbs |
| 01/10/2007 | CN1894806A Color-mixing lighting system |
| 01/10/2007 | CN1893122A Led Lighting light-source based on metal aluminium-base material |
| 01/10/2007 | CN1893063A Stack type package |
| 01/10/2007 | CN1893062A Method for fabricating self-assembling microstructures |
| 01/10/2007 | CN1893061A Package structure of power power-supply module |
| 01/10/2007 | CN1893053A Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure |
| 01/10/2007 | CN1893043A Radiating substrate and light source device |
| 01/10/2007 | CN1893012A Three dimensional ic device and alignment methods of ic device substrates |
| 01/09/2007 | US7161810 Stacked chip electronic package having laminate carrier and method of making same |
| 01/09/2007 | US7161796 Surface-mountable component and method for the production thereof |