| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/27/2007 | US20070222055 Method and System for Stacking Integrated Circuits |
| 09/27/2007 | US20070221931 Optoelectronic semiconductor device and light signal input/output device |
| 09/27/2007 | US20070221859 Radiation image information capturing apparatus and method of detecting temperature of amplifier thereof |
| 09/27/2007 | US20070221265 Rechargeable lithium/water, lithium/air batteries |
| 09/27/2007 | DE19754616B4 Drucksensor Pressure sensor |
| 09/27/2007 | DE10355586B4 Chip-on-Chip-Struktur und Verfahren zu deren Herstellung Chip-on-chip structure and method for their preparation |
| 09/27/2007 | DE10333315B4 Leistungshalbleitermodul The power semiconductor module |
| 09/27/2007 | DE10309302B4 Leistungshalbleitermodul mit Sensorbauteil Power semiconductor module with sensor component |
| 09/27/2007 | DE10233637B4 Systeme und Verfahren zum Bilden von Datenspeichervorrichtungen Systems and methods for forming data storage means |
| 09/27/2007 | DE10229692B4 Leiterplatte, Mehrchippackung und zugehöriges Herstellungsverfahren PCB, multi-chip package and manufacturing method thereof |
| 09/27/2007 | DE10223738B4 Verfahren zur Verbindung integrierter Schaltungen A method for bonding integrated circuits |
| 09/26/2007 | CN200953348Y Encapsulating structure for illuminating device |
| 09/26/2007 | CN101044618A Device and method for fabricating double-sided soi wafer scale package with through via connections |
| 09/26/2007 | CN101043029A High power LED compatible integrating packaging module |
| 09/26/2007 | CN101042501A Back light unit and light-emitting diode packaging structure |
| 09/26/2007 | CN101042498A LED backlight unit without printed circuit board and method of manufacturing the same |
| 09/25/2007 | US7274214 Efficient tile layout for a programmable logic device |
| 09/25/2007 | US7274100 Battery protection circuit with integrated passive components |
| 09/25/2007 | US7273987 Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 09/25/2007 | US7273802 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads |
| 09/25/2007 | US7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 09/20/2007 | WO2007106226A1 Solar cell using low iron high transmission glass and corresponding method |
| 09/20/2007 | WO2007106223A1 Low iron high transmission float glass for solar cell applications and method of making same |
| 09/20/2007 | WO2007105580A1 Base for power module |
| 09/20/2007 | WO2007105361A1 Electronic component module |
| 09/20/2007 | WO2007090664A3 Power electronics assembly |
| 09/20/2007 | WO2006122114A3 Rechargeable dye sensitized solar cell |
| 09/20/2007 | US20070216035 Flip-chip type semiconductor device |
| 09/20/2007 | US20070216025 Device having a contacting structure |
| 09/20/2007 | US20070215790 Photo-Electric Conversion Element Array, Integrated Apparatus Of The Same, Mounted Structures Of Them, And Optical Information Processing Apparatus |
| 09/20/2007 | US20070215435 Production System |
| 09/20/2007 | DE202004021348U1 Multichip-Hochleistungsdiode auf der Basis von AllnGaN Multichip high power diode based on AlInGaN |
| 09/20/2007 | DE102006031076A1 Optisches Projektionsgerät A projection optical apparatus |
| 09/20/2007 | DE102006012781A1 Multichip-Modul mit verbessertem Systemträger Multi-chip module with improved system support |
| 09/20/2007 | CA2641929A1 Low iron high transmission float glass for solar cell applications and method of making same |
| 09/20/2007 | CA2641466A1 Solar cell using low iron high transmission glass and corresponding method |
| 09/19/2007 | EP1835546A2 Solar panel and production method therefor |
| 09/19/2007 | EP1835538A1 Electronic component, electronic assembly and method for manufacturing an electronic assembly |
| 09/19/2007 | EP1835537A1 Light emission device and adjustment process for its chromaticity |
| 09/19/2007 | EP1835337A2 Solid state based illumination source for a projection display |
| 09/19/2007 | EP1834760A1 Glass product |
| 09/19/2007 | EP1834351A1 Method for producing an electronic circuit |
| 09/19/2007 | EP1676316A4 Dc-dc converter implemented in a land grid array package |
| 09/19/2007 | CN200950439Y Solar cell LED interlayer of photoelectric screen wall glass |
| 09/19/2007 | CN200950438Y Wiring box for solar cell assembly |
| 09/19/2007 | CN101040573A Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package |
| 09/19/2007 | CN101040386A Semiconductor device and its manufacturing method |
| 09/19/2007 | CN101038949A 发光二极管封装件 Light-emitting diode package |
| 09/19/2007 | CN101038910A Organic light emitting display (oled) |
| 09/19/2007 | CN101038909A Electronic subassembly, electronic assembly, and method for producing an electronic assembly |
| 09/19/2007 | CN101038908A Stack package utilizing through vias and re-distribution lines |
| 09/19/2007 | CN101038884A Photoelectric sensor and detector terminal module therefor |
| 09/19/2007 | CN100338788C Photoelectric semiconductor component |
| 09/19/2007 | CN100338787C Light-emitting diode light source unit |
| 09/19/2007 | CN100338772C Prossure fixing mechanism of series thyristor valve set |
| 09/19/2007 | CN100338771C Semiconductor device |
| 09/19/2007 | CN100338763C Semiconductor module and mfg. method thereof |
| 09/18/2007 | US7271617 Electronic circuit with array of programmable logic cells |
| 09/18/2007 | US7271481 Microelectronic component and assembly having leads with offset portions |
| 09/18/2007 | US7271477 Power semiconductor device package |
| 09/18/2007 | US7271421 Light-emitting diode array |
| 09/18/2007 | US7271031 Universal interconnect die |
| 09/18/2007 | US7271027 Castellation wafer level packaging of integrated circuit chips |
| 09/18/2007 | US7270912 Module battery |
| 09/18/2007 | US7270428 2D/3D data projector |
| 09/18/2007 | US7269897 Manufacturing process of a stacked semiconductor device |
| 09/13/2007 | WO2007102358A1 Electronic device package, module and electronic device |
| 09/13/2007 | WO2007102042A1 A multi-chip electronic package with reduced stress |
| 09/13/2007 | WO2007101364A1 Chip-level integrated radio frequency passive devices, methods of making same, and systems containing same |
| 09/13/2007 | WO2007060595A3 Light emitting diode construction |
| 09/13/2007 | US20070212815 Sealed three dimensional metal bonded integrated circuits |
| 09/13/2007 | US20070211434 Heat sink |
| 09/13/2007 | US20070210445 Power Semiconductor Module and Method for Cooling a Power Semiconductor Module |
| 09/13/2007 | US20070210435 Stacked microelectronic dies and methods for stacking microelectronic dies |
| 09/13/2007 | US20070210257 Radiation image pickup apparatus |
| 09/13/2007 | DE19947044B9 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same |
| 09/13/2007 | DE102007006346A1 Weiße Doppelemissions-PLED für Beleuchtung White double emission PLED lighting |
| 09/13/2007 | DE102006030598A1 Vorrichtung mit einem Modul und einer Kühlvorrichtung sowie Verfahren zur Verbindung einer Kühlvorrichtung und eines Moduls Apparatus having a module and a cooling device and method for connection of a cooling device and a module |
| 09/13/2007 | DE102006010511A1 Vertical semiconductor arrangement e.g. semiconductor chip stack, for printed circuit board substrate, has auxiliary layer that is bounded on area of relevant main side or includes structure provided with recess, channel, wall and trench |
| 09/12/2007 | CN101036155A Chip with a power supply device |
| 09/12/2007 | CN101035411A 存储器模块 Memory Modules |
| 09/12/2007 | CN101034728A Illumination device |
| 09/12/2007 | CN101034701A IC stack structure and its making method |
| 09/12/2007 | CN101034700A Electronic component integrated module and method for fabricating the same |
| 09/12/2007 | CN101034699A Multi-chip package |
| 09/12/2007 | CN100337330C Radio frequency semiconductor device and method of manufacturing the same |
| 09/12/2007 | CN100337327C Semiconductor device and method for making same |
| 09/11/2007 | US7269814 Parallel programmable antifuse field programmable gate array device (FPGA) and a method for programming and testing an antifuse FPGA |
| 09/11/2007 | US7268587 Programmable logic block with carry chains providing lookahead functions of different lengths |
| 09/11/2007 | US7268585 System for signal routing line aggregation in a field-programmable gate array |
| 09/11/2007 | US7268437 Semiconductor package with encapsulated passive component |
| 09/11/2007 | US7268435 Capacitive semiconductor sensor |
| 09/11/2007 | US7268426 High-frequency chip packages |
| 09/11/2007 | US7268425 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 09/11/2007 | US7268420 Semiconductor device having layered chips |
| 09/11/2007 | US7268418 Multi-chips stacked package |
| 09/11/2007 | US7268015 Method for wafer stacking using copper structures of substantially uniform height |
| 09/11/2007 | US7268010 Method of manufacturing an LED |
| 09/11/2007 | US7268002 Packaging method, packaging structure and package substrate for electronic parts |
| 09/11/2007 | US7267791 Method for the production of light-guiding LED bodies in two chronologically separate stages |