| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 05/08/2007 | US7215008 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 05/08/2007 | US7214615 Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus |
| 05/08/2007 | US7214605 Deposition of diffusion barrier |
| 05/08/2007 | US7214569 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 05/08/2007 | US7214557 Light receiving or light emitting modular sheet and process for producing the same |
| 05/03/2007 | WO2007050754A2 Stackable wafer or die packaging with enhanced thermal and device performance |
| 05/03/2007 | WO2007049458A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 05/03/2007 | WO2007049376A1 High-frequency module |
| 05/03/2007 | WO2007049375A1 Composite circuit module and high-frequency module device |
| 05/03/2007 | US20070101304 Fast/slow state machine latch |
| 05/03/2007 | US20070099437 Power module having at least two substrates |
| 05/03/2007 | US20070096332 Electronic component, module, module assembling method, module identification method and module environment setting method |
| 05/03/2007 | US20070096288 Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
| 05/03/2007 | US20070096160 High frequency chip packages with connecting elements |
| 05/03/2007 | US20070096081 High-heat-resistant semiconductor device |
| 05/03/2007 | US20070096035 Residual charge erasing method for solid state radiation detectors and radiation image recording/readout apparatus |
| 05/03/2007 | US20070096024 Image-capturing apparatus |
| 05/03/2007 | DE102005050224A1 Light cable has current conductor that functions entirely or in separated segments as LEDs and contains at least one luminescent segment |
| 05/03/2007 | DE102005002631B4 Mehrchippackung Multi-chip package |
| 05/02/2007 | EP1780791A2 Power circuit package and fabrication method |
| 05/02/2007 | EP1780790A2 Electronic part built-in substrate and manufacturing method therefor |
| 05/02/2007 | EP1779429A2 Multiple chip semiconductor device |
| 05/02/2007 | EP1609161B1 Stand-alone organic-based passive devices |
| 05/02/2007 | CN2896528Y High-power LED package structure |
| 05/02/2007 | CN2896524Y Package body |
| 05/02/2007 | CN1957470A A method of assembly and assembly thus made |
| 05/02/2007 | CN1957468A Bottom heat spreader |
| 05/02/2007 | CN1957465A Semiconductor device and wiring board |
| 05/02/2007 | CN1957464A Semiconductor device, wiring board and manufacturing method thereof |
| 05/02/2007 | CN1957463A Double density method for wirebond interconnect |
| 05/02/2007 | CN1957462A Vertically stacked semiconductor device |
| 05/02/2007 | CN1956231A Bias polarization luminous element |
| 05/02/2007 | CN1956193A Buried chip package structure |
| 05/02/2007 | CN1956192A Power circuit package and fabrication method |
| 05/02/2007 | CN1956191A LED illumination device |
| 05/02/2007 | CN1956190A Stacked semiconductor module |
| 05/02/2007 | CN1956189A Stacked semiconductor device and lower module of stacked semiconductor device |
| 05/02/2007 | CN1956183A Electronic part built-in substrate and manufacturing method thereof |
| 05/02/2007 | CN1314119C Semiconductor device and its producing method, curcuit board and electronic instrument |
| 05/02/2007 | CN1314118C 多芯片组件 Multi-chip module |
| 05/02/2007 | CN1314117C Structure and method of integrated circuit package |
| 05/02/2007 | CN1314114C Electronic device carrier adapted for transmitting high frequency signals |
| 05/01/2007 | US7212604 Multi-layer direct conversion computed tomography detector module |
| 05/01/2007 | US7212422 Stacked layered type semiconductor memory device |
| 05/01/2007 | US7212344 Illumination system with aligned LEDs |
| 05/01/2007 | US7211900 Thin semiconductor package including stacked dies |
| 05/01/2007 | US7211892 Semiconductor device having a particular electrode structure |
| 05/01/2007 | US7211886 Three-dimensional multichip stack electronic package structure |
| 05/01/2007 | US7211885 Vertical electrical interconnections in a stack |
| 05/01/2007 | US7211883 Semiconductor chip package |
| 05/01/2007 | US7211472 Method for producing a multichip module and multichip module |
| 05/01/2007 | US7211469 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 05/01/2007 | US7211466 Stacked die semiconductor device |
| 05/01/2007 | US7210818 Flexible LED lighting strip |
| 05/01/2007 | CA2403231C Vertical electrical interconnections in a stack |
| 04/26/2007 | WO2007045786A1 Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof |
| 04/26/2007 | US20070091608 Light Transmitting Modules With Optical Power Monitoring |
| 04/26/2007 | US20070090299 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/26/2007 | DE102005050947A1 Leuchtelement mit wenigstens einem Leucht-Chip-Kristall Light-emitting element having at least one light emitting chip crystal |
| 04/26/2007 | DE102005050534A1 Leistungshalbleitermodul The power semiconductor module |
| 04/26/2007 | DE102005050254A1 Multi-arrangement flexible lighting device, has light units each formed as island of unit surface area sufficient for holding electrical connections and cooling devices |
| 04/26/2007 | DE102005049978A1 Circuit arrangement for buck-converter, has half-bridges accommodated in semiconductor housing |
| 04/26/2007 | CA2563480A1 Power circuit package and fabrication method |
| 04/25/2007 | EP1777775A1 Transmission line substrate and semiconductor package |
| 04/25/2007 | EP1777742A2 Semiconductor chip with through via and method of manufacturing the semiconductor chip |
| 04/25/2007 | EP1776722A2 High performance led lamp system |
| 04/25/2007 | EP1776721A2 Led lamp system |
| 04/25/2007 | EP1776718A2 Led light system |
| 04/25/2007 | CN1954427A Power semiconductor assembly |
| 04/25/2007 | CN1954275A 生产系统 Production System |
| 04/25/2007 | CN1953639A A wiring structure and method to reduce the far-end cross talk between parallel signal circuits |
| 04/25/2007 | CN1953222A Light-emitting element with at least one light-emitting crystal |
| 04/25/2007 | CN1953221A Photoelectric sensor, optical module and method of producing same |
| 04/25/2007 | CN1953218A Manufacture method for diode light-emitting device and its structure |
| 04/25/2007 | CN1953192A Image sensor module package structure |
| 04/25/2007 | CN1953177A Light-emitting diode device |
| 04/25/2007 | CN1953176A Direct encapsulation technique of mental base of light-emitting diode |
| 04/25/2007 | CN1953175A Complex RF device and method for manufacturing the same |
| 04/25/2007 | CN1953174A Module with embedded electronic components |
| 04/25/2007 | CN1953164A Encapsulation method and structure of light emitting diode |
| 04/25/2007 | CN1312752C Semiconductor integrated circuit device and its mfg. method |
| 04/24/2007 | US7209987 Embedded system design through simplified add-on card configuration |
| 04/24/2007 | US7209376 Stacked semiconductor memory device |
| 04/24/2007 | US7208838 Semiconductor device, circuit board, and electronic instrument suitable for stacking and having a through hole |
| 04/24/2007 | US7208834 Bonding structure with pillar and cap |
| 04/24/2007 | US7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
| 04/24/2007 | US7208832 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 04/24/2007 | US7208829 Semiconductor component |
| 04/24/2007 | US7208826 Semiconductor device and method of manufacturing the same |
| 04/24/2007 | US7208825 Stacked semiconductor packages |
| 04/24/2007 | US7208816 Electronic circuit device and manufacturing method thereof |
| 04/24/2007 | US7208779 Semiconductor device |
| 04/24/2007 | US7208769 LED arrangement |
| 04/24/2007 | US7208758 Dynamic integrated circuit clusters, modules including same and methods of fabricating |
| 04/24/2007 | US7208674 Solar cell having photovoltaic cells inclined at acute angle to each other |
| 04/24/2007 | US7208347 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 04/24/2007 | US7208343 Semiconductor chip, chip stack package and manufacturing method |
| 04/24/2007 | US7208336 White light emitting device and method of making same |
| 04/24/2007 | US7208335 Castellated chip-scale packages and methods for fabricating the same |
| 04/24/2007 | US7207691 Light emitting device |