| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/22/2007 | US20070040184 Semiconductor device and capacitance regulation circuit |
| 02/22/2007 | US20070040180 Integrated circuit device |
| 02/22/2007 | US20070040126 Three dimensional radiation detector |
| 02/22/2007 | US20070039610 Positioning system for portable solar panels |
| 02/22/2007 | DE10231385B4 Halbleiterchip mit Bondkontaktstellen und zugehörige Mehrchippackung Semiconductor chip bond pads and associated multi-chip package |
| 02/22/2007 | DE102006035114A1 Semiconductor package, useful for surface mounting, comprises substrate, semiconductor chips and transparent resin layer |
| 02/22/2007 | DE102006034425A1 Power light diode module has light diode on carrier plate having a hole through which a cooling body is inserted to contact the rear face of the diode and cool it |
| 02/22/2007 | DE102005039478A1 Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack and processes for preparing |
| 02/22/2007 | DE102005039278A1 Leistungshalbleitermodul mit Leitungselement Power semiconductor module with duct element |
| 02/22/2007 | DE102005038752A1 Method for mounting semiconductor chips on substrate, |
| 02/22/2007 | DE102005038645A1 Support plate for LEDs comprises a central horizontal circular surface for positioning LEDs |
| 02/22/2007 | DE102005038443A1 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a substrate and having a housing and method for producing a sensor arrangement |
| 02/21/2007 | EP1755163A1 Power semiconductor module with wiring element |
| 02/21/2007 | EP1755162A2 Power semiconductor packaging method and structure |
| 02/21/2007 | EP1754259A2 Direct cooling of leds |
| 02/21/2007 | CN1918714A Optical communication module |
| 02/21/2007 | CN1917731A Calibrated led light module |
| 02/21/2007 | CN1917239A LED light source compatible to night vision |
| 02/21/2007 | CN1917204A Optical module with flexible substrate |
| 02/21/2007 | CN1917203A Power semiconductor module with wiring element |
| 02/21/2007 | CN1917149A Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 02/21/2007 | CN1917142A Semiconductor device manufacturing apparatus |
| 02/21/2007 | CN1916484A LED illuminator having high power and high radiation efficiency |
| 02/21/2007 | CN1916483A High power, high efficiency systematic packed LED lamp |
| 02/20/2007 | US7180749 Circuit board and its manufacturing method |
| 02/20/2007 | US7180183 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 02/20/2007 | US7180182 Semiconductor component |
| 02/20/2007 | US7180180 Stacked device underfill and a method of fabrication |
| 02/20/2007 | US7180177 Power supply component assembly on a printed circuit and method for obtaining same |
| 02/20/2007 | US7180169 Circuit component built-in module and method for manufacturing the same |
| 02/20/2007 | US7180168 Stacked semiconductor chips |
| 02/20/2007 | US7180167 Low profile stacking system and method |
| 02/20/2007 | US7180166 Stacked multi-chip package |
| 02/20/2007 | US7180165 Stackable electronic assembly |
| 02/20/2007 | US7180149 Semiconductor package with through-hole |
| 02/20/2007 | US7180066 Infrared detector composed of group III-V nitrides |
| 02/20/2007 | US7179695 Method of forming wiring |
| 02/20/2007 | US7179687 Semiconductor device and its manufacturing method, and semiconductor device manufacturing system |
| 02/20/2007 | US7179686 Manufacturing method of semiconductor device |
| 02/20/2007 | US7179685 Fabrication method for stacked multi-chip package |
| 02/20/2007 | US7179681 Techniques for packaging multiple device components |
| 02/20/2007 | US7178959 Illumination arrangement with reduced depth for a vehicle headlight |
| 02/15/2007 | WO2007019183A2 Electric tile modules |
| 02/15/2007 | WO2007017833A1 Light emitting diode comprising multiple dies and optical system with number of lens elements |
| 02/15/2007 | WO2006108993A3 Bluetooth ® wireless dental radiology device and system |
| 02/15/2007 | WO2006108992A3 Stand-alone wireless dental radiology device and system |
| 02/15/2007 | WO2006089450A3 Light source |
| 02/15/2007 | US20070036944 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly |
| 02/15/2007 | US20070035018 Mount for a programmable electronic processing device |
| 02/15/2007 | US20070035013 Module with built-in circuit elements |
| 02/15/2007 | US20070035004 Semiconductor module |
| 02/15/2007 | US20070034946 Semiconductor device |
| 02/15/2007 | US20070034807 Detector module, detector and computed tomography unit |
| 02/15/2007 | US20070034806 Solid-state detector and method for resetting residue charges by illumination in the case of a solid-state detector |
| 02/15/2007 | US20070034798 IR camera |
| 02/15/2007 | DE102006020853A1 Anzeige und Tape-carrier-package-Aufbau Display and tape carrier package structure |
| 02/15/2007 | DE102005037522A1 Leistungshalbleitermodul mit wannenförmigem Grundkörper Power semiconductor module with tub-body |
| 02/15/2007 | DE102005036116A1 Power semi-conductor module comprises has both first semi-conductor chip, with semi-conductor element, and second semi-conductor chip, with control electronics, soldered on structured metalization |
| 02/15/2007 | DE10146936B4 Herstellverfahren für eine Chipkomponenten-Baugruppe Manufacturing method of a chip component assembly |
| 02/14/2007 | EP1753035A1 Light-emitting device and method for manufacturing same |
| 02/14/2007 | EP1753028A2 Receiver chips receiving different types of digital signals bonded on a monolithic integrated circuit semiconductor substrate |
| 02/14/2007 | EP1753025A2 Power semiconductor module with a bowl-shaped support base |
| 02/14/2007 | EP1751795A1 Method for construction of rigid photovoltaic modules |
| 02/14/2007 | EP1434268B1 Electronic substrate, power module and motor driver |
| 02/14/2007 | EP1266412B1 Method and device for transferring spin-polarized charge carriers |
| 02/14/2007 | EP1008186B1 Power transistor cell |
| 02/14/2007 | CN1914740A Light-receiving module |
| 02/14/2007 | CN1914730A Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 02/14/2007 | CN1914729A 半导体器件 Semiconductor devices |
| 02/14/2007 | CN1914728A 半导体器件 Semiconductor devices |
| 02/14/2007 | CN1914727A Electronic component and method for manufacturing the same |
| 02/14/2007 | CN1913317A Brushless excitation steam turbine rotation rectifier |
| 02/14/2007 | CN1913154A Image sensing module and its package method |
| 02/14/2007 | CN1913153A Image sensing module and its package method |
| 02/14/2007 | CN1913152A Multi-chip structure |
| 02/14/2007 | CN1913151A Light-emitting diode module for flash and auto-focus application |
| 02/14/2007 | CN1913150A Method for fabricating electronic circuit module and integrated circuit device |
| 02/14/2007 | CN1913149A Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
| 02/14/2007 | CN1913145A Driving film, driving package, manufacturing method thereof and display comprising the same |
| 02/14/2007 | CN1913117A Method for improving electron circuit layout efficiency, electronic connector and electronic panel |
| 02/14/2007 | CN1300939C High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 02/14/2007 | CN1300840C Chip and wafer integration process using vertical connections |
| 02/14/2007 | CN1300832C Producing method for electronic device and chip carrier |
| 02/13/2007 | US7177548 Optical module |
| 02/13/2007 | US7177171 Semiconductor device |
| 02/13/2007 | US7177128 Snubber module and power conversion device |
| 02/13/2007 | US7176612 LED device and portable telephone, digital camera and LCD apparatus using the same |
| 02/13/2007 | US7176579 Semiconductor module |
| 02/13/2007 | US7176561 Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment |
| 02/13/2007 | US7176560 Semiconductor device having a chip—chip structure |
| 02/13/2007 | US7176559 Integrated circuit package with a balanced-part structure |
| 02/13/2007 | US7176558 Single chip and stack-type chip semiconductor package and method of manufacturing the same |
| 02/13/2007 | US7176556 Semiconductor system-in-package |
| 02/13/2007 | US7176545 Apparatus and methods for maskless pattern generation |
| 02/13/2007 | US7176506 High frequency chip packages with connecting elements |
| 02/13/2007 | US7176502 Light emitting diodes packaged for high temperature operation |
| 02/13/2007 | US7176487 Semiconductor integrated circuit |
| 02/13/2007 | US7176473 Shielding leadframe for semiconductors for optical coupling and electronic apparatus including same |
| 02/13/2007 | US7176461 Acoustic absorption radiation sensing in SiC |
| 02/13/2007 | US7176131 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same |