| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/23/2007 | CN1967827A Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
| 05/23/2007 | CN1967214A Optical sensor, ink cartridge, and inkjet apparatus |
| 05/23/2007 | CN1317812C Matrix converter for converting electric energy |
| 05/23/2007 | CN1317776C Light-emitting diode lamp |
| 05/22/2007 | US7221214 Delay value adjusting method and semiconductor integrated circuit |
| 05/22/2007 | US7221187 Programmable microcontroller architecture (mixed analog/digital) |
| 05/22/2007 | US7221057 Stacked IC device having functions for selecting and counting IC chips |
| 05/22/2007 | US7221049 Circuit device and manufacturing method thereof |
| 05/22/2007 | US7220997 Light receiving or light emitting device and itsd production method |
| 05/22/2007 | US7220921 Sheet-like board member and method of manufacturing a semiconductor device |
| 05/22/2007 | US7220667 Semiconductor device and method of fabricating the same |
| 05/22/2007 | US7220608 Transferring semiconductor crystal from a substrate to a resin |
| 05/22/2007 | US7220020 Light source device |
| 05/18/2007 | WO2007054894A2 Chip assembly and method of manufacturing thereof |
| 05/18/2007 | WO2007025127A3 Microelectronic device packages, stacked microlecetronic device packages, and methods for manufacturing microelectronic devices |
| 05/18/2007 | WO2006073825A3 Led light sources for image projection sytems |
| 05/18/2007 | WO2006012127A3 Microelectronic packages and methods therefor |
| 05/17/2007 | US20070113305 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof |
| 05/17/2007 | US20070113215 System and method for implementing package level IP preverification for system on chip devices |
| 05/17/2007 | US20070113214 Integrated structure layout and layout of interconnections for an instruction execution unit of an integrated circuit chip |
| 05/17/2007 | US20070113213 Flip flop function device, semiconductor integrated-circuit, and method and apparatus for designing semiconductor integrated circuit |
| 05/17/2007 | US20070111567 Method and device for connecting chips |
| 05/17/2007 | US20070111386 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
| 05/17/2007 | US20070111384 Method of manufacturing a semiconductor device |
| 05/17/2007 | US20070111374 Reversible leadless package and methods of making and using same |
| 05/17/2007 | US20070111347 Surface emitting device, manufacturing method thereof and projection display device using the same |
| 05/17/2007 | US20070109898 Semiconductor device |
| 05/17/2007 | US20070109792 Liner light source, method for manufacturing the same and surface emitting device |
| 05/17/2007 | US20070109018 Intersection Ontologies for Organizing Data |
| 05/17/2007 | US20070108634 Packaged electronic element and method of producing electronic element package |
| 05/17/2007 | US20070108632 Semiconductor chip having bond pads |
| 05/17/2007 | US20070108600 Semiconductor device |
| 05/17/2007 | US20070108598 Low Voltage Drop and High Thermal Performance Ball Grid Array Package |
| 05/17/2007 | US20070108580 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same |
| 05/16/2007 | EP1786035A2 Circuit arrangement, especially frequency converter |
| 05/16/2007 | EP1785746A2 Wafer level manufacturing of optical elements |
| 05/16/2007 | EP1784864A2 Electric sub-assembly |
| 05/16/2007 | EP1784863A1 Power semiconductor module |
| 05/16/2007 | EP1561246B1 Method for manufacturing a light emitting device |
| 05/16/2007 | CN2901586Y Package structure of light emitting module |
| 05/16/2007 | CN2901581Y Double crystal mixed color LED |
| 05/16/2007 | CN2901580Y Single row direct insert full wave rectifier bridge stack |
| 05/16/2007 | CN1964084A Packaging structure of LED |
| 05/16/2007 | CN1964077A Capacitor and manufacturing method thereof, semiconductor device containing the capacitor |
| 05/16/2007 | CN1964042A A luminescent device and its manufacture method |
| 05/16/2007 | CN1964041A A multiple-chip structure and multiple-chip electronic device with multiple-chip structure |
| 05/16/2007 | CN1964040A 传感器块 Sensor block |
| 05/16/2007 | CN1964039A 功率半导体模块 Power semiconductor module |
| 05/16/2007 | CN1964038A A three-dimensional wafer stacking structure with post-and-beam construction and method to stack three-dimensional wafer |
| 05/16/2007 | CN1964037A A stacking type semiconductor chip package |
| 05/16/2007 | CN1964036A A stacking type wafer packaging structure |
| 05/16/2007 | CN1316578C Semiconductor device and its producing method, curcuit board and electronic instrument |
| 05/16/2007 | CN1316329C Scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 05/15/2007 | USRE39628 Stackable flex circuit IC package and method of making same |
| 05/15/2007 | US7218143 Integrated circuit having fast interconnect paths between memory elements and carry logic |
| 05/15/2007 | US7218142 Switch matrix circuit, logical operation circuit, and switch circuit |
| 05/15/2007 | US7218141 Techniques for implementing hardwired decoders in differential input circuits |
| 05/15/2007 | US7218006 Multi-chip stack package |
| 05/15/2007 | US7218005 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 05/15/2007 | US7217993 Stacked-type semiconductor device |
| 05/15/2007 | US7217956 Light active sheet material |
| 05/15/2007 | US7217890 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 05/15/2007 | US7217888 Electronic parts packaging structure and method of manufacturing the same |
| 05/15/2007 | US7217646 Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement |
| 05/15/2007 | US7217631 Semiconductor device and method for fabricating the device |
| 05/15/2007 | US7217596 Stacked die module and techniques for forming a stacked die module |
| 05/15/2007 | US7217595 Sealed three dimensional metal bonded integrated circuits |
| 05/10/2007 | WO2007052777A1 Light-emitting module, and display unit and lighting unit using the same |
| 05/10/2007 | WO2007052476A1 Electronic circuit device and method for manufacturing same |
| 05/10/2007 | WO2006118994A3 Multi-chip module and method of manufacture |
| 05/10/2007 | US20070106965 Semiconductor integrated circuit device, method of testing the same, database for design of the same and method of designing the same |
| 05/10/2007 | US20070106964 Optimized microchip and related methods |
| 05/10/2007 | US20070103228 Stackable programmable passive device and a testing method |
| 05/10/2007 | US20070102826 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same |
| 05/10/2007 | US20070102807 Coupling substrate for semiconductor components and method for producing the same |
| 05/10/2007 | US20070102803 Method for making stacked integrated circuits (ICs) using prepackaged parts |
| 05/10/2007 | US20070102802 Single chip and stack-type chip semiconductor package and method of manufacturing the same |
| 05/10/2007 | US20070102712 Optical Semiconductor Device and method for Manufacturing the Same |
| 05/10/2007 | US20070102693 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 05/10/2007 | US20070102643 Efficient approach for reducing image transfer time in wireless portable x-ray detectors |
| 05/10/2007 | DE102006050376A1 Leuchtdiodeneinheit Light-emitting unit |
| 05/10/2007 | DE102006003377B3 Semiconductor chip and electronic component has chip(s) integrated into chip housing with four sets of conductive leads connected both to external contacts and to upper and lower housing surfaces |
| 05/10/2007 | CA2617881A1 Method for preparing an electric circuit comprising multiple leds |
| 05/09/2007 | CN2899114Y Laminated chip packing structure |
| 05/09/2007 | CN1961431A Surface mount light emitting chip packaging piece |
| 05/09/2007 | CN1961426A Semiconductor module comprising a coupling substrate and production method thereof |
| 05/09/2007 | CN1961422A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/09/2007 | CN1961421A Integrated circuit stacking system and method |
| 05/09/2007 | CN1960016A Light emitting diode |
| 05/09/2007 | CN1960010A Capsulation structure of white LED |
| 05/09/2007 | CN1959983A Semiconductor element and process of manufacturing the same |
| 05/09/2007 | CN1959982A Semiconductor light emitting device |
| 05/09/2007 | CN1959981A Capsulation structure of luminous secondary body |
| 05/09/2007 | CN1959182A Luminescence diode lighting module and lighting device |
| 05/08/2007 | US7215085 Plasma display device |
| 05/08/2007 | US7215033 Wafer level stack structure for system-in-package and method thereof |
| 05/08/2007 | US7215023 Power module |
| 05/08/2007 | US7215022 Multi-die module |
| 05/08/2007 | US7215018 Stacked die BGA or LGA component assembly |
| 05/08/2007 | US7215016 Multi-chips stacked package |