| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/07/2007 | WO2007098895A1 Apparatus for suppling power to buildings using solar power as a power source |
| 09/07/2007 | WO2006131843A3 Method of removing the growth substrate of a semiconductor light-emitting device |
| 09/07/2007 | WO2006093755A3 Methods and systems for detecting presence of materials |
| 09/07/2007 | WO2006022624A3 Rectifying charge storage memory circuit |
| 09/06/2007 | US20070206358 Semiconductor Device |
| 09/06/2007 | US20070205505 Semiconductor device having capacitors for reducing power source noise |
| 09/06/2007 | US20070205500 Power Semiconductor Module |
| 09/06/2007 | US20070205496 Microelectronic packages and methods therefor |
| 09/06/2007 | US20070205495 Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means |
| 09/06/2007 | DE102006034964B3 Arrangement has power semiconductor element in power semiconductor module or disc cell, where shaped body is arranged with one cut above element, where contact device is for auxiliary or control connection contact of element |
| 09/06/2007 | DE102006008807A1 Power semiconductor module and cooling assembly combination for insulated gate bipolar transistor inverter application, has module with frame-like housing, which stays away from outer edge section of main surface of substrate |
| 09/06/2007 | DE102006005420A1 Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben A stackable semiconductor device and method of manufacturing the same |
| 09/06/2007 | DE102004055815B4 Montageplatte für elektronische Bauteile Mounting plate for electronic components |
| 09/05/2007 | EP1830406A1 Power module, method for producing same and air conditioner |
| 09/05/2007 | EP1830404A2 Power semiconductor module and its method of manufacturing |
| 09/05/2007 | EP1829107A1 Arrangement of a semiconductor module and an electrical busbar |
| 09/05/2007 | EP1665393A4 Pv wind performance enhancing methods and apparatus |
| 09/05/2007 | EP1421628B1 Irfpa roic with dual tdm reset integrators and sub-frame averaging functions per unit cell |
| 09/05/2007 | CN200944403Y Infrared remote control receiving amplifier of outer shielding structure |
| 09/05/2007 | CN101032025A Cpu power delivery system |
| 09/05/2007 | CN101032022A Cu-Mo substrate and method for producing same |
| 09/05/2007 | CN101031862A Three dimensional packaging and voltage regulator/converter module of cpu |
| 09/05/2007 | CN101030577A Electronic substrate, semiconductor device, and electronic device |
| 09/05/2007 | CN101030576A Electronic substrate, semiconductor device, and electronic device |
| 09/05/2007 | CN101030572A Method for packing and producing light-emitting diodes |
| 09/05/2007 | CN101030571A Commutating diode device and its production |
| 09/05/2007 | CN101030570A 半导体装置 Semiconductor device |
| 09/05/2007 | CN101030569A Packing component for decreasing electromagnetic-wave disturbance |
| 09/05/2007 | CN100336425C Hybrid integrated circuit device |
| 09/05/2007 | CN100336232C Solar cell module and edge face sealing member for same |
| 09/05/2007 | CN100336221C Modularized device of stackable semiconductor package and preparing method |
| 09/05/2007 | CN100336217C Lead wire, resin closed semiconductor device and its mfg. method |
| 09/05/2007 | CN100336209C Hybrid integrated circuit device and manufacturing method of the same |
| 09/05/2007 | CN100336190C Method for producing semiconductor and semiconductor device |
| 09/04/2007 | US7266262 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
| 09/04/2007 | US7265580 Semiconductor-integrated circuit utilizing magnetoresistive effect elements |
| 09/04/2007 | US7265395 Semiconductor device |
| 09/04/2007 | US7265389 Light emitting diode and fabricating method thereof |
| 08/30/2007 | WO2007097664A1 Light-emitting diode device |
| 08/30/2007 | WO2007096975A1 Semiconductor device |
| 08/30/2007 | WO2007078994A3 Configurable inputs and outputs for memory stacking system and method |
| 08/30/2007 | US20070200512 Semiconductor Chip For Driving Light Emitting Element, Light Emitting Device And Lighting Equipment |
| 08/30/2007 | US20070200217 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 08/30/2007 | US20070200216 Chip stack package |
| 08/30/2007 | DE102007006447A1 Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls An electronic module and method for manufacturing the electronic module |
| 08/30/2007 | DE102007006191A1 Speichermodulvorrichtung Memory module device |
| 08/30/2007 | DE102007002967A1 Halbleiterleuchteinrichtung und ihr Herstellungsverfahren Semiconductor light-emitting device and its manufacturing method |
| 08/30/2007 | DE102006008632A1 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation |
| 08/30/2007 | DE102006007303A1 Printed circuit board, has grouting cover element, in which multiple chips connected electrically with printed circuit board, are embedded |
| 08/30/2007 | DE102005060081B4 Elektronisches Bauteil mit zumindest einer Leiterplatte und mit einer Mehrzahl gleichartiger Halbleiterbausteine und Verfahren Electronic component with at least one circuit board and having a plurality of similar semiconductor devices and methods |
| 08/29/2007 | EP1826834A2 Light emitting device package and method of manufacturing the same |
| 08/29/2007 | EP1825511A1 Semiconductor switching module |
| 08/29/2007 | EP1751795A4 Method for construction of rigid photovoltaic modules |
| 08/29/2007 | EP1636845A4 Wet chemical processing chambers for processing microfeature workpieces |
| 08/29/2007 | CN200941384Y Improved structure of light receiving diode |
| 08/29/2007 | CN200941383Y LED digital tube reflecting chamber |
| 08/29/2007 | CN101027948A Electronics module and method for manufacturing the same |
| 08/29/2007 | CN101027794A Illumination system |
| 08/29/2007 | CN101027775A Manufacture of a layer including a component |
| 08/29/2007 | CN101026216A Lighting device |
| 08/29/2007 | CN101026152A Light-emitting device |
| 08/29/2007 | CN101026151A Chip package body with built in capacitor structure |
| 08/29/2007 | CN101026150A Method for packaging organic light emitting display with frit seal and reinforcing structure |
| 08/29/2007 | CN101026149A Image sensor package structure |
| 08/29/2007 | CN101026148A Multi-chip build up package structure for optronic chip and its manufacturing method |
| 08/29/2007 | CN101026147A Semiconductor device with battery |
| 08/29/2007 | CN101026146A Power semiconductor module and its manufacturing method |
| 08/29/2007 | CN101026145A Semiconductor packages including transformer or antenna |
| 08/29/2007 | CN101026144A Radiating type stereo package structure and its manufacturing method |
| 08/29/2007 | CN101026104A Display device and method for manufacturing the same |
| 08/29/2007 | CN101026103A Package on package with cavity and method for manufacturing thereof |
| 08/29/2007 | CN101026102A Stacked chip package using warp-proof insulative material and method of manufacturing the same |
| 08/29/2007 | CN100334727C Resin moulded devices and manufacturing installation therefor |
| 08/29/2007 | CN100334726C Window opening type multi-chip semiconductor package |
| 08/29/2007 | CN100334724C 半导体集成电路器件 The semiconductor integrated circuit device |
| 08/29/2007 | CN100334723C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/29/2007 | CN100334721C Flip chip type semiconductor package |
| 08/28/2007 | US7263294 Infrared data communication module and method of making the same |
| 08/28/2007 | US7262508 Integrated circuit incorporating flip chip and wire bonding |
| 08/28/2007 | US7262507 Semiconductor-mounted device and method for producing same |
| 08/28/2007 | US7262506 Stacked mass storage flash memory package |
| 08/28/2007 | US7262490 Semiconductor chip with external connecting terminal |
| 08/28/2007 | US7262480 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 08/28/2007 | US7262455 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system |
| 08/28/2007 | US7262437 Radiation source and method for producing a lens mould |
| 08/28/2007 | US7262081 Fan out type wafer level package structure and method of the same |
| 08/28/2007 | US7262080 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 08/28/2007 | US7260890 Methods for fabricating three-dimensional all organic interconnect structures |
| 08/23/2007 | WO2007094928A1 Rare earth doped layer or substrate for light conversion |
| 08/23/2007 | WO2007094508A1 Semiconductor module and drive device for hybrid vehicle having the same |
| 08/23/2007 | WO2007075727A3 Microelectronic packages and methods therefor |
| 08/23/2007 | US20070198962 Semiconductor integrated circuit and method of designing layout of the same |
| 08/23/2007 | US20070194841 Semiconductor integrated circuit device |
| 08/23/2007 | US20070194433 Electronic circuit, a semiconductor device and a mounting substrate |
| 08/23/2007 | US20070194339 Optical data communication module |
| 08/23/2007 | US20070194332 Light active sheet material |
| 08/23/2007 | US20070194237 Thermo-optic system employing self reference |
| 08/23/2007 | US20070193763 Leadframe-based module dc bus design to reduce module inductance |
| 08/23/2007 | US20070193622 Laminate Type Thin-Film Solar Cell And Method For Manufacturing The Same |
| 08/23/2007 | DE112005002326T5 CPU-Stromversorgungssystem CPU power supply system |