| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 07/25/2007 | CN101005063A Semiconductor chip package attached electronic device and integrated circuit module having the same |
| 07/25/2007 | CN101005062A Vertically packaged MOSFET and ic power devices as integrated module using 3D interconnected laminates |
| 07/25/2007 | CN101004455A Optical sensor |
| 07/25/2007 | CN101004246A Daylight lamp of LED in high luminous quantity |
| 07/24/2007 | US7248756 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry |
| 07/24/2007 | US7248482 Module with built-in circuit component and method for producing the same |
| 07/24/2007 | US7248478 Coolant cooled type semiconductor device |
| 07/24/2007 | US7248073 Configurable logic element with expander structures |
| 07/24/2007 | US7247950 Semiconductor device and method of manufacturing the same |
| 07/24/2007 | US7247949 Semiconductor device with stacked chips |
| 07/24/2007 | US7247948 Semiconductor device and method for fabricating the semiconductor device |
| 07/24/2007 | US7247942 Techniques for joining an opto-electronic module to a semiconductor package |
| 07/24/2007 | US7247935 Semiconductor device |
| 07/24/2007 | US7247933 Thin multiple semiconductor die package |
| 07/24/2007 | US7247932 Chip package with capacitor |
| 07/24/2007 | US7247929 Molded semiconductor device with heat conducting members |
| 07/24/2007 | US7247858 Method for creating a contiguous image using multiple X-ray imagers |
| 07/24/2007 | US7247851 Imaging device and an imaging method |
| 07/24/2007 | US7247519 Method for making a semiconductor multi-package module having inverted bump chip carrier second package |
| 07/24/2007 | US7247518 Semiconductor device and method for manufacturing same |
| 07/24/2007 | US7246431 Methods of making microelectronic packages including folded substrates |
| 07/19/2007 | WO2007079997A1 Electronic module, and method for producing one |
| 07/19/2007 | US20070166993 Method for fabricating circuit component |
| 07/19/2007 | US20070166886 Method for manufacturing an electronic module |
| 07/19/2007 | US20070166879 Multi-chip stack package and fabricating method thereof |
| 07/19/2007 | US20070166876 Components, methods and assemblies for multi-chip packages |
| 07/19/2007 | US20070166853 LED Arrangement |
| 07/19/2007 | US20070166050 Optical communication module |
| 07/19/2007 | US20070165979 Optical input substrate, optical output substrate, optical input/output substrate, a fabrication method for these substrates, and an optical element integrated semiconductor integrated circuit |
| 07/19/2007 | US20070165414 Light-emitting diode package structure |
| 07/19/2007 | US20070165383 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof |
| 07/19/2007 | US20070165364 Optimization of the number of power outputs for an integrated circuit |
| 07/19/2007 | US20070164297 Optical-element integrated semiconductor integrated circuit and fabrication method thereof |
| 07/19/2007 | US20070164199 Camera module for compact electronic equipments |
| 07/19/2007 | DE102006002381B3 Power semiconductor component for e.g. alternating current-direct current converter, has chips arranged adjacent to each other and attached on flat conductor by diffusion solder connection, where another chip is attached on chips |
| 07/19/2007 | DE102004022884B4 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing |
| 07/18/2007 | EP1808954A2 IGBT-module |
| 07/18/2007 | EP1808904A1 Light emitting device |
| 07/18/2007 | EP1808900A2 Multiple phase motor driver with bidirectional blocking accumulation-mode trench power mosfets |
| 07/18/2007 | CN1327521C Planar hybrid diode rectifier bridge |
| 07/18/2007 | CN1327519C Device package, a printed wiring board, and an electronic apparatus |
| 07/18/2007 | CN1327517C Semiconductor device and method of manufacturing the same |
| 07/18/2007 | CN1327492C Gas for plasma reaction, process for producing the same, and use |
| 07/18/2007 | CN101002321A Methods and systems for attaching die in stacked-die packages |
| 07/18/2007 | CN101001321A 数码相机模组 Digital Camera Module |
| 07/18/2007 | CN101000939A LED module |
| 07/18/2007 | CN101000907A Semiconductor device, manufacturing method of semiconductor device, and rfid tag |
| 07/18/2007 | CN101000130A High power LED combined cup lamp |
| 07/17/2007 | US7245884 RF module |
| 07/17/2007 | US7245493 Cooler for cooling electric part |
| 07/17/2007 | US7245021 Micropede stacked die component assembly |
| 07/17/2007 | US7245008 Ball grid array package, stacked semiconductor package and method for manufacturing the same |
| 07/17/2007 | US7244998 Light-emitting or light-receiving semiconductor module and method of its manufacture |
| 07/17/2007 | US7244656 Thin film circuit board device and method for manufacturing the same |
| 07/12/2007 | WO2007077688A1 Soldering method and semiconductor module manufacturing method |
| 07/12/2007 | US20070161228 Wiring substrate and semiconductor device, and method of manufacturing wiring substrate |
| 07/12/2007 | US20070161129 Semiconductor device and manufacturing process thereof |
| 07/12/2007 | US20070159864 Semiconductor Module and Power Conversion Device |
| 07/12/2007 | US20070159545 Managed memory component |
| 07/12/2007 | US20070158815 Multi-chip ball grid array package and method of manufacture |
| 07/12/2007 | US20070158814 Electronic circuit package |
| 07/12/2007 | US20070158811 Low profile managed memory component |
| 07/12/2007 | US20070158682 Semiconductor device |
| 07/12/2007 | US20070158675 Semiconductor light-emitting device and method for manufacturing the device |
| 07/12/2007 | US20070158670 Semiconductor light-emitting device and method for manufacturing the device |
| 07/12/2007 | DE102006000622A1 Miniaturized multi-chip module for wireless transmission device, comprises interposer having thickness more than largest height of integrated circuit chip, that includes substrate confronting surface and board confronting surface |
| 07/12/2007 | DE10142118B4 Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung Electronic component with at least two stacked semiconductor chips and to methods for its preparation |
| 07/11/2007 | EP1806789A2 Light emitting device, lighting equipment or liquid crystal display device using such light emitting device |
| 07/11/2007 | EP1806035A2 An illuminator and manufacturing method |
| 07/11/2007 | EP1805816A1 Process for manufacturing a light emitting array |
| 07/11/2007 | EP1540730A4 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 07/11/2007 | EP1036415B1 Wafer level integration of multiple optical elements |
| 07/11/2007 | CN2922291Y Radio |
| 07/11/2007 | CN2922127Y Luminous device |
| 07/11/2007 | CN1998092A Photoelectric conversion element array, its integrated device, their packaging structure, and optical information processor |
| 07/11/2007 | CN1998081A Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device |
| 07/11/2007 | CN1998077A Semiconductor device manufacturing method and semiconductor device |
| 07/11/2007 | CN1996592A Encapsulation of the image sensor and detector |
| 07/11/2007 | CN1326313C AC generator of vehicles |
| 07/11/2007 | CN1326234C Stacked-type semiconductor device |
| 07/10/2007 | US7243329 Application-specific integrated circuit equivalents of programmable logic and associated methods |
| 07/10/2007 | US7242748 X-ray transmissive optical mirror apparatus |
| 07/10/2007 | US7242584 Housing for power semiconductor modules |
| 07/10/2007 | US7242218 Techniques for combining volatile and non-volatile programmable logic on an integrated circuit |
| 07/10/2007 | US7242217 Output reporting techniques for hard intellectual property blocks |
| 07/10/2007 | US7242213 Memory module and method having improved signal routing topology |
| 07/10/2007 | US7242099 Chip package with multiple chips connected by bumps |
| 07/10/2007 | US7242032 Light emitting device |
| 07/10/2007 | US7242029 Light emitting device |
| 07/10/2007 | US7242012 Lithography device for semiconductor circuit pattern generator |
| 07/10/2007 | US7242006 Dual-sided microstructured, position-sensitive detector |
| 07/10/2007 | US7241675 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 07/10/2007 | US7241641 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 07/10/2007 | US7241530 Module battery |
| 07/05/2007 | WO2007008232A3 Locoregional internal radionuclide ablation of abnormal tissues. |
| 07/05/2007 | WO2006114971A3 Electronic component module |
| 07/05/2007 | US20070157349 Method of Fabricating an Integrated Circuit to Improve Soft Error Performance |
| 07/05/2007 | US20070157146 Method of packing-based macro placement and semiconductor chip using the same |
| 07/05/2007 | US20070155053 Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages |
| 07/05/2007 | US20070155050 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |