| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/05/2007 | WO2005101535A3 High density led array |
| 04/05/2007 | US20070079261 Integrated circuit device and method for forming the same |
| 04/05/2007 | US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts |
| 04/05/2007 | US20070074753 Shape memory alloy motor as incorpoated into solar tracking mechanism |
| 04/05/2007 | DE4418163B4 Verfahren zur Herstellung von mikromechanischen Strukturen Process for the preparation of micro-mechanical structures |
| 04/05/2007 | DE202007001048U1 LED-Baugruppe mit einer Pressglaslinse LED assembly with a molded glass lens |
| 04/05/2007 | DE112005000952T5 Elektronik-Modul und Verfahren zur Herstellung desselben The same electronic module and method for producing |
| 04/05/2007 | DE10352946B4 Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben Of the same semiconductor device with the semiconductor chip and rewiring and methods for preparing |
| 04/05/2007 | DE102005061798A1 Lighting arrangement has radiation-emitting diode with two beam-shaping optical elements that deviate part of the light from the optical axis |
| 04/05/2007 | DE102005061206A1 Detector component and arrangement has microelectronic semiconductor chip and separate optoelectronic detector chip on the semiconductor chip |
| 04/05/2007 | DE102005048100A1 Automotive electrical or electronic control unit is mounted on an extruded metal bar with air vent |
| 04/05/2007 | DE102005046710A1 Carrier for a semiconductor chip comprises a sintered body made from carbon fibers and a metal |
| 04/05/2007 | DE102005046406A1 Electrical current`s current intensity controlling device for e.g. LED, has electrodes electrically connected with front side of semiconductor body and current/voltage source and with rear side of body and electrical load, respectively |
| 04/05/2007 | DE102005046404A1 Method for reducing scattering in the sagging of rolled metal base plates for semi conductor modules involves rolling base plates in preferential such as longitudinal direction |
| 04/05/2007 | DE102004036909B4 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation |
| 04/04/2007 | EP1771050A1 Printed circuit board and method of manufacturing printed circuit board |
| 04/04/2007 | EP1769533A2 Electronic device comprising an integrated circuit |
| 04/04/2007 | EP1769532A1 Electronic device comprising an esd device |
| 04/04/2007 | CN2886805Y Structure in which LED circuit is integrated in radiation baseplate |
| 04/04/2007 | CN1943049A Semiconductor chip for driving light emitting element, light emitting device, and lighting device |
| 04/04/2007 | CN1943032A 半导体器件 Semiconductor devices |
| 04/04/2007 | CN1943031A An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit |
| 04/04/2007 | CN1942054A Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus |
| 04/04/2007 | CN1941432A Solid-crystal conductive and heat-conductive packing structure of light-emitting diodes |
| 04/04/2007 | CN1941365A Light-emitting diodes and light-source device |
| 04/04/2007 | CN1941364A 半导体器件 Semiconductor devices |
| 04/04/2007 | CN1941363A Information transfer in electronic modules and device with corresponding structure |
| 04/04/2007 | CN1941362A Semiconductor power module with excess current protection unit |
| 04/04/2007 | CN1941361A Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 04/04/2007 | CN1941360A Packing structure with stacking platform |
| 04/04/2007 | CN1941343A Chip structure and stacked chip packing structure |
| 04/04/2007 | CN1941317A High temperature electrostatic chuck |
| 04/04/2007 | CN1309285C High frequency circuit block member, its manufacturing method, high refrequency module device and its manufacturing method |
| 04/04/2007 | CN1309073C High-density chip carrier and its constituent method |
| 04/04/2007 | CN1309062C Functional module with built-in radiating fin |
| 04/04/2007 | CN1309061C Functional module with built-in flat plate type radiating element |
| 04/04/2007 | CN1309057C Semiconductor device and method for manufacturing same |
| 04/03/2007 | US7200824 Performance/power mapping of a die |
| 04/03/2007 | US7199653 Semiconductor device with operation mode set by external resistor |
| 04/03/2007 | US7199476 Electronic device |
| 04/03/2007 | US7199469 Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
| 04/03/2007 | US7199468 Hybrid integrated circuit device with high melting point brazing material |
| 04/03/2007 | US7199465 Wire bonding system and method of use |
| 04/03/2007 | US7199459 Semiconductor package without bonding wires and fabrication method thereof |
| 04/03/2007 | US7199458 Stacked offset semiconductor package and method for fabricating |
| 04/03/2007 | US7199457 Thin film circuit board device and its manufacturing method |
| 04/03/2007 | US7199440 Techniques for joining an opto-electronic module to a semiconductor package |
| 04/03/2007 | US7199025 Fabrication and assembly structures and methods for memory devices |
| 04/03/2007 | US7198986 Electronic parts built-in substrate and method of manufacturing the same |
| 04/03/2007 | US7198980 Methods for assembling multiple semiconductor devices |
| 04/03/2007 | US7198979 Method for manufacturing a stack arrangement of a memory module |
| 04/03/2007 | US7198969 Semiconductor chip assemblies, methods of making same and components for same |
| 03/29/2007 | WO2007034626A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module |
| 03/29/2007 | WO2005112525A3 Apparatus, system, and method for frequency stabilized mode-locked laser |
| 03/29/2007 | US20070072347 Method of assembly for multi-flip chip on lead frame on overmolded ic package |
| 03/29/2007 | US20070069642 Sphere-supported thin film phosphor electroluminescent devices |
| 03/29/2007 | US20070069227 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component |
| 03/29/2007 | US20070069038 Method of manufacturing a contactless card |
| 03/29/2007 | US20070068568 Solar panel and production method therefor |
| 03/29/2007 | DE102006005645A1 Stapelbarer Baustein, Bausteinstapel und Verfahren zu deren Herstellung Stackable building block, block stack and processes for their preparation |
| 03/29/2007 | DE102005047567B3 Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body |
| 03/29/2007 | DE102005045100A1 Verfahren zum Herstellen eines Leistungshalbleitermoduls Method for producing a power semiconductor module |
| 03/29/2007 | DE102004030813B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 03/29/2007 | CA2623192A1 Photovoltaic device comprising two photovoltaic cells and two photon sources |
| 03/28/2007 | EP1768193A2 Light emitting diode |
| 03/28/2007 | EP1768183A2 Microdevices with bump contacts on two sides and manufacturing method thereof |
| 03/28/2007 | EP1768182A2 Semiconductor power module with overcurrent protection means |
| 03/28/2007 | EP1766693A1 Light emitting device including rgb light emitting diodes and phosphor |
| 03/28/2007 | EP1766692A1 Light emitting device |
| 03/28/2007 | EP1766683A2 Universal interconnect die |
| 03/28/2007 | EP1399953B1 Opto-electronic device integration |
| 03/28/2007 | CN2884534Y Improved LED |
| 03/28/2007 | CN1938866A Laminate type thin-film solar cell and production method therefor |
| 03/28/2007 | CN1937265A Led光源产品 Led lighting products |
| 03/28/2007 | CN1937223A 半导体装置 Semiconductor device |
| 03/28/2007 | CN1937222A LED package and illuminating device |
| 03/28/2007 | CN1937221A Stacking structure for semiconductor packaging assembly |
| 03/28/2007 | CN1936931A Package structure of radio-frequency identifying volume label jointed with microassembly |
| 03/28/2007 | CN1307712C 半导体器件 Semiconductor devices |
| 03/28/2007 | CN1307700C Semiconductor device, its manufacturing method, and radio communication device |
| 03/28/2007 | CN1307698C Device having resin package and method of producing the same |
| 03/28/2007 | CN1307401C Measurement method for determining a surface profile |
| 03/27/2007 | US7196427 Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element |
| 03/27/2007 | US7196418 Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device |
| 03/27/2007 | US7196415 Low voltage drop and high thermal performance ball grid array package |
| 03/27/2007 | US7196413 Heat dissipation assembly and method for producing the same |
| 03/27/2007 | US7196412 Multi-chip press-connected type semiconductor device |
| 03/27/2007 | US7196408 Fan out type wafer level package structure and method of the same |
| 03/27/2007 | US7196407 Semiconductor device having a multi-chip stacked structure and reduced thickness |
| 03/27/2007 | US7195957 Packaged microelectronic components |
| 03/27/2007 | US7195948 Method for fabricating semiconductor device |
| 03/27/2007 | US7195935 Selective packaging of tested semiconductor devices |
| 03/27/2007 | US7195687 Device transferring method, and device arraying method and image display unit fabricating method using the same |
| 03/22/2007 | WO2007032486A1 Insulating circuit board and insulating circuit board provided with cooling sink section |
| 03/22/2007 | US20070065987 Stacked mass storage flash memory package |
| 03/22/2007 | US20070065983 Decoupling capacitor closely coupled with integrated circuit |
| 03/22/2007 | US20070065981 Semiconductor system-in-package |
| 03/22/2007 | US20070063343 Substrate for semiconductor device and semiconductor device |
| 03/22/2007 | US20070063332 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 03/22/2007 | US20070063328 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |