| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/23/2007 | DE102006006425A1 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design |
| 08/23/2007 | DE102006006424A1 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method |
| 08/23/2007 | DE102006006423A1 Leistungshalbleitermodul und zugehöriges Herstellungsverfahren The power semiconductor module and associated production method |
| 08/23/2007 | DE102006006422A1 Leistungshalbleitermodul mit Kontakteinrichtung Power semiconductor module with contactor |
| 08/23/2007 | DE102006006421A1 Power semiconductor module has substrate with insulating material body, where connection element is formed as contact spring with two contact mechanism and springy section |
| 08/23/2007 | DE102006006175A1 Power electronics assembly has surface of insulating substrate with a metal layer, which projects beyond substrate on all sides and projecting region of metal layer forms metal flange which borders insulating substrate |
| 08/23/2007 | DE102004031954B4 Halbleiterpackung mit gestapelten Chips Semiconductor package with stacked chips |
| 08/22/2007 | EP1821348A2 Light emitting device having vertical structure package thereof and method for manufacturing the same |
| 08/22/2007 | EP1821341A1 Electric assembly with a wire-bonded circuit and method for manufacturing such an electric assembly |
| 08/22/2007 | EP0972301B1 Manufacturing a heterobipolar transistor and a laser diode on the same substrate |
| 08/22/2007 | CN2938407Y LED for solar lawn lamp with control function |
| 08/22/2007 | CN2938406Y LED package structure of increasing luminous effect |
| 08/22/2007 | CN2938405Y Led |
| 08/22/2007 | CN1333460C High-frequency module board device |
| 08/22/2007 | CN1333459C 电路装置 Circuit device |
| 08/22/2007 | CN1333449C Semiconductor package piece |
| 08/22/2007 | CN1333434C Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 08/22/2007 | CN1333431C Method for fabricating semiconductor device |
| 08/22/2007 | CN101022147A Ceramic packaged light-emitting diode and producing method thereof |
| 08/22/2007 | CN101022104A Light-emitting diode package, light-emitting diode array and method for improving chromatic aberration |
| 08/22/2007 | CN101022103A Chip package body |
| 08/22/2007 | CN101022102A LED lamp capable of emitting white light |
| 08/22/2007 | CN101022101A Integrated circuit chip and package |
| 08/22/2007 | CN101022100A Light-emitting diode module |
| 08/21/2007 | US7259587 Configurable IC's with configurable logic resources that have asymetric inputs and/or outputs |
| 08/21/2007 | US7259459 Semiconductor module and DC-DC converter |
| 08/21/2007 | US7259451 Invertible microfeature device packages |
| 08/21/2007 | US7259450 Double-packaged multi-chip semiconductor module |
| 08/21/2007 | US7259403 Card-type LED illumination source |
| 08/21/2007 | US7259323 Thin film solar cell thermal radiator |
| 08/21/2007 | US7259046 Semiconductor device and manufacturing method thereof |
| 08/21/2007 | US7259030 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| 08/16/2007 | WO2007091119A1 Electromagnetic radiation collection device |
| 08/16/2007 | WO2007090664A2 Power electronics assembly |
| 08/16/2007 | WO2007090227A1 Pixel array and tile for a video display |
| 08/16/2007 | WO2007052241A3 Method for preparing an electric comprising multiple leds |
| 08/16/2007 | WO2006114971A9 Electronic component module |
| 08/16/2007 | US20070190693 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 08/16/2007 | US20070189007 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module |
| 08/16/2007 | US20070187823 Semiconductor device |
| 08/16/2007 | US20070187811 Stacked chip semiconductor device and method for manufacturing the same |
| 08/16/2007 | US20070187708 LED Illumination Apparatus and Card-Type LED Illumination Source |
| 08/16/2007 | US20070187603 MEMS radiometer |
| 08/16/2007 | US20070187142 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 08/16/2007 | DE102006027482B3 Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung Gehauste semiconductor circuit with contactor |
| 08/16/2007 | DE102006005445A1 Leistungshalbleitermodul The power semiconductor module |
| 08/16/2007 | DE102005056907B3 3-dimensionales Mehrchip-Modul 3-dimensional multi-chip module |
| 08/16/2007 | DE102005001590B4 BOC-Package BOC Package |
| 08/16/2007 | CA2642645A1 Electromagnetic radiation collection device |
| 08/15/2007 | EP1818988A2 Integrated circuit chip and package |
| 08/15/2007 | EP1818987A1 Semi-conductor component assembly |
| 08/15/2007 | EP1818986A2 Semiconductor device |
| 08/15/2007 | EP1818984A2 Semiconductor chip with multiple rows of bond pads |
| 08/15/2007 | EP1818980A2 Substrate for high voltage modules |
| 08/15/2007 | EP1818979A1 Electronic component and production method therefor |
| 08/15/2007 | EP1817799A1 Semiconductor device and rectifier arrangement |
| 08/15/2007 | EP1817795A1 Metallised film for sheet contacting |
| 08/15/2007 | EP1570530B1 Production method for a solar panel |
| 08/15/2007 | EP1466363A4 Semiconductor device with co-packaged die |
| 08/15/2007 | EP1295340B1 Semiconductor chip |
| 08/15/2007 | CN2935477Y High brightness white LED |
| 08/15/2007 | CN2935474Y Functional lighting LED |
| 08/15/2007 | CN2935473Y Reinforced micro-electromechanical packaging structure |
| 08/15/2007 | CN2935472Y 球栅阵列封装结构 Ball grid array package structure |
| 08/15/2007 | CN2935471Y Two-chip packaging |
| 08/15/2007 | CN1332498C Cooling body and rectifier module for a motor |
| 08/15/2007 | CN1332431C Method for producing semiconductor device |
| 08/15/2007 | CN101017956A Encapsulation structure and method of the high-speed semiconductor light emission component |
| 08/15/2007 | CN101017815A Two-in-one LED encapsulation structure |
| 08/15/2007 | CN101017814A A separating fluorescence film white LED lamp |
| 08/15/2007 | CN101017813A 半导体装置 Semiconductor device |
| 08/15/2007 | CN101017812A Communication semiconductor chip, calibration method, and program |
| 08/15/2007 | CN101017811A 多芯片堆栈结构 Multi-chip stack structure |
| 08/15/2007 | CN101017785A Semiconductor stack structure and its making method |
| 08/14/2007 | US7257002 Heat radiation device for memory module |
| 08/14/2007 | US7256613 Programmable interconnect architecture for programmable logic devices |
| 08/14/2007 | US7256612 Programmable logic block providing carry chain with programmable initialization values |
| 08/14/2007 | US7256496 Semiconductor device having adhesion increasing film to prevent peeling |
| 08/14/2007 | US7256493 Ball grid array housing having a cooling foil |
| 08/14/2007 | US7256489 Semiconductor apparatus |
| 08/14/2007 | US7256484 Memory expansion and chip scale stacking system and method |
| 08/14/2007 | US7256073 Semiconductor device and manufacturing method thereof |
| 08/14/2007 | US7256072 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 08/14/2007 | US7255496 Package for housing an optoelectronic assembly |
| 08/14/2007 | US7255494 Low-profile package for housing an optoelectronic assembly |
| 08/09/2007 | WO2007089380A2 METHOD OF MAKING OPTICAL LIGHT ENGINES WITH ELEVATED LEDs AND RESULTING PRODUCT |
| 08/09/2007 | WO2007088866A1 Memory card and method for manufacturing memory card |
| 08/09/2007 | WO2007088757A1 Memory card and memory card manufacturing method |
| 08/09/2007 | US20070182000 Module part |
| 08/09/2007 | US20070181816 Anisotropic conductive film, x-ray flat panel detector, infrared flat panel detector and display device |
| 08/09/2007 | US20070181174 Photovoltaic tiles, roofing system, and method of constructing roof |
| 08/09/2007 | DE10211677B4 Anordnung zum Senden oder Empfangen von optischen Signalen Arrangement for transmitting or receiving optical signals |
| 08/09/2007 | DE102007006440A1 Lighting assembly, has receiving space formed in support structure, and aligned to outer contour of light emitting diode arrangement that is shedded with support structure with translucent grouting material |
| 08/09/2007 | DE102006061118A1 Licht aussendende Vorrichtung, Verfahren zu deren Herstellung und Baugruppe Light-emitting device, method for their production and assembly |
| 08/09/2007 | DE102006010145A1 Optokopplervorrichtung und Verfahren zur Fertigung dessen Optical coupling device and method for production thereof |
| 08/09/2007 | DE102006004581A1 Licht-Modul, Licht-Mehrfachmodul und Verwendung eines Licht-Moduls oder Licht-Mehrfachmoduls zur Beleuchtung oder Hinterleuchtung Light module, light multiple module and using a light module or light multiple module for lighting or backlighting |
| 08/09/2007 | DE10142585B4 Halbleiteranordnung und zugehöriges Verfahren zu deren Herstellung A semiconductor device and associated method for the preparation thereof |
| 08/09/2007 | DE10084657B4 Modulkarte und Herstellverfahren für diese Module board and manufacturing method of this |
| 08/09/2007 | DE10008572B4 Verbindungseinrichtung für Leistungshalbleitermodule Connector for power semiconductor modules |
| 08/08/2007 | EP1815534A2 Composite led modules |