| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 12/26/2006 | US7152319 Method of making high speed circuit board |
| 12/21/2006 | WO2006135841A1 Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| 12/21/2006 | WO2006135840A1 Thermally conductive polyamide-based components used in light emitting diode reflector applications |
| 12/21/2006 | WO2006134705A1 Terminal box for solar cell module |
| 12/21/2006 | WO2006134629A1 Semiconductor circuit board and semiconductor circuit |
| 12/21/2006 | WO2006134410A2 Light-emitting structures |
| 12/21/2006 | WO2006134114A1 Organic pixilated flat panel detector and method for the production thereof |
| 12/21/2006 | WO2006133664A1 Power semiconductor component stack of planar conductor design with surface-mountable outer contacts and a method for production thereof |
| 12/21/2006 | WO2005089477A3 Direct cooling of leds |
| 12/21/2006 | US20060286828 Contact Structures Comprising A Core Structure And An Overcoat |
| 12/21/2006 | US20060286714 Semiconductor device and system having semiconductor device mounted thereon |
| 12/21/2006 | US20060285324 Color-mixing lighting system |
| 12/21/2006 | US20060284320 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 12/21/2006 | US20060284306 Multi-chip type semiconductor device |
| 12/21/2006 | US20060283917 Method of soldering or brazing articles having surfaces that are difficult to bond |
| 12/21/2006 | DE19903028B4 MOS-Halbleiteranordnung MOS semiconductor device |
| 12/21/2006 | DE112004001176T5 Elektronische Baugruppe für elektrische Maschine Electronic assembly for electrical machine |
| 12/21/2006 | DE102006028358A1 Power semiconductor module e.g. insulated gate bipolar transistor, has magnetic core set around module package so as to surround power semiconductor devices |
| 12/21/2006 | DE102006011473A1 Verfahren zum MCP-Häusen für eine ausgeglichene Leistung A method for MCP-housings for balanced performance |
| 12/21/2006 | DE102005026435B3 Eine Speicherkarte, ihre Herstellung und eine Mobiltelefonvorrichtung mit einer Speicherkarte A memory card, its preparation and a mobile phone device with a memory card |
| 12/21/2006 | CA2611278A1 Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| 12/21/2006 | CA2611270A1 Thermally conductive polyamide-based components used in light emitting diode reflector applications |
| 12/21/2006 | CA2589325A1 Light-emitting structures |
| 12/20/2006 | EP1734581A1 Laminated semiconductor package |
| 12/20/2006 | EP1226611B1 Optical semiconductor housing and method for making same |
| 12/20/2006 | EP1226609B1 Optical semiconductor housing and method for making same |
| 12/20/2006 | CN2850134Y Rectifying bridge arm |
| 12/20/2006 | CN2849979Y High heat radiation LED module |
| 12/20/2006 | CN2849969Y High power LED device |
| 12/20/2006 | CN2849463Y Monomer bipolar bicolour LED lamp bulb |
| 12/20/2006 | CN1881627A White light apparatus with light-emitting diode |
| 12/20/2006 | CN1881579A Light emitting apparatus |
| 12/20/2006 | CN1881578A Laminated semiconductor package |
| 12/20/2006 | CN1881575A Electronic member |
| 12/20/2006 | CN1881552A Method for manufacturing optocoupler |
| 12/20/2006 | CN1879552A Soft physiological signal monitoring device |
| 12/20/2006 | CN1291490C Semiconductor device and camera assembly for small electronic apparatus |
| 12/20/2006 | CN1291487C Semiconductor device and its making method, and electronic device with the same |
| 12/20/2006 | CN1291480C Manufacturing method of semiconductor device and semiconductor device |
| 12/20/2006 | CN1291471C Device test apparatus and test method |
| 12/20/2006 | CN1291467C Method for manufacturing electronic device |
| 12/20/2006 | CN1290956C Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
| 12/19/2006 | US7151661 Capacitor module and semiconductor device using the same |
| 12/19/2006 | US7151281 Light-emitting diode structure with electrostatic discharge protection |
| 12/19/2006 | US7151259 Method for operating an optoelectronic sensor device |
| 12/19/2006 | US7151041 Methods of forming semiconductor circuitry |
| 12/19/2006 | US7151013 Semiconductor package having exposed heat dissipating surface and method of fabrication |
| 12/19/2006 | US7151009 Method for manufacturing wafer level chip stack package |
| 12/19/2006 | US7150553 Replaceable LED lamp capsule |
| 12/19/2006 | US7150406 Thin electronic label and method for making same |
| 12/14/2006 | WO2006131209A2 Photodiode with integrated semiconductor circuit and method for the production thereof |
| 12/14/2006 | US20060282804 Novel test structure for automatic dynamic negative-bias temperature instability testing |
| 12/14/2006 | US20060279955 Light emitting device |
| 12/14/2006 | US20060279300 Probe Card Assembly And Kit |
| 12/14/2006 | US20060278967 Method for manufacturing an electronic module and an electronic module |
| 12/14/2006 | US20060278324 Mounting Device and Method Thereof |
| 12/14/2006 | DE102004028143B4 Vorrichtung zur Digitalisierung von Filmmaterial Device for digitizing footage |
| 12/14/2006 | DE102004010614B4 Basishalbleiterbauteil für einen Halbleiterbeuteilstapel und Verfahren zur Herstellung desselben Based semiconductor device for a Halbleiterbeuteilstapel and method of manufacturing the same |
| 12/14/2006 | DE10110203B4 Elektronisches Bauteil mit gestapelten Halbleiterchips und Verfahren zu seiner Herstellung An electronic part having stacked semiconductor chips and process for its preparation |
| 12/14/2006 | CA2609646A1 Lead free solar cell contacts |
| 12/13/2006 | EP1732132A1 Array-type modularized light-emitting diode structure and method for packaging the structure |
| 12/13/2006 | EP1732130A2 Circuit assembly with surface-mount IC package and heat sink |
| 12/13/2006 | EP1730792A2 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module |
| 12/13/2006 | EP1730774A2 Integrated circuit stacking system and method |
| 12/13/2006 | EP1425800B1 Image sensor with recessed planarizing layers and method for making same |
| 12/13/2006 | CN2847535Y Led发光体 Led luminous body |
| 12/13/2006 | CN1879217A Electric motor and method for producing said motor |
| 12/13/2006 | CN1877833A U-grooved integrated chip and method for fabricating same |
| 12/13/2006 | CN1877832A Composite LED package structure |
| 12/13/2006 | CN1877831A Composite LED package structure |
| 12/13/2006 | CN1877830A Light-emitting system, light-emitting device, and forming method therefor |
| 12/13/2006 | CN1877824A Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device |
| 12/13/2006 | CN1290263C In service programmable logic arrays with ultra thin vertical body transistors |
| 12/13/2006 | CN1290170C Method for testing probe board and semiconductor chip, capacitor and mfg. method thereof |
| 12/12/2006 | US7149284 Segmented collimator assembly |
| 12/12/2006 | US7149095 Stacked microelectronic assemblies |
| 12/12/2006 | US7148578 Semiconductor multi-chip package |
| 12/12/2006 | US7148576 Semiconductor device and method of fabricating the same |
| 12/12/2006 | US7148567 Semiconductor integrated circuit device |
| 12/12/2006 | US7148565 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 12/12/2006 | US7148562 Power semiconductor device and power semiconductor module |
| 12/12/2006 | US7148087 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 12/12/2006 | US7148084 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 12/12/2006 | US7148081 Method of manufacturing a semiconductor device |
| 12/12/2006 | US7148080 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package |
| 12/12/2006 | US7148078 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities |
| 12/07/2006 | WO2006129232A2 Flexible display device |
| 12/07/2006 | WO2006129223A1 Flexible display device |
| 12/07/2006 | US20060275957 Semiconductor device |
| 12/07/2006 | US20060274228 Image display device and light emission device |
| 12/07/2006 | US20060274227 Image display device and light emission device |
| 12/07/2006 | US20060273440 Stacking apparatus and method for stacking integrated circuit elements |
| 12/07/2006 | US20060273439 Three-dimensional multichip stack electronic package structure |
| 12/07/2006 | US20060273255 Method for forming the image in millimetre and sub-millimetre wave band (variants), system for forming the image in millimetre and sub-millimeter wave band (variants), diffuser light (variants) and transceiver (variants) |
| 12/07/2006 | DE102005051497B3 Memory module e.g. registered dual in-line memory module, has two groups of semiconductor chips connected by two separate line buses, respectively, where conducting paths of line buses branch out to all semiconductor chips of groups |
| 12/07/2006 | DE102005029251A1 Speichermodul und Verfahren zum Betreiben eines Speichermoduls Memory module and method of operating a memory module |
| 12/07/2006 | DE102005025623A1 LED-Leuchte und Anorndung aus Leuchtenkörper und LED-Betriebsgerät LED light and Anorndung of lamp body and LED control gear |
| 12/07/2006 | DE102005024830A1 Leuchtdioden-Anordnung Light emitting diode array |
| 12/07/2006 | DE10064194B4 Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls Power semiconductor module and the cooling body for receiving the power semiconductor module |
| 12/07/2006 | DE10024518B4 Integriertes Halbleiterschaltelement und Herstellungsverfahren Integrated semiconductor switching element and methods of manufacture |