Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2007
03/22/2007US20070063327 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063326 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063321 Light emitting diode package and light emitting diode system having at least two heat sinks
03/22/2007US20070063229 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063202 Method for producing electronic components
03/22/2007US20070062033 Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
03/22/2007DE10315303B4 Halbleiter-Bauelement-Spannungsversorgung für System mit mindestens zwei, insbesondere gestapelten, Halbleiter-Bauelementen The semiconductor device for power supply system having at least two, in particular stacked, semiconductor devices
03/22/2007DE102005040781A1 Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing
03/22/2007DE102005011857B4 Flächige Beleuchtungseinrichtung Area lighting device
03/21/2007EP1764552A1 Variable optics spot module
03/21/2007EP1763899A2 Light emitting diode module
03/21/2007EP1763896A2 Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode
03/21/2007EP1763894A2 Stacked die bga or lga component assembly
03/21/2007EP1410424A4 Opto-electronic device integration
03/21/2007EP1399952A4 Opto-electronic device integration
03/21/2007CN2881965Y LED structure
03/21/2007CN2881959Y High brightness LED with multiple grain
03/21/2007CN2881958Y Semiconductor cuminescent device package structure
03/21/2007CN1934720A Semiconductor light-emitting device and illuminating device
03/21/2007CN1934710A Large-area photovoltaic device and methods of making same
03/21/2007CN1934704A Chip stacking semiconductor device
03/21/2007CN1933194A Back light module and light-emitting diode packaging structure thereof
03/21/2007CN1933151A White light light-emitting diode and producing method thereof
03/21/2007CN1933150A Semiconductor IC-embedded module
03/21/2007CN1933149A Backward integrated micro-lens infrared focal plane detector and micro-lens producing method
03/21/2007CN1933148A Electron package structure
03/21/2007CN1933147A Chip packaging body and stack chip packaging structure
03/21/2007CN1933132A Chip packaging body without kernel dielectric layer and stack chip packaging structure
03/21/2007CN1933117A Producing process for chip packaging body without kernel dielectric layer
03/21/2007CN1306629C LED lamp
03/21/2007CN1306627C Light-emitting diode light source unit
03/21/2007CN1306621C Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler
03/21/2007CN1306600C Press pack power semiconductor module
03/20/2007US7193860 Leadframe-based module DC bus design to reduce module inductance
03/20/2007US7193438 Configurable integrated circuit with offset connection
03/20/2007US7193437 Architecture for a connection block in reconfigurable gate arrays
03/20/2007US7193432 VPA logic circuits
03/20/2007US7193358 Light-emitting device arranged in the light distribution pattern for a vehicle
03/20/2007US7193331 Semiconductor device and manufacturing process thereof
03/20/2007US7193317 Semiconductor module and power conversion device
03/20/2007US7193312 Castellation wafer level packaging of integrated circuit chips
03/20/2007US7193311 Multi-chip circuit module and method for producing the same
03/20/2007US7193310 Stacking system and method
03/20/2007US7193308 Intermediate chip module, semiconductor device, circuit board, and electronic device
03/20/2007US7193306 Semiconductor structure having stacked semiconductor devices
03/20/2007US7193297 Semiconductor device, method for manufacturing the same, circuit substrate and electronic device
03/20/2007US7193239 Three dimensional structure integrated circuit
03/20/2007US7193214 Sensor having differential polarization and a network comprised of several such sensors
03/20/2007US7193212 Infrared radiation detecting device
03/20/2007US7193211 Thermal type infrared ray imaging device and fabrication method thereof
03/20/2007US7192847 Ultra-thin wafer level stack packaging method
03/20/2007US7192488 Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
03/20/2007US7192311 Apparatus for forming modular sockets using flexible interconnects and resulting structures
03/20/2007US7192164 Light-emitting apparatus and illuminating apparatus
03/20/2007US7192146 Solar concentrator array with grouped adjustable elements
03/20/2007US7191516 Method for shielding integrated circuit devices
03/15/2007WO2007029445A1 Capacitor-equipped semiconductor device
03/15/2007WO2007029384A1 Semiconductor device
03/15/2007WO2006103596A3 Flexible led array
03/15/2007WO2005099310A3 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
03/15/2007US20070059984 Modular sockets using flexible interconnects
03/15/2007US20070059866 Fan out type wafer level package structure and method of the same
03/15/2007US20070059862 Multiple chip semiconductor package
03/15/2007US20070057383 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057367 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057191 Radiological imaging system
03/15/2007US20070057190 Ultra-high resolution pixel electrode arrangement structure signal processing method
03/15/2007DE102005046063B3 Semiconductor power module with excess current protection unit has fuse unit surrounded by explosion protection material connected across conductive tracks by narrower leads than power semiconductor
03/15/2007DE102005042066A1 Hinterleuchtungsanordnung mit in Leuchtgruppen angeordneten Halbleiterlichtquellen With backlighting illumination groups arranged in semiconductor light sources
03/15/2007DE102005041452A1 Three-dimensional integrated electronic component and production process has chips, wafers or films with active and passive electronic components in embedded or printed circuits in many interconnected planes
03/15/2007DE102005041174A1 Leistungshalbleiterbauteil mit Leitungen innerhalb eines Gehäuses Power semiconductor component with leads within a housing
03/15/2007CA2621505A1 3-dimensional multi-layered modular computer architecture
03/14/2007EP1763079A1 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
03/14/2007EP1763078A1 Alignment measurement system to determine alignment between chips
03/14/2007EP1763070A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet
03/14/2007EP1762943A1 Chip-to-chip communication system
03/14/2007EP1761964A2 Chip with a power supply device
03/14/2007CN1930695A Semiconductor light emitting devices and submounts and methods for forming the same
03/14/2007CN1930682A Various structure/height bumps for wafer level-chip scale package
03/14/2007CN1929155A Light-emitting device generating visible light
03/14/2007CN1929133A Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
03/14/2007CN1929132A Electronic apparatus
03/14/2007CN1929131A Electronic apparatus
03/14/2007CN1929130A Multi-chip stacking package structure
03/14/2007CN1929129A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929128A Illuminating source device
03/14/2007CN1929120A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929105A Three-dimensional interconnection interpolator applied in system packaging and its producing method
03/14/2007CN1305133C Semiconductor device and method of manufacturing the same
03/14/2007CN1305004C IC card and manufacturing method thereof
03/13/2007US7190190 Programmable logic device with on-chip nonvolatile user memory
03/13/2007US7190074 Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
03/13/2007US7190071 Semiconductor package and method for fabricating the same
03/13/2007US7190070 Modular power semiconductor module
03/13/2007US7190068 Bottom heat spreader
03/13/2007US7190064 Semiconductor device and method of manufacturing the same
03/13/2007US7190063 Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus
03/13/2007US7190061 stack package made of chip scale packages
03/13/2007US7190060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
03/13/2007US7190059 Electronic component with a stack of semiconductor chips and a method for producing the electronic component
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