Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2007
10/11/2007US20070235885 Semiconductor device
10/11/2007US20070235881 Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device
10/11/2007DE10308323B4 Halbleiterchipanordnung mit ROM Semiconductor chip assembly with ROM
10/11/2007DE10255818B4 Programmierbare Steuerung Programmable Logic Controller
10/11/2007DE10247035B4 Speichermodul mit einer Wärmeableiteinrichtung Memory module with a heat sink
10/11/2007DE10204083B4 Verfahren zum Anpassen eines Drehmomentmodells und Anordnung A method for adjusting a torque model and configuration
10/11/2007DE102007015731A1 Halbleitervorrichtung mit Wärmeabstrahlteil und Halbleiterchip und Verfahren zu dessen Herstellung A semiconductor device having heat radiation and the semiconductor chip and process for its preparation
10/11/2007DE102006015377A1 Halbleiter-Strahlungsquelle sowie Lichthärtgerät Semiconductor radiation source and light curing device
10/11/2007DE102006015336A1 Halbleiter-Strahlungsquelle Semiconductor radiation source
10/11/2007DE102006015335A1 Halbleiter-Strahlungsquelle sowie Lichthärtgerät Semiconductor radiation source and light curing device
10/11/2007DE102006014609A1 Semiconductor module, has plumb layer forming layer compound together with substrate underside-metallization layer, where edges of layer compound are formed such that radii of edges lie in specific range
10/11/2007DE102006014582A1 Halbleitermodul Semiconductor module
10/11/2007DE102004021122B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
10/10/2007EP1843453A1 Rotary electric machine
10/10/2007EP1843403A2 Light emitting unit and lighting apparatus
10/10/2007EP1843402A1 Semiconductor illuminant and illumination panel with such system
10/10/2007EP1843394A2 Semi-conductor radiation source and light hardening apparatus
10/10/2007EP1843393A2 Pressure contact type power semiconductor module
10/10/2007EP1843391A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component
10/10/2007EP1843080A2 Semi-conductor radiation source
10/10/2007EP1842408A2 Low thermal resistance power module assembly
10/10/2007EP1842218A2 Light emission device
10/10/2007EP1547131A4 Large-diameter sic wafer and manufacturing method thereof
10/10/2007CN101051636A LED packaging structure
10/10/2007CN101051635A Solid-state image pickup device and method for manufacturing thereof
10/10/2007CN101051634A Silicon lining bottom plane LED integrated chip and producing method
10/10/2007CN101051633A A package having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
10/10/2007CN101050846A Method for producing flexible light source and flexible base board and flexible solid state light source
10/10/2007CN100342538C Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment
10/10/2007CN100342537C Semiconductor apparatus and processing system utilizing the same semiconductor apparatus
10/10/2007CN100342536C Integrated electronic micromodule and method for making same
10/10/2007CN100342534C Stacked microelectronic packages
10/10/2007CN100342508C Improved memory package
10/09/2007US7279963 Low inductance semiconductor device having half-bridge configuration
10/09/2007US7279797 Module assembly and method for stacked BGA packages
10/09/2007US7279784 Semiconductor package
10/09/2007US7279771 Wiring board mounting a capacitor
10/09/2007US7279724 Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
10/09/2007US7279723 LED lamp
10/09/2007US7279363 Vertically stacked semiconductor device
10/09/2007US7279361 Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages
10/09/2007US7279350 White-light emitting devices and methods for manufacturing the same
10/09/2007US7278760 Light-emitting electronic component
10/04/2007WO2007111290A1 Method for manufacturing substrate having electric component
10/04/2007WO2007079121A3 Interconnected ic packages with vertical smt pads
10/04/2007WO2007053523A3 Stacked module systems and methods
10/04/2007US20070232061 Semiconductor device having adhesion increasing film to prevent peeling
10/04/2007US20070232054 Semiconductor device and manufacturing method thereof
10/04/2007US20070231964 Methods of forming semiconductor assemblies
10/04/2007US20070230139 Semiconductor Module with Serial Bus Connection to Multiple Dies
10/04/2007US20070230134 Semiconductor Module with Serial Bus Connection to Multiple Dies
10/04/2007US20070229143 Power Module
10/04/2007US20070228566 Ball grid array package construction with raised solder ball pads
10/04/2007US20070228565 Ball grid array housing having a cooling foil
10/04/2007US20070228494 Electronic card with protection against aerial discharge
10/04/2007US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
10/04/2007US20070227761 Heat Conduction From an Embedded Component
10/04/2007US20070226996 Hybrid integrated circuit device and method of manufacturing the same
10/04/2007DE10334575B4 Elektronisches Bauteil und Nutzen sowie Verfahren zur Herstellung derselben Electronic component and benefits as well as methods for making same
10/04/2007DE10300711B4 Verfahren zur Passivierung eines Halbleiterchipstapels A method for passivation of a semiconductor chip stack
10/04/2007DE102007004005A1 Leistungshalbleitermodul The power semiconductor module
10/04/2007DE102006015115A1 Electronic module, has units and body covered with electrical insulating layer, where units have surfaces that are electrically conductive and connected by one unit with contact area of body and by path structure
10/04/2007DE102006013078A1 Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung Compact power semiconductor module with connector
10/03/2007EP1840964A1 Semiconductor device with protected access
10/03/2007EP1840961A2 High performance semiconductor module and associated manufacturing method
10/03/2007EP0821406B1 An integrated circuit on an ultra-flexible substrate and a method of wire bonding an integrated circuit to an ultra-flexible substrate
10/03/2007CN200956370Y Package-on-package structure for communication module
10/03/2007CN101048868A Method for manufacturing semiconductor device having three-dimensional multilayer structure
10/03/2007CN101048022A Organic luminous display
10/03/2007CN101047221A LED package structure and method for manufacturing the same
10/03/2007CN101047174A Composite semiconductor device, LED head, and image forming apparatus
10/03/2007CN101047172A Compact type power semi-conductor module with connecting device
10/03/2007CN101047171A 半导体装置 Semiconductor device
10/03/2007CN101047170A Semiconductor device and manufacturing method thereof
10/03/2007CN101047169A Operation processing apparatus
10/03/2007CN101047168A Modular LED package structure
10/03/2007CN101047167A Semiconductor package stack with through-via connection
10/03/2007CN101047054A Varistor and light-emitting apparatus
10/03/2007CN101047052A Varistor and light-emitting apparatus
10/03/2007CN101046278A Great power LED lamp
10/03/2007CN100341164C Modular structure of array LED and its packing method
10/03/2007CN100341127C 半导体器件 Semiconductor devices
10/02/2007US7277568 Method for suppressing ghost image artifacts in x-ray device for performing this method
10/02/2007US7277526 Apparatus, system, and method for high flux, compact compton x-ray source
10/02/2007US7276799 Chip stack package and manufacturing method thereof
10/02/2007US7276793 Semiconductor device and semiconductor module
10/02/2007US7276791 Board having alternating rows of processors and memories
10/02/2007US7276785 Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof
10/02/2007US7276780 Semiconductor device and chip-stack semiconductor device
10/02/2007US7276437 Semiconductor device and manufacturing method thereof
10/02/2007US7276387 Castellation wafer level packaging of integrated circuit chips
10/02/2007US7276292 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40.
09/2007
09/30/2007CA2582881A1 Led bulb
09/27/2007WO2007109326A2 Methods and materials useful for chip stacking, chip and wafer bonding
09/27/2007WO2006132766A3 Lead free solar cell contacts
09/27/2007US20070224731 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
09/27/2007US20070223159 Semiconductor Module with Serial Bus Connection to Multiple Dies
09/27/2007US20070222083 RF and MMIC stackable micro-modules
09/27/2007US20070222062 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
09/27/2007US20070222061 Semiconductor Module With Serial Bus Connection to Multiple Dies
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