Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2007
10/24/2007CN101061582A Metallised film for sheet contacting
10/24/2007CN101061580A Insulating circuit board and insulating circuit board provided with cooling sink section
10/24/2007CN101060734A Organic LED double panel module
10/24/2007CN101060153A A side LED and its manufacture process
10/24/2007CN101060152A A sheet-type LED
10/24/2007CN101060118A LED module
10/24/2007CN101060117A Chip overlap structure and wafer structure for manufacturing the chip stack structure
10/24/2007CN101060116A Led package
10/24/2007CN101060115A 半导体装置 Semiconductor device
10/24/2007CN101060114A Light-emitting device
10/24/2007CN101060113A Chip package structure
10/24/2007CN101060087A Electrode, manufacturing method of the same, and semiconductor device having the same
10/24/2007CN100345296C Multichip semiconductor package with chip carrier having down stretched pin
10/24/2007CN100345295C 半导体封装构造 Semiconductor package
10/24/2007CN100345290C Semiconductor apparatus
10/24/2007CN100345268C 半导体装置 Semiconductor device
10/23/2007US7287115 Multi-chip package type memory system
10/23/2007US7286386 Semiconductor device
10/23/2007US7286365 Electronic substrate for a three-dimensional electronic module
10/23/2007US7286007 Configurable clock network for programmable logic device
10/23/2007US7285864 Stack MCP
10/23/2007US7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
10/23/2007US7285850 Support elements for semiconductor devices with peripherally located bond pads
10/23/2007US7285848 Carrier for stacked type semiconductor device and method of fabricating the same
10/23/2007US7285847 Chip stack package, connecting board, and method of connecting chips
10/23/2007US7285803 Light-emitting diode lamp having a terminal portion with a notch portion
10/23/2007US7285730 Ceramic circuit board and method for manufacturing the same
10/23/2007US7285728 Electronic parts packaging structure and method of manufacturing the same
10/23/2007US7285445 Direct cooling of LEDs
10/23/2007US7285443 Stacked semiconductor module
10/23/2007US7285442 Stackable ceramic FBGA for high thermal applications
10/23/2007US7284311 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
10/18/2007WO2007116905A1 Electronic component union, electronic circuit module utilizing the same, and process for manufacturing the same
10/18/2007WO2007116894A1 Cooling device
10/18/2007WO2007116344A1 Elastically deformable integrated-circuit device
10/18/2007WO2007116342A1 Light emitting diode module
10/18/2007WO2007083244A3 Package for a light emitting diode with integrated electrostatic discharge protection
10/18/2007WO2007069198A3 Collimation arrangement and illumination system and display device using the same
10/18/2007WO2007054859A3 Miniature optical component
10/18/2007WO2007046031A3 Device comprising an element with electrodes coupled to connections
10/18/2007WO2002003422A3 Integrated circuits packaging system and method
10/18/2007US20070243706 Method of manufacturing a through electrode
10/18/2007US20070241811 Methods and Systems for Reducing Leakage Current in Semiconductor Circuits
10/18/2007US20070241434 Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device
10/18/2007US20070240754 Textured Transparent Film Having Pyramidal Patterns That Can Be Associated With Photovoltaic Cells
10/18/2007DE112005001962T5 Verfahren und Systeme zum Anbringen von Chips in gestapelten Chipbausteinen Methods and systems for mounting chips in the stacked chip modules
10/18/2007DE102006020600A1 Verfahren und Anordnung zur Positionierung von Hochleistungs-LEDs Method and apparatus for positioning of High Power LEDs
10/18/2007DE102006017059A1 Halbleiter-Bauelement-System, sowie Verfahren zum Modifizieren eines Halbleiterbauelements Semiconductor component system, as well as methods for modifying a semiconductor device
10/18/2007DE102006016529A1 Semiconductor radiation source of high power output density for hardening adhesives, coatings/sealing compounds, comprises a carrier cooled by a flow of coolant, and temperature sensors contacted with a cooling medium
10/18/2007DE102006016345A1 Halbleitermodul mit diskreten Bauelementen und Verfahren zur Herstellung desselben Of the same semiconductor module having discrete components and methods for making
10/18/2007DE102006015606A1 Halbleiter-Leuchtmittel und Leuchtpaneel mit solchen Semiconductor lighting products and light panel with such
10/18/2007DE102006000622B4 Miniaturisiertes Multi-Chip Modul und Verfahren zur Herstellung desselben A miniaturized multi-chip module and method of manufacturing the same
10/17/2007EP1845558A1 Semiconductor device
10/17/2007EP1844497A1 Semiconductor switching module
10/17/2007CN200962567Y Mitsubishi series commutation bridge
10/17/2007CN200962423Y Dual LED indicator lamp
10/17/2007CN200962422Y A LED welding tray
10/17/2007CN200962227Y Multi-layer encapsulation SIM card
10/17/2007CN101057327A IC chip, antenna, and manufacturing method of the ic chip and the antenna
10/17/2007CN101057326A 半导体器件 Semiconductor devices
10/17/2007CN101055868A Memory module, its producing method and data processing device
10/17/2007CN101055867A Semiconductor device and method for fabricating the same
10/17/2007CN101055866A Module for optical device and manufacturing method thereof
10/17/2007CN101055865A Storage card structure and its making method
10/17/2007CN101055864A Semiconductor chip encapsulation structure and its application device
10/17/2007CN101055861A Strip format of package board and array of the same
10/17/2007CN101055858A Semiconductor encapsulation structure
10/17/2007CN101055856A Connecting device for electronic component
10/17/2007CN101055845A Coated thermal interface in integrated circuit chip
10/17/2007CN101055844A Wafer construction structure with the inductance and its construction method
10/17/2007CN100344003C Light source unit
10/17/2007CN100344002C Multicolor light-emitting lamp and light source
10/17/2007CN100343992C 半导体器件 Semiconductor devices
10/17/2007CN100343989C 集成电路芯片组件 IC chip assembly
10/17/2007CN100343965C Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same
10/17/2007CN100343964C Multiple chip packaging arrangement
10/17/2007CN100343871C Electronic device, rubber product, and methods for manufacturing the same
10/16/2007US7284226 Methods and structures of providing modular integrated circuits
10/16/2007US7283313 Bulk-shaped lens, light-emitting unit, and lighting equipment
10/16/2007US7282951 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
10/16/2007US7282950 Configurable IC's with logic resources with offset connections
10/16/2007US7282853 LED lamp
10/16/2007US7282824 Press-fitting method and rectifying device having press-fitted member
10/16/2007US7282805 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
10/16/2007US7282804 Structure of high performance combo chip and processing method
10/16/2007US7282794 Multiple die stack apparatus employing t-shaped interposer elements
10/16/2007US7282793 Multiple die stack apparatus employing T-shaped interposer elements
10/16/2007US7282792 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/16/2007US7282789 Back-to-back semiconductor device assemblies
10/16/2007US7282693 Camera module for compact electronic equipments
10/16/2007US7282444 Semiconductor chip and manufacturing method for the same, and semiconductor device
10/16/2007US7282431 Single chip and stack-type chip semiconductor package and method of manufacturing the same
10/16/2007US7282397 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
10/16/2007US7282392 Method of fabricating a stacked die in die BGA package
10/16/2007US7282390 Stacked die-in-die BGA package with die having a recess
10/16/2007US7281832 Vehicular lamp
10/11/2007WO2007114224A1 Circuit module, wireless communication apparatus and circuit module manufacturing method
10/11/2007WO2007114106A1 Semiconductor device, layered type semiconductor device using the same, base substrate, and semiconductor device manufacturing method
10/11/2007WO2007025538A3 Backlighting arrangement with semiconductor light sources arranged in illumination groups and illumination device
10/11/2007WO2005117092A3 Stacked semiconductor package having adhesive/spacer structure and insulation
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