Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2014
12/02/2014US8900974 High yield substrate assembly
12/02/2014US8900933 Semiconductor module, molding apparatus, and molding method
12/02/2014US8900928 Semiconductor device and programming method
12/02/2014US8900924 Chip package and method for forming the same
12/02/2014US8900923 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/02/2014US8900922 Fine-pitch package-on-package structures and methods for forming the same
12/02/2014US8900921 Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
12/02/2014US8900531 Method for bonding plastic micro chip
12/02/2014US8899789 Lamp module
11/2014
11/28/2014DE202014104575U1 Gestapelte mikroelektronische Chips, die in einem mikroelektronischen Substrat eingebettet sind Stacked microelectronic chips, which are embedded in a microelectronic substrate
11/27/2014US20140346683 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
11/27/2014US20140346676 Semiconductor device
11/27/2014US20140346667 Semiconductor package and method of fabricating the same
11/27/2014US20140346659 Semiconductor device and method for manufacturing semiconductor device
11/27/2014US20140346516 Semiconductor memory devices and semiconductor packages
11/25/2014US8897184 System and method for wireless communication in a backplane fabric architecture
11/25/2014US8897051 Semiconductor storage device and method for producing the same
11/25/2014US8897046 DC voltage conversion module, semiconductor module, and method of making semiconductor module
11/25/2014US8897028 Circuit module
11/25/2014US8897015 Base plate
11/25/2014US8896130 Multi-chip stack structure and method for fabricating the same
11/25/2014US8896126 Packaging DRAM and SOC in an IC package
11/25/2014US8896121 Chip assembly system
11/25/2014US8896116 Microelectronic package and method of manufacturing same
11/25/2014US8896115 Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure
11/25/2014US8896109 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
11/25/2014US8896095 Semiconductor device with circuits connected to each other in contactless manner
11/25/2014US8896092 Anti-fuse element
11/25/2014US8896010 Wafer-level flip chip device packages and related methods
11/25/2014US8896000 Light-emitting element package and display device
11/25/2014US8895954 Light emitting diode package
11/25/2014US8895440 Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
11/25/2014US8895380 Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
11/25/2014US8895360 Integrated semiconductor device and wafer level method of fabricating the same
11/25/2014US8894251 Lighting device topology for reducing unevenness in LED luminance and color
11/25/2014US8894240 Illumination device
11/20/2014US20140342509 Module and Assembly with Dual DC-Links for Three-Level NPC Applications
11/20/2014US20140342502 Three-Dimensional Vertically Interconnected Structure and Fabricating Method Thereof
11/20/2014US20140342501 Package stacks and methods of manufacturing the same
11/20/2014US20140342500 Method and system for template assisted wafer bonding
11/20/2014US20140342476 Land grid array semiconductor device packages
11/20/2014US20140340890 Light emitting apparatus and method for manufacturing same
11/20/2014US20140340887 Led module and method of manufacturing the same
11/20/2014US20140339708 Semiconductor package device
11/20/2014US20140339693 Semiconductor module
11/20/2014US20140339576 Flip-chip light-emitting diode unit
11/18/2014US8890570 Switch block circuit in field programmable gate array
11/18/2014US8890568 Semiconductor integrated circuit
11/18/2014US8890567 High speed testing of integrated circuits including resistive elements
11/18/2014US8890455 Electric vehicle control device
11/18/2014US8890336 Cylindrical bonding structure and method of manufacture
11/18/2014US8890335 Semiconductor device
11/18/2014US8890334 Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device
11/18/2014US8890330 Semiconductor packages and electronic systems including the same
11/18/2014US8890329 Semiconductor device
11/18/2014US8890328 Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
11/18/2014US8890327 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
11/18/2014US8890316 Implementing decoupling devices inside a TSV DRAM stack
11/18/2014US8890314 Package configurations for low EMI circuits
11/18/2014US8890311 Power conversion device
11/18/2014US8890310 Power module package having excellent heat sink emission capability and method for manufacturing the same
11/18/2014US8890306 Light-emitting diode
11/18/2014US8890305 Semiconductor device
11/18/2014US8890303 Three-dimensional integrated circuit
11/18/2014US8890300 Discrete three-dimensional memory comprising off-die read/write-voltage generator
11/18/2014US8890299 Bonded semiconductor structures and methods of forming same
11/18/2014US8890296 Wafer level chip scale package
11/18/2014US8890286 Vertically integrated systems
11/18/2014US8890285 Vertically integrated systems
11/18/2014US8890228 Semiconductor device and method of manufacturing the same
11/18/2014US8890186 Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
11/18/2014US8890099 Radiation source and method for lithographic apparatus for device manufacture
11/18/2014US8890002 Resin multilayer substrate and method for manufacturing the resin multilayer substrate
11/18/2014US8889483 Method of manufacturing semiconductor device including filling gap between substrates with mold resin
11/18/2014US8889482 Methods to fabricate integrated circuits by assembling components
11/18/2014US8889459 Method of manufacturing light emitting device
11/18/2014US8889458 Method of converting power using a power semiconductor module
11/18/2014US8889448 Method of fabricating a light-emitting element
11/18/2014US8888324 Light-emitting device, method for assembling same and luminaire
11/13/2014US20140335657 Stack packages having fastening element and halogen-free inter-package connector
11/13/2014US20140335656 Semiconductor stack packages and methods of fabricating the same
11/13/2014US20140335655 Integrated circuit package system with mounting structure
11/13/2014US20140332982 Stacked Packages and Microelectronic Assemblies Incorporating the Same
11/13/2014US20140332980 Methods of forming 3-d circuits with integrated passive devices
11/13/2014US20140332966 Epoxy-amine underfill materials for semiconductor packages
11/13/2014US20140332948 Thermal management in 2.5 d semiconductor packaging
11/13/2014US20140332946 Semiconductor package and stacked semiconductor package having the same
11/13/2014US20140332942 Method of manufacturing semiconductor device and semiconductor device
11/13/2014US20140332842 Packaged overvoltage protection circuit for triggering thyristors
11/13/2014US20140332829 Light source module
11/13/2014US20140332770 Chip on film including different wiring pattern, flexible display device including the same, and method of manufacturing flexible display device
11/13/2014US20140332665 Photosensitive imaging devices and associated methods
11/11/2014US8887120 Timing path slack monitoring system
11/11/2014US8886696 Digital signal processing circuitry with redundancy and ability to support larger multipliers
11/11/2014US8885988 Optical module
11/11/2014US8885380 Semiconductor memory device
11/11/2014US8885356 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
11/11/2014US8885344 Semiconductor device
11/11/2014US8884650 High-frequency semiconductor switching circuit
11/11/2014US8884448 Flip chip interconnection with double post
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