Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2007
11/13/2007US7294587 Component built-in module and method for producing the same
11/13/2007US7294531 Wafer level chip stack method
11/13/2007US7294530 Method for encapsulating multiple integrated circuits
11/13/2007US7293907 Backlight for display device, light source for display device, and light emitting diode used therefor
11/13/2007CA2353496C Scalable data processing apparatus
11/08/2007WO2007127712A2 Light emitting diodes with improved light collimation
11/08/2007WO2007126720A2 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
11/08/2007WO2007125744A1 Semiconductor device with double-sided electrode structure and its manufacturing method
11/08/2007WO2007125650A1 Adhesive tape, semiconductor package, and electronic device
11/08/2007US20070258229 Method and Apparatus for Led Panel Lamp Systems
11/08/2007US20070258225 Printed circuit board and method of manufacturing printed ciruit board
11/08/2007US20070257901 Semiconductor chip for driving light emitting element, light emitting device, and lighting device
11/08/2007US20070257374 Semiconductor chip and semiconductor device
11/08/2007US20070257350 Wafer level stack structure for system-in-package and method thereof
11/08/2007US20070257344 Flip chip type LED lighting device manufacturing method
11/08/2007DE10332829B4 Halbleiterchipstapel Semiconductor chip stack
11/08/2007DE102006020869A1 Semiconductor chip stack, has chips stacked such that elevations are engaged in recesses, where chips have passage contact for electrical contacting of chip front side with chip back side, and elevations and recesses of chips are laid out
11/08/2007DE102006012739B3 Leistungstransistor und Leistungshalbleiterbauteil Power transistor and power semiconductor component
11/08/2007DE102006011995B3 Power semiconductor module, has base plate connected with substrate in material-coherent manner, and contact layer of substrate divided into segments for providing material-coherent connection with base plate
11/08/2007DE10101086B4 Leistungs-Moduleinheit Power module unit
11/07/2007EP1852913A1 Macro-component designed to be installed in a pressed stack assembly and pressed stack assembly comprising such a macro-component
11/07/2007EP1852912A1 Device and method of centring a semiconductor element designed to be inserted in a pressed stack assembly and pressed stack assembly comprising such a device
11/07/2007EP1852911A1 Semiconductor device
11/07/2007EP1852716A2 Radiation detector, radiation detector element, and radiation imaging apparatus
11/07/2007EP1851797A1 Device and method for fabricating double-sided soi wafer scale package with through via connections
11/07/2007EP1540739B1 Electromagnetic radiation sensing device with integrated housing including two superimposed sensors
11/07/2007EP1537483B1 A memory circuit comprising a non-volatile ram and a ram
11/07/2007EP0642699B1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
11/07/2007CN200972865Y Package structure of high power LED
11/07/2007CN200972860Y High power LED
11/07/2007CN200972857Y Chip sealing device of preventing adhesive spilling
11/07/2007CN101069283A Encased thermal management device and method of making such a device
11/07/2007CN101068016A Photoelectric system for realizing multi-CCD seamless paste-up
11/07/2007CN100347867C Technique of solder ball for manufacutirng LED
11/07/2007CN100347857C Power semiconductor device
11/07/2007CN100347856C Package with multiple wafers and packaging method thereof
11/07/2007CN100347849C Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
11/06/2007US7292063 Method of interconnect for multi-slot metal-mask programmable relocatable function placed in an I/O region
11/06/2007US7292062 Distribution of signals throughout a spine of an integrated circuit
11/06/2007US7291928 Electric power semiconductor device
11/06/2007US7291926 Multi-chip package structure
11/06/2007US7291924 Flip chip stacked package
11/06/2007US7291914 Power semiconductor module
11/06/2007US7291911 Semiconductor device and manufacturing method thereof
11/06/2007US7291910 Semiconductor chip assemblies, methods of making same and components for same
11/06/2007US7291906 Stack package and fabricating method thereof
11/06/2007US7291905 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device
11/06/2007US7291901 Packaging method, packaging structure and package substrate for electronic parts
11/06/2007US7291896 Voltage droop suppressing active interposer
11/01/2007WO2007024774A3 Apparatus and methods for high-density chip connectivity
11/01/2007US20070252285 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
11/01/2007US20070252264 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
11/01/2007US20070252262 Die Assembly Having Electrical Interconnect
11/01/2007CA2650053A1 Solar collector arrangement with reflecting surface
10/2007
10/31/2007EP1850384A2 Impedance matched photodetector module
10/31/2007EP1850383A1 Three wavelength light emitting diode
10/31/2007EP1849186A2 Stacked ball grid array package module utilizing one or more interposer layers
10/31/2007EP1683198B1 Semiconductor device and manufacturing method thereof
10/31/2007EP1172026B1 Electronic power module and method for making same
10/31/2007DE102007020011A1 Semiconductor lighting device for use as e.g. LCD backlight, has lighting units installed on substrate and encapsulated in translucent resin, where units with different directional characteristics are arranged adjacent to each other
10/31/2007CN200969357Y Luminous diode component
10/31/2007CN200969350Y Integrated power luminous diode package structure
10/31/2007CN200969349Y Luminous diode structure
10/31/2007CN200969348Y Package structure for luminous diode chip
10/31/2007CN200969347Y Semiconductor color changeable lighting device
10/31/2007CN101065848A Semiconductor device and rectifier arrangement
10/31/2007CN101064990A Impedance matched photodetector module
10/31/2007CN101064301A Semiconductor light-emitting equipment
10/31/2007CN101064300A Mosfet power package
10/31/2007CN101064299A Power semiconductor module in pressure contact layout
10/31/2007CN101064289A Power inverter
10/31/2007CN101064288A Leadless integrated circuit protection device
10/31/2007CN101064287A Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
10/31/2007CN100346476C Semiconductor device and mixed integrated circuit device
10/31/2007CN100346473C Millimeter band module with built-in semiconductor
10/30/2007US7289089 Light emitting unit
10/30/2007US7288837 Semiconductor device and its writing method
10/30/2007US7288795 Semiconductor light-emitting device and method for manufacturing the device
10/30/2007US7288434 Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
10/25/2007WO2007119572A1 Lighting device, image pickup apparatus and portable terminal unit
10/25/2007WO2007097664A9 Light-emitting diode device
10/25/2007WO2007075678A3 Microelectronic assemblies having very fine pitch stacking
10/25/2007US20070246835 Semiconductor device
10/25/2007DE60123178T2 Halbleiterbauelement Semiconductor device
10/25/2007DE102007013737A1 Direkte Stromabgabe in eine elektronische Baugruppe Direct current output into an electronic module
10/25/2007DE102006018874A1 Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung Circuit arrangement for coupling a voltage supply to a semiconductor device, method for manufacturing the circuit arrangement as well as data processing apparatus comprising the circuit arrangement
10/25/2007DE102006018161A1 Elektronisches Bauelementmodul Electronic component module
10/25/2007CA2650547A1 Electronic component module
10/24/2007EP1848038A2 High efficiency led package
10/24/2007EP1848037A2 Light emitting device
10/24/2007EP1848029A1 Carrying structure of electronic components
10/24/2007EP0795200B1 Mounting electronic components to a circuit board
10/24/2007CN200965890Y LED element and its device
10/24/2007CN200965887Y Ultrahigh brightness light-emitting diode
10/24/2007CN200965886Y LED light source package structure for low temperature co-fired ceramic with thermo separation design
10/24/2007CN200965882Y Multi-chip package LED
10/24/2007CN200965881Y Semiconductor encapsulation structure
10/24/2007CN200965880Y LED structure
10/24/2007CN200965879Y Led
10/24/2007CN101061583A Led array
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