H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2007
11/22/2007	WO2007133301A2 Light emitting diodes with improved light collimation
11/22/2007	WO2007132683A2 Power semiconductor module
11/22/2007	WO2007132612A1 Composite substrate and method for manufacturing same
11/22/2007	WO2007132432A2 Stacked dies and manufacturing method thereof
11/22/2007	WO2007132423A2 Assembly, chip and method of operating
11/22/2007	WO2007131967A1 Integrated low-loss capacitor-arrray structure
11/22/2007	US20070267138 Methods for Fabricating Three-Dimensional All Organic Interconnect Structures
11/22/2007	DE112005003345T5 Led-Lichtquellen für Bildprojektorsysteme Led light sources for image projector systems
11/22/2007	DE102006023168A1 Herstellungsverfahren für eine elektronische Schaltung und elektronische Schaltung in einer Package-in-Package-Ausführung Manufacturing method for an electronic circuit and electronic circuit in a package-on-package execution
11/22/2007	DE102005031836B4 Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben The semiconductor power module of the same with SiC power diode and methods for preparing
11/22/2007	DE102005027356B4 Halbleiterleistungsbauteilstapel in Flachleitertechnik mit oberflächenmontierbaren Außenkontakten und ein Verfahren zur Herstellung desselben The same semiconductor power device stack in flat-wire technology with surface-mountable external contacts and a method for producing
11/21/2007	EP1858089A2 Semiconductor optical device
11/21/2007	EP1858077A2 Heat sink electronic package having compliant pedestal
11/21/2007	EP1857729A1 Optoelectronic module and lighting device including the optoelectronic module
11/21/2007	EP1856727A2 Junction-isolated vias
11/21/2007	CN200979887Y A brightness-improving bracket structure of a SMD diode and encapsulation structure
11/21/2007	CN200979881Y A light source device of a strong power LED and lamps with such light source
11/21/2007	CN101076892A Power module, manufacturing method therefor, and air conditioner
11/21/2007	CN101075849A Multi-channel optical receiver module
11/21/2007	CN101075609A Structure and method for packing LED chip
11/21/2007	CN101075608A Luminescent device and its operation
11/21/2007	CN101075607A Surge protector for containing packed semiconductor
11/21/2007	CN101075606A Power semiconductor module
11/21/2007	CN101075605A Structure for packing light-emitting diodes, light-conducting pipe and liquid crystal display device thereof
11/21/2007	CN101075604A Structure and method for packing infrared receiving mould set and surface-adhered mould set
11/21/2007	CN101075603A Structure and method for packing videwfinding mould set
11/21/2007	CN101075596A Piled semiconductor packing structure and its production
11/21/2007	CN101075566A Packer of semiconductor and its production
11/21/2007	CN101075565A Packer of semiconductor and its production
11/21/2007	CN101075300A Card-typed circuit module and its production
11/21/2007	CN100350633C Luminous device and its producing method
11/21/2007	CN100350630C Optical semiconductor device
11/21/2007	CN100350609C Electronic control apparatus
11/21/2007	CN100350608C Multi-chip packaging body
11/21/2007	CN100350607C Semiconductor device and producing method thereof
11/21/2007	CN100350602C High performance, low cost microelectronic circuit package with interposer
11/21/2007	CN100350598C Semiconductor device having a pair of heat sinks and method for manufacturing the same
11/20/2007	US7298045 Stacked semiconductor device
11/20/2007	US7298039 Electronic circuit device
11/20/2007	US7298034 Multi-chip semiconductor connector assemblies
11/20/2007	US7298033 Stack type ball grid array package and method for manufacturing the same
11/20/2007	US7298032 Semiconductor multi-chip package and fabrication method
11/20/2007	US7298031 Multiple substrate microelectronic devices and methods of manufacture
11/20/2007	US7297985 Display device and display unit using the same
11/20/2007	US7297984 Semiconductor light-emitting device and method for manufacturing the device
11/20/2007	US7297866 Ventilated photovoltaic module frame
11/20/2007	US7297575 System semiconductor device and method of manufacturing the same
11/20/2007	US7297566 Method for producing a display unit
11/15/2007	WO2007130471A2 Systems and methods for high density multi-component modules
11/15/2007	WO2007129486A1 Semiconductor device and method for manufacturing same
11/15/2007	WO2007129458A1 Semiconductor device and semiconductor device manufacturing method
11/15/2007	WO2007054894A3 Chip assembly and method of manufacturing thereof
11/15/2007	WO2007043983A3 Reversible oxidation of carbon nanotubes
11/15/2007	US20070264751 Super High Density Module with Integrated Wafer Level Packages
11/15/2007	US20070262793 Circuit configurations having four terminal JFET devices
11/15/2007	US20070262470 Module With Built-In Semiconductor And Method For Manufacturing The Module
11/15/2007	US20070262467 Semiconductor Device Having a Chip Stack on a Rewiring Plate
11/15/2007	US20070262465 Semiconductor Device and Method of Fabricating the Same
11/15/2007	US20070262445 Stack MCP and manufacturing method thereof
11/15/2007	US20070262419 Semiconductor Device
11/15/2007	DE102007022428A1 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
11/15/2007	DE102006022748A1 Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation
11/15/2007	DE102006021959A1 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
11/15/2007	DE102006021412B3 Leistungshalbleitermodul The power semiconductor module
11/15/2007	DE102006008632B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
11/15/2007	DE10102353B4 LED-Signalmodul LED signal module
11/14/2007	EP1855319A2 Power semiconductor device
11/14/2007	EP1855318A1 Compact high performance semiconductor module with connecting device
11/14/2007	EP1855316A1 Stackable integrated circuit package
11/14/2007	EP1854153A1 Led array
11/14/2007	EP1854139A1 Module comprising radiation-emitting semiconductor bodies
11/14/2007	EP1570513A4 Microelectronic packaging and components
11/14/2007	EP0853342B1 Connecting structure between wiring board and plug member
11/14/2007	CN200976350Y Liquid insulation heat conductive material embedding module
11/14/2007	CN200976349Y LED package bracket
11/14/2007	CN101073191A Voltage regulator and method using substrate board with insulator layer and conductive traces
11/14/2007	CN101073158A Illumination assembly using circuitized strips
11/14/2007	CN101073153A Component mounting apparatus and component mounting method
11/14/2007	CN101071839A 发光装置 Light-emitting device
11/14/2007	CN101071812A Light-emitting diode packaging module
11/14/2007	CN101071811A Semiconductor device, related method and printed circuit board
11/14/2007	CN101071810A 半导体器件 Semiconductor devices
11/14/2007	CN101071809A Power semiconductor device
11/14/2007	CN101071808A Optimized wire bonding of an integrated modulator and laser diode on a mount
11/14/2007	CN101071807A Connecting module structure with passive element and its manufacturing method
11/14/2007	CN101071806A 封装结构 Package
11/14/2007	CN101071805A System-level packaging module and its preparing method
11/14/2007	CN101071798A Semiconductor packaging substrate and semiconductor package with same
11/14/2007	CN101071795A Semiconductor device of chip constitution and manufacturing method thereof
11/14/2007	CN101071781A Wafer level packaging method and its structure
11/14/2007	CN101071779A Semiconductor package stacking structure and its preparing method
11/14/2007	CN100349292C Semiconductor device and its producing method, electronic device and electronic instrument
11/14/2007	CN100349287C Method and apparatus for electronically aligning capacitively coupled chip pads
11/14/2007	CN100349255C Methods and systems for processing a substrate using a dynamic liquid meniscus
11/13/2007	US7295653 Apparatus, system, and method for optical pulse gain enhancement for high-finesse external cavity
11/13/2007	US7294961 Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
11/13/2007	US7294936 Semiconductor device
11/13/2007	US7294928 Components, methods and assemblies for stacked packages
11/13/2007	US7294922 Semiconductor device and method of manufacturing the same
11/13/2007	US7294816 LED illumination system having an intensity monitoring system

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