H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2007
12/12/2007	CN100354978C 半导体集成电路器件 The semiconductor integrated circuit device
12/12/2007	CN100354671C Integrated optical transceiver and related methods
12/11/2007	US7308588 Memory card
12/11/2007	US7307852 Printed circuit board and method for manufacturing printed circuit board
12/11/2007	US7307452 Interconnect structure enabling indirect routing in programmable logic
12/11/2007	US7307349 Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
12/11/2007	US7307340 Wafer-level electronic modules with integral connector contacts
12/11/2007	US7307331 Integrated radio front-end module with embedded circuit elements
12/11/2007	US7307285 Optical semiconductor device and a method for manufacturing the same
12/11/2007	US7307020 Membrane 3D IC fabrication
12/11/2007	US7307003 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
12/11/2007	US7306973 Method for making a semiconductor multipackage module including a processor and memory package assemblies
12/11/2007	US7306972 Semiconductor device and manufacturing method of the same
12/11/2007	US7306971 Semiconductor chip packaging method with individually placed film adhesive pieces
12/11/2007	US7306685 Mounting device and method thereof
12/06/2007	WO2007139709A2 Method of making solar cell with antireflective coating using combustion chemical vapor deposition (ccvd) and corresponding product
12/06/2007	WO2007139132A1 Semiconductor device
12/06/2007	WO2007137742A1 Method for the production of an electronic subassembly, associated subassembly, and assembly comprising at least one such subassembly
12/06/2007	WO2007120697A3 Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
12/06/2007	WO2007111507A3 Light sensor
12/06/2007	US20070281374 Chip stack package and manufacturing method thereof
12/06/2007	US20070279873 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
12/06/2007	US20070278683 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials
12/06/2007	US20070278648 Multiple die stack apparatus employing t-shaped interposer elements
12/06/2007	US20070278639 Semiconductor Device Stack and Method for Its Production
12/06/2007	DE102007025248A1 Elektronisches Bauelement, das mindestens zwei Halbleiterleistungsbauteile aufweist An electronic component having at least two semiconductor power components
12/06/2007	DE102007017733A1 Kühlmechanismus für Stapelchip-Packung und Verfahren zur Herstellung einer Stapelchip-Packung, die diesen enthält Cooling mechanism for stacking chip package and method of manufacturing a stack chip package that includes that
12/06/2007	DE102007002707A1 System-in Package-Modul System-in-package module
12/06/2007	DE102006026023A1 Semiconductor component, has plastic compound arranged between another plastic compound and edge sides of adhesive layer and chip and upper side of chip such that latter plastic compound does not have physical contact to chip and layer
12/06/2007	DE102006025453A1 Halbleiterschaltungsanordnung Semiconductor circuitry
12/06/2007	CA2648992A1 Method of making solar cell with antireflective coating using combustion chemical vapor deposition (ccvd) and corresponding product
12/05/2007	EP1863087A1 Module board
12/05/2007	EP1861878A2 Power semiconductor module
12/05/2007	EP1861876A1 Solid-state lighting device package
12/05/2007	EP1050077B1 High-density computer modules with stacked parallel-plane packaging
12/05/2007	CN200986917Y Open type semiconductor package structure
12/05/2007	CN101084578A 半导体开关模块 Semiconductor switch modules
12/05/2007	CN101083257A 半导体装置 Semiconductor device
12/05/2007	CN101083256A Semiconductor device
12/05/2007	CN101083255A Device package and methods for the fabrication and testing thereof
12/05/2007	CN101083254A Optically coupled semiconductor device and electronic device
12/05/2007	CN101083253A Paster type light emitting type and process for manufacturing the same
12/05/2007	CN101083252A 显示装置 Display device
12/05/2007	CN101083244A Semiconductor package, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
12/05/2007	CN101083241A Semiconductor device and its manufacturing method
12/05/2007	CN100353577C Manufacturing method of light-emitting device with crystal coated light emitting diode
12/05/2007	CN100353547C Multi-chip circuit module and method for producing the same
12/05/2007	CN100353546C Packing semiconductor device
12/05/2007	CN100353545C Lower profile package with power supply in package
12/05/2007	CN100353539C LSI packaging and assembly method thereof
12/04/2007	US7305647 Using standard pattern tiles and custom pattern tiles to generate a semiconductor design layout having a deep well structure for routing body-bias voltage
12/04/2007	US7305222 Radio frequency integrated circuit having reduced receiver noise levels
12/04/2007	US7304500 Programmable logic module and upgrade method thereof
12/04/2007	US7304498 Clock circuitry for programmable logic devices
12/04/2007	US7304497 Methods and apparatus for programmably powering down structured application-specific integrated circuits
12/04/2007	US7304375 Castellation wafer level packaging of integrated circuit chips
12/04/2007	US7304374 Wireless coupling of semiconductor dies
12/04/2007	US7304370 Electronic device having wiring substrate and lead frame
12/04/2007	US7303942 Semiconductor device and method for manufacturing the same
12/04/2007	US7303406 Device for controlling a vehicle
11/2007
11/29/2007	WO2007136928A2 Low profile managed memory component
11/29/2007	WO2007136917A2 Managed memory component
11/29/2007	WO2007135768A1 Semiconductor device
11/29/2007	WO2007059367A3 Multi-source ambient energy power supply for embedded devices or remote sensor or rfid networks
11/29/2007	US20070274058 Integrated Circuit, a Method and an Assembly for Manufacturing the Integrated Circuit, and a Mobile Phone Having the Integrated Circuit
11/29/2007	US20070272991 Method And Device For Alternately Contacting Two Wafers
11/29/2007	US20070272870 Radiation imaging apparatus and radiation imaging system
11/29/2007	US20070271781 High density integrated circuit apparatus, test probe and methods of use thereof
11/29/2007	DE10240730B4 Leiterplatte, Speichermodul und Herstellungsverfahren PCB, memory module and manufacturing method
11/29/2007	DE102006024147B3 Elektronisches Modul mit Halbleiterbauteilgehäuse und einem Halbleiterchip und Verfahren zur Herstellung desselben An electronic module with the semiconductor device housing and a semiconductor chip and method of manufacturing the same
11/29/2007	DE10122363B4 Halbleitermodul Semiconductor module
11/28/2007	EP1860697A2 Semiconductor device
11/28/2007	EP1860696A1 Semiconductor module
11/28/2007	EP1062539A4 Improved photovaltaic generator circuit
11/28/2007	CN200983369Y Heat radiation machine of ultra-high brightness LED
11/28/2007	CN200983363Y Led
11/28/2007	CN101079416A Light emitting unit
11/28/2007	CN101079415A LED encapsulation structure
11/28/2007	CN101079414A Module for utilizing two light emitting parts to mix into three-wave long white light and adjusting color temperature
11/28/2007	CN101079413A Semiconductor device
11/28/2007	CN101079412A System in package module
11/28/2007	CN101079404A 半导体器件 Semiconductor devices
11/28/2007	CN100352071C Light-emitting diode lamp
11/28/2007	CN100352057C Packaging base plate of improving thermolysis structure, and electronic device
11/28/2007	CN100352056C Optical device and production method thereof
11/28/2007	CN100352050C Semiconductor with multiple rows of bond pads
11/28/2007	CN100352047C Unmolded package for semiconductor device
11/28/2007	CN100352043C Flat power semiconductor device, its radiator pressure mounting method and apparatus
11/28/2007	CN100352023C Semiconductor device and method and apparatus for making same
11/27/2007	US7302181 Single lens multiple light source device
11/27/2007	US7301972 Apparatus, system, and method for frequency stabilized mode-locked laser
11/27/2007	US7301781 Semiconductor module
11/27/2007	US7301779 Electronic chip and electronic chip assembly
11/27/2007	US7301369 Programmable gate array apparatus and method for switching circuits
11/27/2007	US7301235 Semiconductor device module with flip chip devices on a common lead frame
11/27/2007	US7301214 Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
11/27/2007	US7301095 Solar cell array
11/27/2007	US7300816 Method of sensor packaging
11/27/2007	US7300182 LED light sources for image projection systems
11/27/2007	US7299546 Method for manufacturing an electronic module

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