H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2007
12/27/2007	DE102006045696B3 Electronic power module for soft-starting of motor, has conductive copper bus bars with two slots, which are arranged in parallel such that remaining parts of bus bars form partition wall between slots
12/27/2007	DE102006027481A1 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
12/26/2007	EP1870934A1 Converter module
12/26/2007	EP1870932A1 Stackable integrated circuit package and stacked package formed therefrom
12/26/2007	CN200997405Y Light-emitting diode assembly with moulded glass lens
12/26/2007	CN200997399Y Electronic power-supply module
12/26/2007	CN101095231A 半导体装置 Semiconductor device
12/26/2007	CN101095225A Semiconductor device with embedded heat spreader
12/26/2007	CN101095215A Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet
12/26/2007	CN101093849A Light emitting device having multiple light emitting elements
12/26/2007	CN101093829A Structure for packaging integration type power model light emitting diode
12/26/2007	CN101093828A Structure for packaging compact type large power light emitting diode
12/26/2007	CN101093827A Structure for packaging light emitting diode
12/26/2007	CN100358153C Display device and its manufacturing method
12/26/2007	CN100358118C Semiconductor device and method of manufacturing the same
12/26/2007	CN100358103C Semiconductor device and multi-layer substrate used for the same semiconductor device
12/25/2007	US7312927 Head-up display
12/25/2007	US7312822 Attachment of additional information to stored or streamed image
12/25/2007	US7312633 Programmable routing structures providing shorter timing delays for input/output signals
12/25/2007	US7312630 Configurable integrated circuit with built-in turns
12/25/2007	US7312534 Interlayer dielectric and pre-applied die attach adhesive materials
12/25/2007	US7312517 System-in-package type semiconductor device
12/25/2007	US7312505 Semiconductor substrate with interconnections and embedded circuit elements
12/25/2007	US7312109 Methods for fabricating fuse programmable three dimensional integrated circuits
12/25/2007	US7312105 Leadframe of a leadless flip-chip package and method for manufacturing the same
12/25/2007	US7311242 Design of an insulated cavity
12/21/2007	WO2007146307A2 Stack die packages
12/21/2007	WO2007145086A1 Semiconductor device, signal transmitter and signal transmission method
12/20/2007	US20070292990 Semiconductor multi-package module having wire bond interconnect between stacked packages
12/20/2007	US20070291503 Light-Emitting Diode Arrangement for a High-Power Ligth-Emitting Diode and Method for Producing a Light-Emitting Diode Arrangement
12/20/2007	US20070290383 Method for producing a lens mold
12/20/2007	US20070290320 Carrier for stacked type semiconductor device and method of fabricating the same
12/20/2007	US20070290318 Multi-chip package structure
12/20/2007	US20070290317 Semiconductor device having a multi-layered semiconductor substrate
12/20/2007	US20070289772 Electronic Circuit
12/20/2007	DE102006012446B3 Speichermodul mit einem Mittel zur Kühlung, Verfahren zur Herstellung des Speichermoduls mit einem Mittel zur Kühlung sowie Datenverarbeitungsgerät umfassend ein Speichermodul mit einem Mittel zur Kühlung Memory module with a means for cooling, process for the preparation of the memory module with a means for cooling as well as data processing apparatus comprising a memory module with a means for cooling
12/20/2007	DE102005030465B4 Halbleiterstapelblock mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor stacking block with semiconductor chips and processes for making
12/19/2007	EP1868245A2 Semiconductor device and method of manufacturing semiconductor device
12/19/2007	EP1868244A1 Semiconductor device
12/19/2007	EP1868243A1 High-performance semi-conductor module with opposing electrically insulated terminals
12/19/2007	EP1868242A2 Power semiconductor module and fabrication method thereof
12/19/2007	CN200993968Y Structure improvement of light-emitting diode
12/19/2007	CN200993962Y Improved optical-sensing packaging module
12/19/2007	CN101091243A Single mask via method and device
12/19/2007	CN101090144A Technology for package of high power luminous element and its structure
12/19/2007	CN101090110A White light LED
12/19/2007	CN101090109A Power semiconductor module with connection elements electrically insulated from one another
12/19/2007	CN101090108A Composite semiconductor device and method of manufacturing the same
12/19/2007	CN101090107A Package structure of crystal particle and manufacturing method thereof
12/19/2007	CN101090080A Package method for multi-chip stack and its package structure
12/19/2007	CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure
12/19/2007	CN100356822C 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/19/2007	CN100356601C Thermoelectric modular packing
12/19/2007	CN100356600C 热电模块 Thermoelectric Modules
12/19/2007	CN100356597C Multi-light-path synthesized semiconductor light emitter
12/19/2007	CN100356591C A light-emitting diode
12/19/2007	CN100356565C Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system
12/19/2007	CN100356533C Central welding pad memory body stacking encapsulating assembly and encapsulating process thereof
12/19/2007	CN100356510C Semiconductor device and manufacturing method for the same
12/18/2007	US7310004 Apparatus and method of interconnecting nanoscale programmable logic array clusters
12/18/2007	US7309913 Stacked semiconductor packages
12/18/2007	US7309831 Protective sheet for solar battery module, method of fabricating the same and solar battery module
12/18/2007	US7309624 Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame
12/18/2007	US7309623 Method of fabricating a stacked die in die BGA package
12/18/2007	US7308756 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
12/13/2007	WO2007142052A1 Semiconductor package, its manufacturing method, semiconductor device, and electronic device
12/13/2007	WO2007142038A1 Semiconductor device
12/13/2007	WO2007090227A9 Pixel array and tile for a video display
12/13/2007	WO2007085035A3 Ferrous component
12/13/2007	WO2007041155A3 Microelectronic package having multiple conductive paths through an opening in a support substrate
12/13/2007	US20070287230 Electronic device and production method thereof
12/13/2007	US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
12/13/2007	US20070284716 Assembly Having Stacked Die Mounted On Substrate
12/13/2007	US20070284588 Follicle stimulating hormone supreagonists
12/13/2007	US20070284576 Semiconductor circuit arrangement and associated method for temperature detection
12/13/2007	US20070284563 Light emitting device including rgb light emitting diodes and phosphor
12/13/2007	DE202007014336U1 Integrierter Bildschaltkreis Integrated circuit image
12/13/2007	DE102007001191A1 Halbleitervorrichtung mit einem Widerstand zum Abgleichen der Stromverteilung A semiconductor device with a resistor for adjusting the current distribution
12/13/2007	DE102004031623B4 Leistungs-Halbleitermodul mit federndem Anschlusskontakt Power semiconductor module with spring terminal contact
12/12/2007	EP1864326A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls
12/12/2007	EP1741325B1 Cooling and mounting plate with fixation means for electronic components
12/12/2007	EP1498013B1 Flexible interconnect structures for electrical devices and light sources incorporating the same
12/12/2007	EP1104025B1 Semiconductor device
12/12/2007	EP1030369B1 Multichip module structure and method for manufacturing the same
12/12/2007	EP0935818B1 Electronic control apparatus
12/12/2007	CN200990388Y Illuminating components
12/12/2007	CN200990387Y Large power LED chip package structure and large power LED illuminating device
12/12/2007	CN200990377Y Lateral illuminating LED improved structure
12/12/2007	CN200990376Y Lateral illuminated LED structure
12/12/2007	CN101088177A Process for manufacturing a light emitting array
12/12/2007	CN101088162A Packaging for electronic modules
12/12/2007	CN101088161A Semiconductor chip mounting structure and method for manufacturing same
12/12/2007	CN101088160A Arrangement of a semiconductor module and an electrical busbar
12/12/2007	CN101088140A Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
12/12/2007	CN101086986A Optical coupling element and electric device
12/12/2007	CN101086985A Block water cooling power semiconductor part
12/12/2007	CN101086984A 半导体装置 Semiconductor device
12/12/2007	CN101086952A Wafer package body and crystal circle processing method for making wafer with rubber layer
12/12/2007	CN100355071C Mixed analog and digital inegrated circits
12/12/2007	CN100355070C High power semiconductor module

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