| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/16/2008 | CN101106094A Built-in wafer encapsulation structure and its making process |
| 01/16/2008 | CN100362639C Semiconductor packer and production for godown chip |
| 01/16/2008 | CN100362617C Forming folded-stack packaged device using progressive folding tool |
| 01/15/2008 | US7319598 Electronic component with a housing package |
| 01/15/2008 | US7319268 Semiconductor device having capacitors for reducing power source noise |
| 01/15/2008 | US7319241 Surface emitting device, manufacturing method thereof and projection display device using the same |
| 01/15/2008 | US7319049 Method of manufacturing an electronic parts packaging structure |
| 01/15/2008 | CA2320798C Advanced active devices and methods for molecular biological analysis and diagnostics |
| 01/10/2008 | WO2008005586A2 Flipped, stacked-chip ic packaging for high bandwidth data transfer buses |
| 01/10/2008 | US20080009098 Structure of high performance combo chip and processing method |
| 01/10/2008 | US20080006943 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 01/10/2008 | US20080006920 Multi-chip semiconductor connector assemblies |
| 01/10/2008 | DE112005002855T5 LED vom integrierten Typ und Herstellungsverfahren derselben LED integrated type and manufacturing method thereof |
| 01/09/2008 | EP1876653A2 Sub-mount for mounting light emitting device and light emitting device package |
| 01/09/2008 | EP1876646A2 LED lighting unit |
| 01/09/2008 | EP1876645A2 High power AllnGaN based multi-chip light emitting diode |
| 01/09/2008 | EP1876644A2 Semiconductor device and manufacturing method of same |
| 01/09/2008 | EP1875519A2 Flexible led array |
| 01/09/2008 | EP1875503A2 Structure for stacking an integrated circuit on another integrated circuit |
| 01/09/2008 | EP1776722B1 High performance led lamp system |
| 01/09/2008 | EP1564819B1 Light emitting diode |
| 01/09/2008 | CN201004469Y A high-power LED |
| 01/09/2008 | CN201004468Y LED improvement |
| 01/09/2008 | CN201004467Y A white light luminescent device |
| 01/09/2008 | CN201004460Y A LED lamp based on COA technology |
| 01/09/2008 | CN101103656A Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/09/2008 | CN101101944A Sub-mount for mounting light emitting device and light emitting device package |
| 01/09/2008 | CN101101910A LED module |
| 01/09/2008 | CN101101909A Semiconductor device and method of manufacturing the same |
| 01/09/2008 | CN101101908A LED module |
| 01/09/2008 | CN101101898A Bottom substrate of package on package and manufacturing method thereof |
| 01/09/2008 | CN101101884A Semiconductor device with stacked chips and method for manufacturing thereof |
| 01/09/2008 | CN100361319C Manufacturing method of lead frame and optical coupling device using this lead frame |
| 01/09/2008 | CN100361301C Multi-chip semiconductor package and mfg. method thereof |
| 01/09/2008 | CN100361293C Exposed active element base module with embedded passive element |
| 01/09/2008 | CN100361289C Method of forming a raised contact for a substrate |
| 01/08/2008 | US7317621 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 01/08/2008 | US7317332 Interconnection and input/output resources for programmable logic integrated circuit devices |
| 01/08/2008 | US7317251 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components |
| 01/08/2008 | US7317244 Semiconductor device and manufacturing method thereof |
| 01/08/2008 | US7317243 Encapsulated lead having step configuration |
| 01/08/2008 | US7317241 Semiconductor apparatus having a large-size bus connection |
| 01/08/2008 | US7317210 Organic light emitting diode, method for the production thereof and uses thereof |
| 01/08/2008 | US7317199 Circuit device |
| 01/08/2008 | US7316060 System for populating a circuit board with semiconductor chips |
| 01/08/2008 | CA2443149C Semiconductor device and method of manufacturing the same |
| 01/03/2008 | WO2008002836A2 Stacked, interconnected semiconductor packages |
| 01/03/2008 | WO2008001641A1 Interconnect substrate and electronic circuit mounted structure |
| 01/03/2008 | WO2007126720A3 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 01/03/2008 | WO2007061667A3 Volatile memory elements with elevated power supply levels for programmable logic device integrated circuits |
| 01/03/2008 | US20080003712 Methods of making semiconductor fuses |
| 01/03/2008 | US20080002813 Apparatus system, and method for high flux, compact compton x-ray source |
| 01/03/2008 | US20080001309 Semiconductor Device, Wiring Board, And Manufacturing Method Thereof |
| 01/03/2008 | US20080001164 Flip chip type LED lighting device manufacturing method |
| 01/03/2008 | US20080001163 LED lamp |
| 01/03/2008 | DE102006028314A1 LED arrangement e.g. LED array, for e.g. signal lamp of motor vehicle, has right and left connecting leads extending by openings of blinding foil, where blinding foil is coated with polyester lamination |
| 01/03/2008 | DE102006013078B4 Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung Compact power semiconductor module with connector |
| 01/02/2008 | EP1873923A1 High frequency module |
| 01/02/2008 | EP1873830A2 Power amplifier module |
| 01/02/2008 | EP1873826A2 Electronic component module |
| 01/02/2008 | EP1508157A4 High efficiency solid-state light source and methods of use and manufacture |
| 01/02/2008 | EP1149419B1 Multi-chip module for use in high-power applications |
| 01/02/2008 | CN201000888Y LED solar energy photovoltaic component |
| 01/02/2008 | CN201000887Y Rectifier diode naked crystal structure on radiation fin |
| 01/02/2008 | CN200999996Y Lighting lamp strips |
| 01/02/2008 | CN200999989Y Structure improved luminous diode lamp |
| 01/02/2008 | CN101098589A Semiconductor device with passive component |
| 01/02/2008 | CN101097982A Packaging structure for luminescent device |
| 01/02/2008 | CN101097932A Low noise thin type photoelectric sensor and manufacturing method therefor |
| 01/02/2008 | CN101097911A Organic light-emitting diode display device and method of fabricating the same |
| 01/02/2008 | CN101097910A Organic electroluminescent display device and manufacturing method |
| 01/02/2008 | CN101097909A Light emitting diode packaging structure and method capable of increasing luminous efficiency |
| 01/02/2008 | CN101097908A 半导体装置 Semiconductor device |
| 01/02/2008 | CN101097907A Organic light emitting device and manufacturing method thereof |
| 01/02/2008 | CN101097906A Stack package with vertically formed heat sink |
| 01/02/2008 | CN101097905A Semiconductor and manufacturing method thereof |
| 01/02/2008 | CN101097904A Packaging structure for reducing warping |
| 01/02/2008 | CN101097873A Organic electro-luminescence display device and method for fabricating the same |
| 01/02/2008 | CN100359708C Luminous device and illuminator |
| 01/02/2008 | CN100359687C Optical coupling semiconductor device and its mfg. method |
| 01/02/2008 | CN100359686C Thin and small outer shape package combined by metal oxide semiconductor field effect transistor and schottky diode |
| 01/02/2008 | CN100359682C Thin electronic label and method for making same |
| 01/01/2008 | US7315455 Surface-mounted electronic component module and method for manufacturing the same |
| 01/01/2008 | US7315201 Methods and systems for reducing leakage current in semiconductor circuits |
| 01/01/2008 | US7315083 Circuit device and manufacturing method thereof |
| 01/01/2008 | US7315046 Semiconductor light-emitting device and method for manufacturing the device |
| 01/01/2008 | US7314818 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 12/27/2007 | WO2007149819A2 Three-dimensional wafer-level integrated circuit assembly |
| 12/27/2007 | WO2007148782A1 Resin-sealed semiconductor device, method for manufacturing the same, base for semiconductor device, and multilayer resin-sealed semiconductor device |
| 12/27/2007 | WO2007148466A1 Electronic component module |
| 12/27/2007 | WO2007148398A1 Resin-sealed module, optical module and method of resin sealing |
| 12/27/2007 | WO2007148154A1 Stackable ic package with top and bottom interconnect |
| 12/27/2007 | WO2007130471A3 Systems and methods for high density multi-component modules |
| 12/27/2007 | US20070300202 Compact standard cell |
| 12/27/2007 | US20070297108 Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection |
| 12/27/2007 | DE4425389B4 Gleichrichteranordnung sowie Verfahren zur Herstellung einer elektrisch und thermisch leitenden Verbindung und Anordnung zur Durchführung des Verfahrens Rectifier arrangement and methods for making an electrically and thermally conductive connection and arrangement for performing the method |
| 12/27/2007 | DE202007014910U1 Packungsaufbau eines LED-Chips mit hoher Lichtausbeute in seitlicher Richtung Package structure of an LED chip with high light output in the lateral direction |
| 12/27/2007 | DE202007011535U1 LED-Platine LED board |
| 12/27/2007 | DE19755675B4 Halbleitergehäuse und Verfahren zu dessen Herstellung Semiconductor package and method for its production |
| 12/27/2007 | DE10294771B4 Leistungshalbleitermodul The power semiconductor module |