| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/31/2008 | US20080023825 Multi-die DC-DC Boost Power Converter with Efficient Packaging |
| 01/31/2008 | US20080023718 Led lamp |
| 01/31/2008 | DE102007021042A1 Leuchtdiodenmodul für Lichtquellenreihe Light emitting diode module for light source series |
| 01/31/2008 | DE102006044525B3 Method for production of integrated circuit, involves continuous making of flexible substrate having conductive strip structure, where flexible integrated circuit is connected with conductive strip structure of flexible substrate |
| 01/31/2008 | DE102006034679A1 Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben The same semiconductor module with a power semiconductor die and passive component as well as methods for preparing |
| 01/30/2008 | EP1883108A2 Assembly with a high performance semiconductor element and a contact device |
| 01/30/2008 | EP1882908A2 Reflective sensor |
| 01/30/2008 | CN201014273Y LED sun lamp integrating package |
| 01/30/2008 | CN101115351A Electronic components packaging structure |
| 01/30/2008 | CN101114684A SMD light-emitting diode packaging structure |
| 01/30/2008 | CN101114642A Power semiconductor module as H - bridge circuit and method for producing the same |
| 01/30/2008 | CN101114641A Assembly with a high performance semiconductor element and a contact device |
| 01/30/2008 | CN101114640A Semiconductor device |
| 01/30/2008 | CN101114639A 集成电路模块 IC module |
| 01/30/2008 | CN101114638A Stack type semiconductor packaging structure containing flexible circuit board |
| 01/30/2008 | CN101114637A Semiconductor component packaging structure |
| 01/30/2008 | CN101114636A Light-mixing luminous element |
| 01/30/2008 | CN101114635A Multi-chip packaging structure and packaging method |
| 01/30/2008 | CN101114623A Packaging module and electronic device |
| 01/30/2008 | CN100366130C Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 01/30/2008 | CN100365832C Luminous device and lighting device |
| 01/30/2008 | CN100365814C Back-to-back packaging integrated circuit and its producing method |
| 01/30/2008 | CN100365813C Stacking packaging structure for light sensitive chips and semiconductor chips |
| 01/30/2008 | CN100365760C Method for manufacturing semiconductor device, semeconductor device and electronic product |
| 01/29/2008 | US7323904 Look-up table |
| 01/29/2008 | US7323786 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 01/29/2008 | US7323770 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/29/2008 | US7323767 Standoffs for centralizing internals in packaging process |
| 01/29/2008 | US7322531 Electronic device and method of manufacturing the same |
| 01/29/2008 | US7322239 Semiconductor device and manufacturing method thereof |
| 01/29/2008 | CA2210833C Method of wire bonding an integrated circuit to an ultraflexible substrate |
| 01/24/2008 | WO2008010555A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 01/24/2008 | WO2008010261A1 Substrate structure, and mobile terminal |
| 01/24/2008 | WO2008009524A1 Electronic arrangement |
| 01/24/2008 | US20080020513 Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
| 01/24/2008 | US20080017973 Semiconductor device and manufacturing method therefor |
| 01/24/2008 | DE102007032275A1 Verbundanordnung, die mehrere Vorrichtungen eingliedert, die unterschiedliche Lichtwellenlängen verwenden, und Verfahren zum Herstellen derselben A composite assembly, which incorporates a plurality of devices that use different wavelengths of light and methods of making the same |
| 01/24/2008 | DE102006033228A1 Heat-dissipating device manufacture for memory, involves integrally forming protrusions on one side of metal plate and flat portion on the other side of the metal plate |
| 01/24/2008 | DE102005006995B4 Halbleiterbauteil mit Kunstoffgehäuse und Außenanschlüssen sowie Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing and external terminals and methods for preparing |
| 01/23/2008 | EP1881530A1 Power semiconductor apparatus |
| 01/23/2008 | EP1880419A1 Method of assembling semiconductor devices with leds |
| 01/23/2008 | CN201011657Y Three-phase commutating bridge flat packaging power module |
| 01/23/2008 | CN201011656Y One-way controlled bridge arm type flat packaging power module |
| 01/23/2008 | CN101110462A Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 01/23/2008 | CN101110438A Structure of image sensor module and a method for manufacturing of wafer level package |
| 01/23/2008 | CN101110416A Reflective sensor |
| 01/23/2008 | CN101110415A Uninsulated double tower type diode |
| 01/23/2008 | CN101110414A Chip stack with a higher power chip on the outside of the stack |
| 01/23/2008 | CN101110413A Semiconductor apparatus |
| 01/23/2008 | CN101110412A A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same |
| 01/23/2008 | CN101110411A Semiconductor package and its manufacturing method |
| 01/23/2008 | CN101110410A Power semiconductor device |
| 01/23/2008 | CN101110409A System packaging package |
| 01/23/2008 | CN101110408A Light emitting diode module group |
| 01/23/2008 | CN101110407A Light emitting diode module group |
| 01/23/2008 | CN101110406A Multiple chip packaging structure and its packaging method |
| 01/23/2008 | CN101110404A Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/23/2008 | CN101110401A Interconnect structure for semiconductor package |
| 01/23/2008 | CN101110374A Module and method of manufacturing the same |
| 01/23/2008 | CN101110293A Micro power converter and method of manufacturing same |
| 01/23/2008 | CN100364092C Semiconductor device and its producing method |
| 01/23/2008 | CN100364091C Semiconductor device and its producing method |
| 01/23/2008 | CN100364090C Light-thin laminated packaged semiconductor device and manufacturing process thereof |
| 01/23/2008 | CN100364088C Receptacle for a programmable, electronic processing device |
| 01/23/2008 | CN100364087C Semiconductor device and its mfg. method, circuidboard, electronic device and apparatus for mfg. semiconductor device |
| 01/23/2008 | CN100364072C Motor drive device with power semiconductor module life testing function |
| 01/22/2008 | US7321497 Electronic circuit apparatus and method for stacking electronic circuit units |
| 01/22/2008 | US7321165 Semiconductor device and its manufacturing method |
| 01/22/2008 | US7321163 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 01/22/2008 | US7321137 RGB light emitting diode package with improved color mixing properties |
| 01/22/2008 | US7320928 Method of forming a stacked device filler |
| 01/22/2008 | US7320902 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
| 01/22/2008 | US7320632 Method of producing a lamp |
| 01/22/2008 | CA2334287C Data storage and processing apparatus, and method for fabricating the same |
| 01/17/2008 | WO2008007617A1 Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same |
| 01/17/2008 | WO2008007008A2 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 01/17/2008 | WO2007015169A3 A self-display rfid tag device with a display unit or bluetooth technology to send / receive data |
| 01/17/2008 | US20080013284 Heat radiation device for memory module |
| 01/17/2008 | US20080011508 Electronic parts packaging structure and method of manufacturing the same |
| 01/17/2008 | DE10319538B4 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 01/17/2008 | DE10261009B4 Halbleiterchip-Stapelpackung und Leiterrahmen hierfür Semiconductor chip stack package and lead frame for this |
| 01/17/2008 | DE102006032441A1 Device has printed circuit board, module which comprising electro-technical element and mechanically loadable electrical contact element on side, and module is electrically connected on side |
| 01/17/2008 | DE102006032436A1 Device for arrangement of electronic element on printed circuit board, has support element, electro-technical element, which is arranged on support element, and cover that is provided with electro-technical element for support element |
| 01/17/2008 | DE102006031589A1 Lamp e.g. incandescent lamp, has semiconductor layer structure with lower surface directly attached on conductive paths, and metal layer attached on surface opposite to lower surface and connected with one of paths over bond contacts |
| 01/17/2008 | DE102006031405A1 Halbleitermodul mit Schaltfunktionen und Verfahren zur Herstellung desselben The same semiconductor module with switching functions and processes for preparing |
| 01/17/2008 | DE102006020243B3 Leistungshalbleitermodul als H-Brückenschaltung und Verfahren zur Herstellung desselben The power semiconductor module of the same as an H-bridge circuit and methods for making |
| 01/17/2008 | DE10019812B4 Schaltungsanordnung Circuitry |
| 01/16/2008 | EP1879228A1 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket |
| 01/16/2008 | EP1878060A2 Ultra and very-high efficiency solar cells |
| 01/16/2008 | EP1878052A1 Rgb thermal isolation substrate |
| 01/16/2008 | EP1878050A1 Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip |
| 01/16/2008 | EP1878049A2 Multi-chip module and method of manufacture |
| 01/16/2008 | EP1878048A2 Multi-chip module and method of manufacture |
| 01/16/2008 | EP1419535B1 Multicolor light-emitting lamp and light source |
| 01/16/2008 | CN201007992Y Light emitting diode packaging structure |
| 01/16/2008 | CN101107710A Semiconductor device and its manufacturing method |
| 01/16/2008 | CN101106169A LED encapsulation structure and its making method |
| 01/16/2008 | CN101106126A Semiconductor module and heat radiating plate |
| 01/16/2008 | CN101106125A Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly |
| 01/16/2008 | CN101106124A Direct insertion LED and its making method |