| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/20/2008 | CN101127346A LED lamp source assembly structure |
| 02/20/2008 | CN101127344A Integrated circuit (IC) package and stacking IC packages device and manufacture method |
| 02/20/2008 | CN100370632C Light emitting device and fabrication method thereof and light emitting system using the same |
| 02/20/2008 | CN100370612C 半导体装置 Semiconductor device |
| 02/20/2008 | CN100370611C Electronic assembly stacking structure |
| 02/20/2008 | CN100370610C Luminous diode light source structure |
| 02/20/2008 | CN100370606C Semiconductor device and its producing method |
| 02/20/2008 | CN100370595C Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 02/19/2008 | US7334206 Cell builder for different layer stacks |
| 02/19/2008 | US7332861 Light-emitting structures |
| 02/19/2008 | US7332820 Stacked die in die BGA package |
| 02/19/2008 | US7332819 Stacked die in die BGA package |
| 02/19/2008 | US7332803 Circuit device |
| 02/19/2008 | US7332800 Semiconductor device |
| 02/19/2008 | US7332784 Method of providing an optoelectronic element with a non-protruding lens |
| 02/19/2008 | US7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
| 02/19/2008 | CA2348146C Electronic power device |
| 02/14/2008 | WO2008019392A2 Target marker having quantum cascade laser for thermally marking a target |
| 02/14/2008 | WO2008018524A1 Semiconductor device and its manufacturing method |
| 02/14/2008 | WO2008018332A1 Semiconductor device |
| 02/14/2008 | WO2008018058A1 Inverted pyramid multi-die package reducing wire sweep and weakening torques |
| 02/14/2008 | WO2008018002A2 Illumination device with wavelength converting element side holding heat sink |
| 02/14/2008 | WO2008017207A1 A light emitting diode circuit having a plurality of critical voltages and a light emitting diode device |
| 02/14/2008 | WO2008002836A3 Stacked, interconnected semiconductor packages |
| 02/14/2008 | WO2007149819A3 Three-dimensional wafer-level integrated circuit assembly |
| 02/14/2008 | US20080036096 Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages |
| 02/14/2008 | US20080036068 Stacked Module Systems and Methods |
| 02/14/2008 | US20080036059 Method for producing a module with components stacked one above another |
| 02/14/2008 | US20080035947 Surface Mount Light Emitting Chip Package |
| 02/14/2008 | US20080035938 Thermally coupled light source for an image projection system |
| 02/14/2008 | DE10360573B4 Leistungshalbleitermodul The power semiconductor module |
| 02/14/2008 | DE102006037691A1 Moldgehäuse in Einpresstechnik In press-fit molded housing |
| 02/14/2008 | DE102006037512A1 Stacked module of semiconductor chips has elastic spheres, for movement, compressed between the layers by fasteners in a compact structure |
| 02/13/2008 | EP1886343A2 Lead free solar cell contacts |
| 02/13/2008 | CN201022077Y Silicon underling plane LED integration chip |
| 02/13/2008 | CN201022076Y LED structure |
| 02/13/2008 | CN201021769Y Multi-color LED light string and its LED part |
| 02/13/2008 | CN101124675A Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 02/13/2008 | CN101124674A Electronic component module |
| 02/13/2008 | CN101123286A LED encapsulation structure and method |
| 02/13/2008 | CN101123249A Semiconductor device and its production method |
| 02/13/2008 | CN101123248A Semiconductor package having improved thermal performance |
| 02/13/2008 | CN101123247A LED encapsulation structure |
| 02/13/2008 | CN101123246A Chip interconnection structure and system |
| 02/13/2008 | CN100369536C Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips |
| 02/13/2008 | CN100369532C Module and method of manufacturing module |
| 02/13/2008 | CN100369249C Semiconductor device and method of manufacturing the same, electronic device, electronic instrument |
| 02/13/2008 | CN100369248C Stack MCP and manufacturing method thereof |
| 02/13/2008 | CN100369240C Crystal wafer assembling structure |
| 02/13/2008 | CN100368818C Test module and test method in use for electrical erasable memory built in chip |
| 02/12/2008 | USRE40061 Multi-chip stacked devices |
| 02/12/2008 | US7330368 Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections |
| 02/12/2008 | US7329957 Circuit device and manufacturing method thereof |
| 02/12/2008 | US7329895 Dual wavelength detector |
| 02/07/2008 | WO2008016900A1 Led mosaic |
| 02/07/2008 | WO2008015759A1 Film adhesive, adhesive sheet, and semiconductor device using the same |
| 02/07/2008 | WO2008005586A3 Flipped, stacked-chip ic packaging for high bandwidth data transfer buses |
| 02/07/2008 | WO2003021680A3 Power semiconductor module |
| 02/07/2008 | US20080032449 Stacked Die in Die BGA Package |
| 02/07/2008 | US20080031420 X-ray transmissive optical mirror apparatus |
| 02/07/2008 | US20080030133 Light-emitting structures |
| 02/07/2008 | US20080029760 Interfused nanocrystals and method of preparing the same |
| 02/07/2008 | DE102005055761B4 Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack in a bridge circuit and methods for making |
| 02/07/2008 | DE102004047306B4 Leistungs-Halbleiterbauteil mit mehreren Bauteilkomponenten Power semiconductor component with a plurality of structural components |
| 02/07/2008 | DE10008203B4 Verfahren zum Herstellen elektronischer Halbleiterbauelemente A method for producing electronic semiconductor devices |
| 02/06/2008 | EP1885168A1 Circuit substrate connection structure and circuit substrate connection method |
| 02/06/2008 | EP1642334B1 Electronic power module comprising a rubber seal and corresponding production method |
| 02/06/2008 | CN201017901Y Packaging structure of LED |
| 02/06/2008 | CN201017883Y Flaw memory packaging structure |
| 02/06/2008 | CN201017882Y Programming all-colour LED lamp string |
| 02/06/2008 | CN201017881Y Illuminating diode apparatus having protection function |
| 02/06/2008 | CN201017880Y Semi-conductor packaging body stacking structure |
| 02/06/2008 | CN201017879Y Chip assembling body and chip packaging body |
| 02/06/2008 | CN201017878Y Luminous diode having over temperature and overcurrent protection structure |
| 02/06/2008 | CN201016447Y Tone/temperature changeable LED plate lamp |
| 02/06/2008 | CN101120449A Light-emitting structures |
| 02/06/2008 | CN101120446A Semiconductor module and device |
| 02/06/2008 | CN101120445A Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 02/06/2008 | CN101120438A Semiconductor device manufacturing method and semiconductor device |
| 02/06/2008 | CN101118989A Light emitting diode and circuit module assembly |
| 02/06/2008 | CN101118939A Luminous element packaging device |
| 02/06/2008 | CN101118920A High voltage light emitting diode circuit having multistage threshold voltage and diode luminous device |
| 02/06/2008 | CN101118902A Packed integrated circuit of system and packing method thereof |
| 02/06/2008 | CN101118901A Stack type chip packaging structure, chip packaging structure and manufacture process |
| 02/06/2008 | CN101118900A Light emitting diode packaging structure |
| 02/06/2008 | CN100367584C Opto-electronic device integration |
| 02/06/2008 | CN100367499C 芯片装置 Chip device |
| 02/06/2008 | CN100367498C Illuminating device |
| 02/06/2008 | CN100367452C Semiconductor device and its manufacturing method |
| 02/05/2008 | US7327590 Memory module and memory system |
| 02/05/2008 | US7327028 Embedded heat spreader for folded stacked chip-scale package |
| 02/05/2008 | US7327020 Multi-chip package including at least one semiconductor device enclosed therein |
| 02/05/2008 | US7326960 Semiconductor circuit constructions |
| 02/05/2008 | CA2373368C Semiconductor radiation emitter package |
| 01/31/2008 | WO2007102871A3 Chip-spacer integrated radio frequency id tags, methods of making same, and systems containing same |
| 01/31/2008 | WO2007088267A3 Light emission device with chromatic control |
| 01/31/2008 | US20080028477 Chip with Power Supply Device |
| 01/31/2008 | US20080026506 Semiconductor multi-chip package and fabrication method |
| 01/31/2008 | US20080023848 Semiconductor device and its wiring method |
| 01/31/2008 | US20080023847 Semiconductor device and its wiring method |