| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/05/2008 | CN101135431A LED lamp based on COA technology |
| 03/05/2008 | CN100373617C Paired transistor and manufacturing method thereof |
| 03/05/2008 | CN100373616C Semiconductor device and method of manufacturing the same |
| 03/05/2008 | CN100373615C Mould set structure with multiple package and fins |
| 03/05/2008 | CN100373614C Packing structure of multichip |
| 03/05/2008 | CN100373605C Electronic component packaging structure and method for producing the same |
| 03/05/2008 | CN100373604C High power MCM package |
| 03/04/2008 | US7340121 Optoelectric composite substrate and method of manufacturing the same |
| 03/04/2008 | US7339264 Semiconductor chip with external connecting terminal |
| 03/04/2008 | US7339257 Semiconductor device in which semiconductor chip is mounted on lead frame |
| 03/04/2008 | US7339197 Light emitting diode and fabrication method thereof |
| 02/28/2008 | WO2008022901A2 Process for the collective manufacturing of electronic 3d modules |
| 02/28/2008 | WO2008022463A1 Integrated circuit with digitally switched components to drive an output to which is connected a load |
| 02/28/2008 | WO2007132423A3 Assembly, chip and method of operating |
| 02/28/2008 | US20080050906 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/28/2008 | US20080048320 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/28/2008 | US20080048307 Module and Mounted Structure Using the Same |
| 02/28/2008 | US20080048299 Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly |
| 02/28/2008 | DE102006038541A1 Semiconductor component e.g. insulated gate bipolar transistor, arrangement, has semiconductor bodies of components of one type attached to common carrier, and semiconductor bodies of components of another type, attached to another carrier |
| 02/28/2008 | DE102006028719A1 Halbleiterbauteil mit Halbleiterchipstapel und Verbindungselementen sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising semiconductor chip stack, and connecting elements and processes for producing the semiconductor device |
| 02/28/2008 | CA2661516A1 Solar charged mobile working stations |
| 02/27/2008 | EP1892773A1 Light emitting element mounting board, light emitting module and lighting equipment |
| 02/27/2008 | EP1892764A1 Light-emitting device having light-emitting elements |
| 02/27/2008 | EP1892761A2 Low inductivity power semiconductor module for current driven high power circuits |
| 02/27/2008 | EP1892760A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 02/27/2008 | EP1891689A2 Flexible display device |
| 02/27/2008 | EP1891673A2 Photodiode with integrated semiconductor circuit and method for the production thereof |
| 02/27/2008 | CN201029096Y Light emitting diode device and packaging structure used for packaging the same |
| 02/27/2008 | CN201029094Y Domain improved structure of SMD light emitting diode bracket |
| 02/27/2008 | CN201028414Y Water-proof festival lantern with detachable lampshade |
| 02/27/2008 | CN101133493A Stacked semiconductor device and its manufacturing method |
| 02/27/2008 | CN101132169A Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
| 02/27/2008 | CN101132039A Improvement of LED radiating structure |
| 02/27/2008 | CN101132038A Seat structure of LED |
| 02/27/2008 | CN101131997A Image sensor and fabricating method thereof |
| 02/27/2008 | CN101131996A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131995A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131994A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131993A Packaging structure of conducting wire holder on multi-chip stacking structure |
| 02/27/2008 | CN101131992A Multi-chip stacking type packaging structure |
| 02/27/2008 | CN101131991A Thickness reduced multi-chip stacking and packaging construction |
| 02/27/2008 | CN101131990A Stacked chip packaging construction |
| 02/27/2008 | CN101131986A Method for manufacturing lead frame structure, semiconductor device and flip device |
| 02/27/2008 | CN101131983A Connector and light transmitting receiving module |
| 02/27/2008 | CN101131947A Spatial packaging structure and method of manufacturing the same |
| 02/27/2008 | CN101131942A Packaging method for LED with rare color of LED homogeneous light |
| 02/27/2008 | CN101131800A Display device, flexible member, and method thereof |
| 02/27/2008 | CN101131455A LSI package provided with interface module and method of mounting the same |
| 02/27/2008 | CN100372102C Multiple die interconnect system |
| 02/26/2008 | USRE40112 Semiconductor package and method for fabricating the same |
| 02/26/2008 | US7336808 Optical sensor |
| 02/26/2008 | US7336495 Power component cooling device with a heat sink and one or more cooling fins |
| 02/26/2008 | US7335994 Semiconductor component having multiple stacked dice |
| 02/26/2008 | US7335993 Multi chip package |
| 02/26/2008 | US7335975 Integrated circuit stacking system and method |
| 02/26/2008 | US7335973 Adhesive of folder package |
| 02/26/2008 | US7335970 Semiconductor device having a chip-size package |
| 02/26/2008 | US7335926 Package structure for light emitting diode and method thereof |
| 02/26/2008 | US7335592 Wafer level package, multi-package stack, and method of manufacturing the same |
| 02/26/2008 | US7335582 Component |
| 02/26/2008 | US7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
| 02/26/2008 | US7335532 Method of assembly for multi-flip chip on lead frame on overmolded IC package |
| 02/26/2008 | US7335529 Manufacturing method of a semiconductor device utilizing a flexible adhesive tape |
| 02/26/2008 | US7335523 Process for manufacturing a light-emitting device |
| 02/26/2008 | US7335522 Package structure for light emitting diode and method thereof |
| 02/26/2008 | US7335517 Multichip semiconductor device, chip therefor and method of formation thereof |
| 02/26/2008 | US7334476 Acceleration sensor chip package |
| 02/21/2008 | WO2008021575A2 Microelectronic package |
| 02/21/2008 | WO2007118831A3 Electronic component module |
| 02/21/2008 | WO2006087065A3 Power semiconductor assembly |
| 02/21/2008 | US20080044950 Multi-layer fin wiring interposer fabrication process |
| 02/21/2008 | US20080044944 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 02/21/2008 | US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 02/21/2008 | US20080043441 Electronic module |
| 02/21/2008 | US20080042501 Thermal transfer container for semiconductor component |
| 02/21/2008 | US20080042274 Components, methods and assemblies for stacked packages |
| 02/21/2008 | US20080042253 Stack type ball grid array package and method for manufacturing the same |
| 02/21/2008 | US20080042252 Stackable ceramic fbga for high thermal applications |
| 02/21/2008 | US20080042046 Physical quantity detection device, method of driving physical quantity detection device, and imaging apparatus |
| 02/21/2008 | US20080041517 Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film |
| 02/21/2008 | DE202007015174U1 Verpackungsstruktur von LED-Chips The packaging structure of LED chips |
| 02/21/2008 | DE10250538B4 Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung Electronic component as a multi-chip module and method of producing the |
| 02/21/2008 | DE102007037543A1 Gehäuse für eine integrierte Schaltung mit einer Wärmeabgabeeinheit und Verfahren zu dessen Herstellung Package for an integrated circuit having a heat dissipation unit and process for its preparation |
| 02/21/2008 | DE102006038552A1 Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls Lighting module and method of manufacturing a illumination module |
| 02/21/2008 | DE102006038479A1 Mehrfach-Leistungshalbleiterbauelement Multiple power semiconductor component |
| 02/21/2008 | DE102006037538A1 Elektronisches Bauteil bzw. Bauteilstapel und Verfahren zum Herstellen eines Bauteils Electronic component or component stack and method for manufacturing a component |
| 02/20/2008 | EP1890332A2 Illumination module and method for manufacturing an illumination module |
| 02/20/2008 | EP1889292A1 Integrated circuit package having stacked integrated circuits and method therefor |
| 02/20/2008 | EP1888688A1 Thermally conductive polyamide-based components used in light emitting diode reflector applications |
| 02/20/2008 | EP1888679A1 Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| 02/20/2008 | CN201025619Y LED diffusion lighting module |
| 02/20/2008 | CN201025336Y Side radiation LED |
| 02/20/2008 | CN101128942A Led阵列 Led Array |
| 02/20/2008 | CN101128932A Module comprising radiation-emitting semiconductor bodies |
| 02/20/2008 | CN101128075A Lighting device |
| 02/20/2008 | CN101127381A Encapsulation method of LED astigmatism body and encapsulation structure of LED astigmatism body |
| 02/20/2008 | CN101127350A Apparatus, system and method for use in mounting electronic elements |
| 02/20/2008 | CN101127349A Plastic overmolded packages with mechanically decoupled lid attach attachment |
| 02/20/2008 | CN101127348A Plastic overmolded packages with molded lid attachments |
| 02/20/2008 | CN101127347A Semiconductor device and method of manufacturing the same |