Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2008
03/19/2008EP1901353A2 Integrated passive devices with high Q inductors
03/19/2008EP1901085A1 GNSS Receiver IC package
03/19/2008EP1900018A2 Method of manufacturing an assembly and assembly
03/19/2008EP1493187A4 Lighting device and method
03/19/2008EP1410447A4 Extendible drain members for grounding rfi/emi shielding
03/19/2008CN201039255Y LED mobile phone flashing device
03/19/2008CN201038988Y A single-channel module power device and module power circuit
03/19/2008CN201038185Y LED with optical refraction and scattering medium
03/19/2008CN201038160Y Large power rectifying bridge device
03/19/2008CN201038159Y Light emitting diode module substrate with heat-conductive efficiency
03/19/2008CN101147249A 电子部件安装方法和电子电路装置 Electronic component mounting method and an electronic circuit device
03/19/2008CN101145592A High heat dispersion light emitting diode device
03/19/2008CN101145559A System-in-package type static random access memory device and manufacturing method thereof
03/19/2008CN101145558A Stackable semi-conductor package structure and manufacture method thereof
03/19/2008CN101145557A Stack type semiconductor packaging structure
03/19/2008CN101145556A System-in-package structure
03/19/2008CN101145555A Stack type semiconductor packaging structure
03/19/2008CN101145553A Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same
03/19/2008CN101145531A Solid package structure and manufacture method thereof
03/19/2008CN101145147A Three-dimensional multiprocessor system chip
03/19/2008CN100376127C Heating element radiating structure
03/19/2008CN100376029C Semiconductor package device and method for fabricating the same
03/19/2008CN100376028C Electronic module
03/19/2008CN100376022C Method for packing semiconductor device on printing circuit board and the printing circuit board
03/18/2008US7346876 ASIC having dense mask-programmable portion and related system development method
03/18/2008US7345508 Programmable logic device having a programmable selector circuit
03/18/2008US7345507 Multi-product die configurable as two or more programmable integrated circuits of different logic capacities
03/18/2008US7345363 Semiconductor device with a rewiring level and method for producing the same
03/18/2008US7345361 Stackable integrated circuit packaging
03/18/2008US7345320 Light emitting apparatus
03/18/2008US7345278 Infrared ray detection device, method of fabricating the same and infrared ray camera
03/18/2008US7344971 Manufacturing method of semiconductor device
03/18/2008US7344969 Stacked die in die BGA package
03/18/2008US7344264 Frightening apparatus
03/13/2008US20080064183 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
03/13/2008US20080062680 Lighting device with leds
03/13/2008US20080061659 Alternating current generator with improved frame structure
03/13/2008US20080061641 Vehicle alternator with improved end cover structure
03/13/2008US20080061640 Vehicle alternator with improved operation reliability
03/13/2008US20080061410 Electronic Device having wiring substrate and lead frame
03/13/2008DE102007037894A1 Halbleiterbauelement und Herstellungsverfahren A semiconductor device and manufacturing method
03/13/2008DE102007034305A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
03/13/2008DE102006040820A1 Electronic power package for e.g. diode, has two non-planar insulating substrates connected in connection regions, so that mechanical separation between substrates is controlled by number, arrangement, design and material of regions
03/13/2008DE102006037118B3 Halbleiterschaltmodul für Bordnetze mit mehreren Halbleiterchips, Verwendung eines solchen Halbleiterschaltmoduls und Verfahren zur Herstellung desselben Of the same semiconductor switching module for vehicle electrical systems with several semiconductor chips, use of such a semiconductor switching module and process for preparing
03/12/2008EP1898473A1 Package structure of semiconductor light-emitting device
03/12/2008EP1898467A2 Semiconductor illuminant and illumination panel with such
03/12/2008EP1898465A2 Power semiconductor module
03/12/2008EP1898463A1 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME
03/12/2008EP1898462A2 Semiconductor apparatus
03/12/2008EP1897140A1 Packaging logic and memory integrated circuits
03/12/2008EP1524705B1 Flip chip type LED lighting device and its manufacturing method
03/12/2008CN101142678A Module board
03/12/2008CN101140966A Semi-conductor light source device
03/12/2008CN101140958A Small power modularize solar cell component
03/12/2008CN101140926A Stacked dual mosfet package
03/12/2008CN101140925A Semiconductor chip packaging structure
03/12/2008CN101140917A Power semiconductor apparatus and circuit module using the same
03/12/2008CN100375330C Multichip module
03/12/2008CN100375274C Circuit device and its manufacturing method
03/12/2008CN100375273C Semiconductor device and method of manufacturing the same
03/12/2008CN100375250C Composition for removing sidewall residues
03/12/2008CN100375198C Semiconductor device equiped with memory and logical chips for testing memory ships
03/11/2008US7342803 Printed circuit board and method of manufacturing printed circuit board
03/11/2008US7342440 Current regulator having a transistor and a measuring resistor
03/11/2008US7342422 Semiconductor device having super junction structure and method for manufacturing the same
03/11/2008US7342415 Configurable IC with interconnect circuits that also perform storage operations
03/11/2008US7342414 Fast router and hardware-assisted fast routing method
03/11/2008US7342320 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly
03/11/2008US7342310 Multi-chip package with high-speed serial communications between semiconductor die
03/11/2008US7342307 Semiconductor device
03/11/2008US7342262 Split-gate power module for suppressing oscillation therein
03/11/2008US7342248 Semiconductor device and interposer
03/11/2008US7341938 Single mask via method and device
03/11/2008US7341919 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
03/11/2008US7341894 Semiconductor, electrooptic apparatus and electronic apparatus
03/11/2008US7341890 Circuit board with built-in electronic component and method for manufacturing the same
03/11/2008US7341764 Gas for plasma reaction, process for producing the same, and use
03/06/2008WO2008027746A2 Metal core foldover packages structures, systems including the same and methods of fabrication
03/06/2008WO2008026485A1 Electric power converter
03/06/2008WO2008026388A1 Multi-chip type semiconductor device
03/06/2008WO2008025889A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
03/06/2008WO2008025625A1 Luminous module
03/06/2008WO2007146307A3 Stack die packages
03/06/2008US20080055872 Printed circuit board and method for manufacturing printed circuit board
03/06/2008US20080054459 Low fabrication cost, fine pitch and high reliability solder bump
03/06/2008DE10316355C5 Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung Power semiconductor module with flexible outer pin assignment
03/05/2008EP1895602A2 Illumination apparatus having a plurality of semiconductor light-emitting devices
03/05/2008EP1895590A1 Passive component and electronic component module
03/05/2008EP1894237A1 Electronic module assembly with heat spreader
03/05/2008CN201032707Y 400Hz inverse power supply control module
03/05/2008CN101138089A Stacked type semiconductor device and method for fabricating the same
03/05/2008CN101138088A Structure and method for mounting bare chip
03/05/2008CN101138087A Mounting body and method for manufacturing same
03/05/2008CN101136399A Illumination apparatus
03/05/2008CN101136398A Polycrystal pieces packaging structure
03/05/2008CN101136397A Electronic part module and method of making the same
03/05/2008CN101136396A Power electronic packing member including two pieces of substrate with multiple semiconductor chips and electronic elements
03/05/2008CN101136395A Power electronic packing member including two pieces of substrate with multiple electronic elements
03/05/2008CN101136394A Multiple chip semi-conductor packaging structure and encapsulation method
03/05/2008CN101136381A Passive component and electronic component module
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