| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/03/2008 | WO2008018002A3 Illumination device with wavelength converting element side holding heat sink |
| 04/03/2008 | US20080081400 Device transfer method and display apparatus |
| 04/03/2008 | US20080079100 Fingerprint Sensor and Interconnect |
| 04/03/2008 | US20080078935 Imaging apparatus |
| 04/03/2008 | DE10334761B4 Elektronische Schaltungsvorrichtung An electronic circuit device |
| 04/03/2008 | DE10229182B4 Verfahren zur Herstellung einer gestapelten Chip-Packung A process for producing a stacked chip package |
| 04/03/2008 | DE102007044684A1 Kompakte Hochintensitäts LED basierte Lichtquelle und Verfahren zum Herstellen derselben Compact, high-intensity LED based light source and method of making same |
| 04/03/2008 | DE102006046770A1 Module for producing assembly from module and other compound component, has multiple markers with code reading by read device for co-ordinate axis of co-ordinate system assigned to marker |
| 04/03/2008 | DE102006044836A1 Shielding unit and heat dissipation unit combined module, has shielding unit provided on principal surface of high frequency chip, by bond and comprising welding contact, where shielding unit is arranged in vicinity of chip |
| 04/03/2008 | DE102005019278B4 LED-Lampeneinheit LED lamp unit |
| 04/03/2008 | DE102004008208B4 Leistungshalbleitermodul The power semiconductor module |
| 04/03/2008 | DE10123758B4 Multi-Chip-Modul mit mehreren integrierten Halbleiterschaltungen Multi-chip module having a plurality of semiconductor integrated circuits |
| 04/02/2008 | EP1906452A1 Semiconductor device and method for manufacturing same |
| 04/02/2008 | EP1906436A2 Semiconductor-embedded substrate and manufacturing method thereof |
| 04/02/2008 | EP1905102A1 Light emitting device for ac power operation |
| 04/02/2008 | CN201044238Y Rapid recovery great current rectifier diode module |
| 04/02/2008 | CN201044237Y Light emitting diode |
| 04/02/2008 | CN101156237A Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board used for such electronic device |
| 04/02/2008 | CN101154656A Multi-chip light emitting diode module group structure and method of producing the same |
| 04/02/2008 | CN101154655A Circuit board arrangement and method for producing a circuit board arrangement |
| 04/02/2008 | CN101154654A Semiconductor device, semiconductor integrated circuit and bump resistance measurement method |
| 04/02/2008 | CN101154653A Leistungshalbleitermodul |
| 04/02/2008 | CN101154652A Stack package and method for manufacturing the same |
| 04/02/2008 | CN101154651A Plane structure of LED illuminating device |
| 04/02/2008 | CN101154650A Semi-conductor packaging structure and producing method thereof |
| 04/02/2008 | CN101154607A Unmolded package for a semiconductor device |
| 04/02/2008 | CN100379044C Generation method of whitelight source, whitelight luminous element and its manufacturing method |
| 04/02/2008 | CN100379041C LED illumination light source |
| 04/02/2008 | CN100379034C LED module with high-efficient radiation |
| 04/02/2008 | CN100378993C Stereo-stacking packaging structure |
| 04/02/2008 | CN100378992C Semiconductor package and manufacturing method thereof |
| 04/02/2008 | CN100378945C Three dimensional IC device and alignment methods of ic device substrates |
| 04/02/2008 | CN100378939C Semiconductor device, method for producing the same, circuit board, and electronic apparatus |
| 04/01/2008 | US7353486 Data processing in digital systems |
| 04/01/2008 | US7353481 Computer implemented method for designing a semiconductor integrated circuit and a semiconductor integrated circuit |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7352127 LED lamp with light-emitting junction arranged in three-dimensional array |
| 04/01/2008 | US7352070 Polymer encapsulated electrical devices |
| 04/01/2008 | US7352054 Semiconductor device having conducting portion of upper and lower conductive layers |
| 04/01/2008 | US7352052 Semiconductor device and manufacturing method therefor |
| 04/01/2008 | US7351356 ultraviolet radiation blue excitable green phosphor comprising eurpium-doped alkaline earth metal oxynitride host lattices; light sources; light emitting diodes |
| 04/01/2008 | CA2177276C Method for fabricating self-assembling microstructures |
| 03/27/2008 | WO2008035650A1 Socket, module board, and inspection system using the module board |
| 03/27/2008 | US20080074852 Elimination of RDL using tape base flip chip on flex for die stacking |
| 03/27/2008 | US20080073436 Memory Card |
| 03/27/2008 | US20080073024 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 03/27/2008 | US20080072389 Illuminated electric toothbrushes and methods of use |
| 03/27/2008 | DE202007015105U1 Verpackungsstruktur von LED-Chips mit hoher Lichtemissionsleistung The packaging structure of LED chips having high light emission power |
| 03/27/2008 | DE10318847B4 Verfahren zur Herstellung einer integrierten Schaltung mit zwei Schaltungsteilen A method of fabricating an integrated circuit having two circuit parts |
| 03/27/2008 | DE102007002839A1 Leuchtaggregat mit mehreren LED-Bauelementen und Verfahren zu seiner Herstellung Lighting unit having a plurality of LED components and process for its preparation |
| 03/27/2008 | DE102006045094A1 Chip-to-chip connections manufacturing method for three dimensional-integration of individual chip-to-chip stack, involves attaching adhesive material on joint contacts, where adhesive material has recesses in pattern of connection model |
| 03/27/2008 | DE102006043785A1 Elektronische Baugruppe Electronic assembly |
| 03/27/2008 | DE102006042775B3 Schaltungsmodul und Verfahren zur Herstellung eines Schaltungsmoduls A circuit module and method of manufacturing a circuit module |
| 03/27/2008 | DE102006040838A1 Electronic power package for high power electronic device, has two non-planar insulating substrates with high thermal conductivity with electrical conductivity layers which are separated and isolated from each other |
| 03/27/2008 | DE102006039975A1 Niederinduktives Leistungshalbleitermodul für stromeingeprägte Leistungsschaltungen Niederinduktives power semiconductor module for power-embossed power circuits |
| 03/27/2008 | DE10200399B4 Verfahren zur Erzeugung einer dreidimensional integrierten Halbleitervorrichtung und dreidimensional integrierte Halbleitervorrichtung Method for producing a three-dimensional integrated semiconductor device and three-dimensionally integrated semiconductor device |
| 03/26/2008 | EP1903607A2 LED module with RGB LED chips |
| 03/26/2008 | EP1903606A2 Stackable tier structure comprising an IC die and a high density feedthrough structure |
| 03/26/2008 | EP1384266B1 Arrangement comprising at least two different electronic semiconductor circuits |
| 03/26/2008 | CN201041808Y White lighting device |
| 03/26/2008 | CN201041335Y Luminous diode with heat-irradiation device |
| 03/26/2008 | CN101151741A Flexible led array |
| 03/26/2008 | CN101150124A Encapsulation structure and electronic device using this encapsulation structure |
| 03/26/2008 | CN101150123A Semiconductor encapsulation structure with electromagnetic shielding cover |
| 03/26/2008 | CN101150122A Semiconductor encapsulation structure with electromagnetic shielding function |
| 03/26/2008 | CN101150121A Flexible circuits having improved reliability and thermal dissipation |
| 03/26/2008 | CN101150120A Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring |
| 03/26/2008 | CN101150119A Stacked semiconductor package and method of manufacturing the same |
| 03/26/2008 | CN101150118A 半导体装置 Semiconductor device |
| 03/26/2008 | CN101150117A Semiconductor encapsulation structure and its making process |
| 03/26/2008 | CN101150105A Semiconductor device and method of manufacturing the same |
| 03/26/2008 | CN101150098A 半导体器件 Semiconductor devices |
| 03/26/2008 | CN101150081A Solid encapsulation structure and its making method |
| 03/26/2008 | CN101150078A Making method for semiconductor device and semiconductor device |
| 03/26/2008 | CN101149964A Semiconductor memory device |
| 03/26/2008 | CN101149818A Semiconductor device |
| 03/26/2008 | CN100377367C Solar cell module and manufacturing method therefor |
| 03/26/2008 | CN100377351C Integrated circuit and layered lead frame package |
| 03/26/2008 | CN100377350C Semiconductor device |
| 03/26/2008 | CN100376918C Light-beam switching/adjusting apparatus and manufacturing method thereof |
| 03/25/2008 | US7348837 Point diffusion signal distribution with minimized power consumption and signal skew |
| 03/25/2008 | US7348798 Programmable logic device, configuration apparatus, and configuration method |
| 03/25/2008 | US7348668 Semiconductor device and method of manufacturing the same |
| 03/25/2008 | US7348493 Metal-ceramic circuit board |
| 03/25/2008 | US7348217 Method and structure for interfacing electronic devices |
| 03/25/2008 | US7348213 Method for forming component mounting hole in semiconductor substrate |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/25/2008 | US7347603 Light-emitting diode |
| 03/20/2008 | WO2008031633A1 Modular microelectronic system |
| 03/20/2008 | WO2008031372A1 Power semiconductor module comprising an explosion protection system |
| 03/20/2008 | WO2008031370A1 Power semiconductor module for energy distribution, comprising an explosion protection system |
| 03/20/2008 | US20080070400 Semiconductor device and manufacturing method thereof |
| 03/20/2008 | US20080070346 Structure of high performance combo chip and processing method |
| 03/20/2008 | US20080070345 Structure of high performance combo chip and processing method |
| 03/20/2008 | US20080067675 Castellation wafer level packaging of integrated circuit chips |
| 03/20/2008 | US20080067662 Modularized Die Stacking System and Method |
| 03/20/2008 | US20080067642 Packaged microelectronic components |
| 03/20/2008 | US20080067536 Image display device and light emission device |
| 03/20/2008 | US20080067527 Photo-radiation source |
| 03/20/2008 | DE102004004880B4 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen sowie integrierter Schaltungschip und integriertes Schaltungsgehäuse Connection method to directly connected stacked integrated circuits and integrated circuit chip and integrated circuit package |