Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2014
12/11/2014US20140363922 Method for creating a 3d stacked multichip module
12/11/2014US20140362628 Modular multiple converter comprising reverse conductive power semiconductor switches
12/11/2014US20140361441 Stack packages and methods of manufacturing the same
12/11/2014US20140361424 Semiconductor device
12/11/2014US20140361423 Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
12/11/2014US20140361318 Light emitting device provided with lens for controlling light distribution characteristic
12/11/2014US20140361200 Opto-Electronic Modules, In Particular Flash Modules, and Method For Manufacturing The Same
12/11/2014US20140360554 Method of producing two or more thin-film-based interconnected photovoltaic cells
12/10/2014CN204011469U 发光二极管封装及照明装置 LED packaging and lighting equipment
12/10/2014CN204011421U 智能功率模块保护装置 Intelligent Power Module Protection
12/10/2014CN204011420U 集成电路mcm-3d封装结构 IC mcm-3d package
12/10/2014CN204011419U 具线圈驱动功能的半导体封装结构 Semiconductor package structure with coil drive functions
12/10/2014CN204011418U 一种设有正装倒置芯片的led灯丝 One kind of dress features inverted chip led filament
12/10/2014CN204011417U 一种通用的折弯型led支架及其封装产品 A common stand and bend type led packages
12/10/2014CN204011416U 一种通用的高杯型led支架及其封装产品 A common stand tall cup led product and its packaging
12/10/2014CN204011415U 发光二极管 Led
12/10/2014CN204011414U 具有热沉结构的led钨丝灯支架 Tungsten has led heat sink structure of the stent
12/10/2014CN204011413U 塑封超薄型桥式整流器 Ultra-thin plastic bridge rectifier
12/10/2014CN204011392U 汽车、igbt模块及其底板组件 Car, igbt module and backplane assemblies
12/10/2014CN204005329U 共极式led发光装置 Total pole led light-emitting device
12/10/2014CN104205657A 链路辐射控制 Link Radiation Control
12/10/2014CN104205375A 包括发光器件和波长转换材料的光学腔 A light emitting device comprising an optical cavity and the wavelength conversion material
12/10/2014CN104205331A 具有通电功能的堆叠式集成部件装置 Stacked integrated components of the device has powered functions
12/10/2014CN104205330A 电力用半导体模块以及电力变换装置 The power semiconductor module and power converting apparatus
12/10/2014CN104205328A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN104204652A 用于伸展的引线框架构的预旋转的重叠模制双向发散透镜 Overmolded bi diverging lens for the pre-rotation configuration of a lead frame extending
12/10/2014CN104201271A Led灯丝 Led filament
12/10/2014CN104201173A 发光器件封装和照明系统 Light emitting device package and a lighting system
12/10/2014CN104201169A 一种存储器模块和处理模块 A memory module and processing module
12/10/2014CN104201168A 一种芯片倾斜堆叠的圆片级封装单元及封装方法 A chip tilt unit stacked wafer level packaging and packaging methods
12/10/2014CN104201162A 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统 Semiconductor device and manufacturing method, the millimeter-wave dielectric transmission device and its manufacturing method, and a millimeter-wave dielectric transmission system within the electrical
12/10/2014CN102790513B 电源模块和电源模块的封装方法 Encapsulation method of power module and power module
12/10/2014CN102543968B 三维立体堆叠芯片封装结构 Three-dimensional stacked chip package structure
12/10/2014CN102522393B 封装器件及封装多个集成电路的组件 Packaged device assembly and packaging a plurality of integrated circuits
12/10/2014CN102484109B 电力变换装置 Power conversion means
12/10/2014CN102324422B 发光二极管模块与采用此发光二极管模块的显示器 This module uses light-emitting diodes and light-emitting diode display module
12/10/2014CN102246299B 用于制作通路互连的方法 The method for making the interconnection path
12/10/2014CN102142404B 半导体器件和通信方法 Semiconductor device and communication method
12/10/2014CN102097391B 功率半导体模块 Power Semiconductor Modules
12/10/2014CN101996894B 半导体器件和围绕管芯周边形成坝材料以减小翘曲的方法 Semiconductor device and method of forming a dam around the periphery of the die to reduce the warpage of the material
12/09/2014US8908411 Semiconductor device
12/09/2014US8908345 Semiconductor device
12/09/2014US8907720 Capacitive switch, apparatus for transceiving signal, and manufacturing method thereof
12/09/2014US8907500 Multi-die wirebond packages with elongated windows
12/09/2014US8907499 Three dimensional structure memory
12/09/2014US8907498 Semiconductor device and method of forming a shielding layer between stacked semiconductor die
12/09/2014US8907481 Stack of semiconductor structures and corresponding manufacturing method
12/09/2014US8907477 Unit for semiconductor device and semiconductor device
12/09/2014US8907471 Window interposed die packaging
12/09/2014US8907468 Semiconductor device
12/09/2014US8907466 Stackable molded microelectronic packages
12/09/2014US8907463 Semiconductor device including stacked semiconductor chips
12/09/2014US8907462 Integrated circuit package
12/09/2014US8907459 Three-dimensional semiconductor integrated circuit device and method of fabricating the same
12/09/2014US8907457 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
12/09/2014US8907451 Semiconductor chip and semiconductor apparatus with embedded capacitor
12/09/2014US8907368 Double collimator LED color mixing system
12/09/2014US8907364 LED package comprising encapsulation
12/09/2014US8907362 Light-emitting dies incorporating wavelength-conversion materials and related methods
12/09/2014US8907206 Multi-junction solar cell devices
12/09/2014US8906800 Stacked digital/RF system-on-chip with integral isolation layer
12/09/2014US8906781 Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same
12/09/2014US8906744 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
12/09/2014US8906740 Integrated circuit packaging system having dual sided connection and method of manufacture thereof
12/09/2014US8905789 Electronic device package box having a base unit and a cover unit with electronic components
12/09/2014US8905772 Stretchable and foldable electronic devices
12/04/2014US20140357021 Multi-chip module with stacked face-down connected dies
12/04/2014US20140353847 Semiconductor package
12/04/2014US20140353846 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
12/04/2014US20140353824 Package-on-package structure
12/04/2014US20140353815 Semiconductor die assemblies and semiconductor devices including same
12/04/2014US20140353766 Small Footprint Semiconductor Package
12/04/2014US20140353710 Method for Producing Optoelectronic Semiconductor Components, Leadframe Assemblage and Optoelectronic Semiconductor Component
12/02/2014US8902589 Semiconductor module and cooler
12/02/2014US8902382 Light emitting diode element, light source device, surface light source illumination device, and liquid crystal display device
12/02/2014US8902123 Semiconductor device with wireless communication
12/02/2014US8901962 Programmable logic device structure using third dimensional memory
12/02/2014US8901961 Placement, rebuffering and routing structure for PLD interface
12/02/2014US8901956 Configuration context switcher
12/02/2014US8901810 Transparent OLED device with high intensity
12/02/2014US8901751 Semiconductor device, electronic device, and semiconductor device manufacturing method
12/02/2014US8901750 Semiconductor package including multiple chips and separate groups of leads
12/02/2014US8901749 Semiconductor packages and electronic systems including the same
12/02/2014US8901736 Strength of micro-bump joints
12/02/2014US8901735 Connector design for packaging integrated circuits
12/02/2014US8901728 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
12/02/2014US8901727 Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
12/02/2014US8901726 Package on package structure and method of manufacturing the same
12/02/2014US8901724 Semiconductor package with embedded die and its methods of fabrication
12/02/2014US8901718 Semiconductor package and manufacturing method thereof
12/02/2014US8901602 Power semiconductor device and power conversion system using the device
12/02/2014US8901596 Lighting device and method for manufacturing the same
12/02/2014US8901585 Multiple component solid state white light
12/02/2014US8901583 Surface mount device thin package
12/02/2014US8901582 Light-emitting device
12/02/2014US8901581 Semiconductor light emitting device having multi-cell array and manufacturing method thereof, light emitting module, and illumination apparatus
12/02/2014US8901580 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
12/02/2014US8901578 LED module having LED chips as light source
12/02/2014US8900994 Method for producing a protective structure
12/02/2014US8900993 Semiconductor device sealed in a resin section and method for manufacturing the same
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ... 409