| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/23/2008 | EP1913631A2 3d ic method and device |
| 04/23/2008 | EP1041633B1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 04/23/2008 | CN201051500Y Display encapsulation semiconductor surge protection part |
| 04/23/2008 | CN201051499Y A no shell LED point array module |
| 04/23/2008 | CN201051495Y Alternation encapsulation structure for communication module |
| 04/23/2008 | CN101167186A Power semiconductor module |
| 04/23/2008 | CN101165926A Optical coupling type semiconductor device, method for producing optical coupling type semiconductor device, and electronic device |
| 04/23/2008 | CN101165894A Chip package for image sensor and method of manufacturing the same |
| 04/23/2008 | CN101165893A Semiconductor light receiver module |
| 04/23/2008 | CN101165892A Method for power block |
| 04/23/2008 | CN101165891A Package structure coated with asymmetric single-side pin lower wafer |
| 04/23/2008 | CN101165890A Semiconductor package structure and manufacture method thereof |
| 04/23/2008 | CN100383986C Multichip led package with in-package quantitative and spectral sensing capability and digital signal output |
| 04/23/2008 | CN100383968C Stacked semiconductor memory device |
| 04/23/2008 | CN100383967C Optical semiconductor element and electronic device using the optical semiconductor element |
| 04/23/2008 | CN100383965C Semiconductor device and method of fabricating the same |
| 04/23/2008 | CN100383937C Method for manfacturing semiconductor chip, semiconductor device manufacturing method, semiconductor chip and semiconductor device |
| 04/23/2008 | CN100383936C Three-dimensional device fabrication method |
| 04/22/2008 | US7362576 Radio frequency module |
| 04/22/2008 | US7362135 Apparatus and method for clock skew adjustment in a programmable logic fabric |
| 04/22/2008 | US7361944 Electrical device with a plurality of thin-film device layers |
| 04/22/2008 | US7361881 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 04/22/2008 | US7360925 LED light source assembly |
| 04/17/2008 | WO2008045422A2 Edge connect wafer level stacking |
| 04/17/2008 | WO2008045416A1 High temperature, high voltage sic void-less electronic package |
| 04/17/2008 | WO2008043324A1 Led semiconductor element, and use thereof |
| 04/17/2008 | WO2008043264A1 Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| 04/17/2008 | WO2008027709A3 Microelectronic device having interconnects and conductive backplanes |
| 04/17/2008 | US20080090335 Circuit module and manufacturing method thereof |
| 04/17/2008 | US20080090330 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 04/17/2008 | US20080088034 Semiconductor device and method for manufacturing the same |
| 04/17/2008 | US20080088002 Chip package structure |
| 04/17/2008 | US20080087989 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 04/17/2008 | US20080087980 Semiconductor device and method for fabricating a semiconductor device |
| 04/17/2008 | US20080087898 High-heat-resistant semiconductor device |
| 04/17/2008 | DE112005003273T5 Eingebetteter Wärmeverteiler Embedded heat spreader |
| 04/17/2008 | DE102007044446A1 Flexible Schaltkreise mit verbesserter Zuverlässigkeit und Wärmedissipation Flexible circuits with improved reliability and heat dissipation |
| 04/17/2008 | DE102007038320A1 Vorrichtung, System und Verfahren zur Verwendung bei der Montage elektronischer Elemente Apparatus, system and method for use in the assembly of electronic elements |
| 04/17/2008 | DE102006049476A1 Semiconductor chip for use in semiconductor chip stack, has solder material applied on front side in form of solder balls on plugs and intermediate spaces between balls are filled with concrete joint sealing compound on semiconductor wafer |
| 04/17/2008 | DE102006048592A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 04/17/2008 | DE102006048230A1 Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung Light-emitting system, and method for producing such a backlighting |
| 04/17/2008 | DE102006017059B4 Halbleiter-Bauelement-System, sowie Verfahren zum Modifizieren eines Halbleiterbauelements Semiconductor component system, as well as methods for modifying a semiconductor device |
| 04/16/2008 | EP1449263B1 Optoelectronic component |
| 04/16/2008 | CN201047510Y High power light-emitting diode lamp and luminous diode element thereof |
| 04/16/2008 | CN101162745A High-efficiency fluorescent converted LED light source and backlight module |
| 04/16/2008 | CN101162717A Stacked structures and methods of fabricating stacked structures |
| 04/16/2008 | CN100382334C LSI package, interposer, interface module and signal processing LSI monitoring circuit |
| 04/16/2008 | CN100382312C Semiconductor device and method of manufacturing semiconductor device |
| 04/16/2008 | CN100382311C Stack type double-chip packaging structure |
| 04/16/2008 | CN100382310C Electronic packed element containing photoelectric element and integrated circuit |
| 04/16/2008 | CN100382309C Molecule component |
| 04/16/2008 | CN100382289C Electric circuit module |
| 04/16/2008 | CN100382288C Semiconductor unit with cooling system |
| 04/16/2008 | CN100382199C Circuit module having interleaved groups of circuit chips |
| 04/15/2008 | US7360195 Block level routing architecture in a field programmable gate array |
| 04/15/2008 | US7358766 Mask-programmable logic device with programmable portions |
| 04/15/2008 | US7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
| 04/15/2008 | US7358535 Photo-coupler semiconductor device and production method therefor |
| 04/15/2008 | US7358496 Infrared night vision system, in colour |
| 04/15/2008 | US7358442 Bus structure for power switching circuits |
| 04/15/2008 | US7358117 Stacked die in die BGA package |
| 04/15/2008 | US7358114 Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
| 04/10/2008 | WO2008041682A1 Semiconductor device |
| 04/10/2008 | WO2008041150A2 A light module package |
| 04/10/2008 | WO2008040300A1 Led semiconductor body and use of an led semiconductor body |
| 04/10/2008 | WO2008040297A1 Optical element for a light-emitting diode, light-emitting diode, led arrangement and method for producing an led arrangement |
| 04/10/2008 | US20080084230 Interconnect structure enabling indirect routing in programmable logic |
| 04/10/2008 | US20080083985 Low fabrication cost, fine pitch and high reliability solder bump |
| 04/10/2008 | DE10360708B4 Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben Semiconductor module with a semiconductor stack, rewiring, and methods of making the same |
| 04/10/2008 | DE102007021009A1 Leuchtdiodenanordnung und Verfahren zur Herstellung einer solchen Light emitting diode array and method of manufacturing such a |
| 04/10/2008 | DE102007017604A1 Lamp bunch, lamp strip using the lamp bunch and its method of making |
| 04/10/2008 | DE102007003809A1 LED arrangement producing method, involves arranging LED modules such that modules are pairwise adjacent to each other, and establishing stable and electrically conducting connection between carrier bodies of two LED modules using carrier |
| 04/10/2008 | DE102005036646B4 Halbleiterchip und Herstellungsverfahren Semiconductor chip and the manufacturing method |
| 04/09/2008 | EP1909329A1 Semiconductor device |
| 04/09/2008 | EP1909322A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 04/09/2008 | EP1908124A2 Light-emitting module and mounting board used therefor |
| 04/09/2008 | CN101160733A 高频模块 High-frequency module |
| 04/09/2008 | CN101160656A Multi-chip module and method of manufacture |
| 04/09/2008 | CN101160650A Electronic circuit device and method for manufacturing same |
| 04/09/2008 | CN101159299A LED packaging structure |
| 04/09/2008 | CN101159279A Semiconductor image sensor die and production method thereof, semiconductor image sensor module, image sensor device, optical device element, and optical device module |
| 04/09/2008 | CN101159261A Semiconductor device and method for manufacturing the same |
| 04/09/2008 | CN101159260A Stacked structures and methods of forming stacked structures |
| 04/09/2008 | CN101159259A Three-dimensional multiple chips packaging module and preparation method |
| 04/09/2008 | CN101159255A Electronic device and manufacturing method thereof |
| 04/09/2008 | CN100381027C Printed wiring board and method of producing same |
| 04/09/2008 | CN100381026C Printed wiring board and method of producing same |
| 04/09/2008 | CN100380685C Light-emitting device and its production method |
| 04/09/2008 | CN100380661C Split-gate power module and method for suppressing oscillation therein |
| 04/09/2008 | CN100380660C Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment |
| 04/09/2008 | CN100380659C Semiconductor device and method of manufacturing the same |
| 04/09/2008 | CN100380658C Semiconductor packaging piece and its producing method |
| 04/09/2008 | CN100380657C Multi-configuration processor-memory substrate device |
| 04/09/2008 | CN100380652C Electric power semiconductor device |
| 04/09/2008 | CN100380637C Wiring board and semiconductor package using the same |
| 04/08/2008 | US7355877 Semiconductor device |
| 04/08/2008 | US7355443 Integrated circuit having building blocks |
| 04/08/2008 | US7355273 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
| 04/08/2008 | US7355272 Semiconductor device with stacked semiconductor chips of the same type |
| 04/03/2008 | WO2008037450A1 Modular backlighting device |