| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 05/08/2008 | US20080106860 Multi-configuration processor-memory substrate device |
| 05/08/2008 | US20080106291 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/08/2008 | US20080105967 Fan out type wafer level package structure and method of the same |
| 05/08/2008 | US20080105907 Semiconductor chip, semiconductor device and methods for producing the same |
| 05/08/2008 | US20080105817 Device for Allowing Hand Transport of a Jack-O-Lantern |
| 05/08/2008 | DE112005002889T5 Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen und Baugruppen-Montage desselben Same light emitting device having a plurality of light emitting cells and module assembly |
| 05/08/2008 | DE102007050868A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 05/08/2008 | DE102006028719B4 Halbleiterbauteil mit Halbleiterchipstapel und Verbindungselementen sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising semiconductor chip stack, and connecting elements and processes for producing the semiconductor device |
| 05/08/2008 | CA2667853A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | CA2667852A1 Semiconductor electronic component and semiconductor device using the same |
| 05/07/2008 | EP1918770A2 LED backlight with bare chip LED |
| 05/07/2008 | EP1918351A2 Luminescent sheet having see-through property, luminescent decorative material, and method of producing luminescent sheet |
| 05/07/2008 | EP1917557A2 Apparatus and methods for solar energy conversion using nanoscale cometal structures |
| 05/07/2008 | EP1829107B1 Arrangement of a semiconductor module and an electrical busbar |
| 05/07/2008 | EP1342292B1 Circuit module with universal connectivity |
| 05/07/2008 | CN201057603Y Improved structure of luminous dipolar body module group |
| 05/07/2008 | CN101174619A Power semiconductor device |
| 05/07/2008 | CN101174618A Semiconductor apparatus using back-side high-withstand-voltage integrated circuit |
| 05/07/2008 | CN101174617A Manufacturing method for semiconductor device, semiconductor device, and electronic equipment |
| 05/07/2008 | CN101174616A Circuit device |
| 05/07/2008 | CN101174615A Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
| 05/07/2008 | CN101174614A Multi-chip stack packaging structure with asymmetric conductive wire rack |
| 05/07/2008 | CN101174613A Circuit device and its manufacturing method |
| 05/07/2008 | CN101174612A High power light-emitting diode light source and lamp with the same |
| 05/07/2008 | CN101174605A Stacked chip packaging construction of bus bar with switch-over soldering pad in conducting wire rack |
| 05/07/2008 | CN100386876C Multilayer substrate stack packaging structure |
| 05/07/2008 | CN100386841C Nitride semiconductor device and method for fabricating the same |
| 05/06/2008 | US7368943 Enhanced scheme to implement an interconnection fabric using switching networks in hierarchy |
| 05/06/2008 | US7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 05/06/2008 | US7368810 Invertible microfeature device packages |
| 05/06/2008 | US7368754 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus |
| 05/06/2008 | US7368657 Paste composition and solar cell employing the same |
| 05/06/2008 | US7368655 Textured transparent plate with high light transmission |
| 05/06/2008 | US7368374 Super high density module with integrated wafer level packages |
| 05/06/2008 | US7368323 Semiconductor device and manufacturing method thereof |
| 05/06/2008 | US7367845 Modular sockets using flexible interconnects |
| 05/02/2008 | WO2008051596A2 Solid state light sheet and encapsulated bare die semiconductor circuits |
| 05/02/2008 | WO2008051415A1 Method of manufacturing stacked chip packages |
| 05/02/2008 | WO2008050868A1 Power module substrate, method for manufacturing power module substrate, and power module |
| 05/02/2008 | WO2008050783A1 Light-emitting device and display unit and lighting unit using the same |
| 05/02/2008 | WO2008050724A1 Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor device |
| 05/02/2008 | WO2008050723A1 Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor device |
| 05/02/2008 | WO2008049672A1 Electrical component comprising contact means |
| 05/02/2008 | WO2008011232A3 Universal non-volatile support device for supporting reconfigurable processing systems |
| 05/02/2008 | WO2007136928A3 Low profile managed memory component |
| 05/02/2008 | WO2007132683A3 Power semiconductor module |
| 05/01/2008 | US20080099678 Camera with visible light and infrared image blending |
| 04/30/2008 | EP1916713A2 Semiconductor package and stacked layer type semiconductor package formed with it |
| 04/30/2008 | EP1915568A1 Light emitting diode comprising multiple dies and optical system with number of lens elements |
| 04/30/2008 | DE4337675B4 Verfahren zur Herstellung von stapelbaren Halbleitergehäusen A process for the production of stackable semiconductor packages |
| 04/30/2008 | DE19829609B4 Verfahren zur Herstellung eines Mikrosystems A process for producing a microsystem |
| 04/30/2008 | DE10308448B4 Hochfrequenzmodul RF module |
| 04/30/2008 | DE10255848B4 Halbleiterbauelement und Verfahren zu seiner Herstellung sowie Hauptplatine mit diesem Halbleiterbauelement A semiconductor device and method for its preparation and motherboard with this semiconductor component |
| 04/30/2008 | DE102007030986A1 Electrical component i.e. micromechanical sensor, has contact units provided as solder beads and/or copper supports and arranged at side of one of chips, and cover partially surrounding chip at side and/or partially surrounding other chip |
| 04/30/2008 | CN201054361Y Led |
| 04/30/2008 | CN201054360Y LED part with pasting and welding surface |
| 04/30/2008 | CN201054353Y Multi-chip stacking assembly based on conversion layer |
| 04/30/2008 | CN201054352Y Encapsulation structure for radio communication module |
| 04/30/2008 | CN101171893A Circuit substrate connection structure and circuit substrate connection method |
| 04/30/2008 | CN101171686A Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket |
| 04/30/2008 | CN101171685A Rgb热隔离衬底 Rgb thermal insulating substrate |
| 04/30/2008 | CN101171683A Multi-chip module and method of manufacture |
| 04/30/2008 | CN101170108A Light receiving module |
| 04/30/2008 | CN101170107A Method of manufacturing a white light emitting organic EL device |
| 04/30/2008 | CN101170106A Laminate chip packages and its manufacture method and system |
| 04/30/2008 | CN101170105A Optical device module, fabrication method thereof, optical device unit and fabrication method thereof |
| 04/30/2008 | CN101170104A Stacking chip encapsulation structure with multi-section bus bar in lead rack |
| 04/30/2008 | CN101170103A Stacking wafer encapsulation structure with bus rack in lead rack |
| 04/30/2008 | CN101170102A Lighting device |
| 04/30/2008 | CN101170101A Semiconductor color changing luminescent device |
| 04/30/2008 | CN101170092A Method of producing semiconductor device, mounting structure body, electro-optical device and electronic apparatus |
| 04/30/2008 | CN101169238A Optical source module |
| 04/30/2008 | CN100385665C Chip and multi-chip semiconductor device using thereof and method for manufacturing same |
| 04/30/2008 | CN100385649C 半导体器件 Semiconductor devices |
| 04/30/2008 | CN100385636C Composite leadframe LED package and method of making the same |
| 04/29/2008 | US7365574 General purpose delay logic |
| 04/29/2008 | US7365568 Method and circuit for reducing programmable logic pin counts for large scale logic |
| 04/29/2008 | US7365567 Three input field programmable gate array logic circuit configurable as a three input look up table, a D-latch or a D flip-flop |
| 04/29/2008 | US7365485 White light emitting diode with first and second LED elements |
| 04/29/2008 | US7365426 Semiconductor device |
| 04/29/2008 | US7364949 Semiconductor device package |
| 04/29/2008 | US7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
| 04/29/2008 | US7364784 Thin semiconductor package having stackable lead frame and method of manufacturing the same |
| 04/24/2008 | WO2008047851A1 Light-emitting apparatus |
| 04/24/2008 | WO2008047665A1 Semiconductor device |
| 04/24/2008 | WO2008005161A3 Semiconductor assemblies and manufacturing methods thereof |
| 04/24/2008 | WO2007149362A3 Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements |
| 04/24/2008 | WO2007146775A3 Stacked chips with underpinning |
| 04/24/2008 | WO2007124059A3 Apparatus and method for enhanced solar power generation and maximum power point tracking |
| 04/24/2008 | US20080096316 Stacked Die in Die BGA Package |
| 04/24/2008 | US20080094841 Method and apparatus for using light emitting diodes |
| 04/24/2008 | US20080094805 Electronics Module and Method for Manufacturing the Same |
| 04/24/2008 | US20080094793 Electronic Circuit Device, Electronic Device Using the Same, and Method for Manufacturing the Same |
| 04/24/2008 | US20080093717 Leadframe of a leadless flip-chip package and method for manufacturing the same |
| 04/24/2008 | US20080093530 Illumination System |
| 04/24/2008 | DE10226363B4 Halbleiterbauelement Semiconductor device |
| 04/24/2008 | DE102006049081A1 Semiconductor-illuminant has semiconductor-diode which is illuminated by tension admission, and substrate which is permeable for light produced by semiconductor-diode |
| 04/24/2008 | DE10047897B4 Elektronische Baueinheit mit einer als Leadframe ausgebildeten Montageplatte und darauf befestigten SMD-Bauteilen Electronic unit with a designed as a lead frame mounting plate and secured thereto SMD components |
| 04/23/2008 | EP1914805A2 Semiconductor power module |
| 04/23/2008 | EP1914804A2 Single footprint family of integrated power modules |