| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/28/2008 | CN101188224A High heat radiation multi-chip integrated high-power white light LED module and its making method |
| 05/28/2008 | CN101187722A Contact type video image sensor and making method thereof |
| 05/28/2008 | CN100391020C Led lamp |
| 05/28/2008 | CN100391019C Semiconductor light-emitting device and method of manufacturing the same |
| 05/28/2008 | CN100390990C Stacked multi-chip package and method for manufacturing the same |
| 05/28/2008 | CN100390989C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/28/2008 | CN100390971C Electronic substrate, power module, and motor driver |
| 05/27/2008 | US7378898 Voltage droop suppressing circuit |
| 05/27/2008 | US7378873 Programmable logic device providing a serial peripheral interface |
| 05/27/2008 | US7378869 Lookup table circuits programmable to implement flip-flops |
| 05/27/2008 | US7378732 Semiconductor package |
| 05/27/2008 | US7378725 Semiconducting device with stacked dice |
| 05/27/2008 | US7378662 Radiation detector, radiation detector element, and radiation imaging apparatus |
| 05/27/2008 | US7377031 Fabrication method of semiconductor integrated circuit device |
| 05/22/2008 | WO2008059643A1 Three-dimensional electronic circuit apparatus |
| 05/22/2008 | WO2008024611A3 Staggered array imaging system using pixilated radiation detectors |
| 05/22/2008 | WO2007146307B1 Stack die packages |
| 05/22/2008 | US20080116931 Embedding Memory within Tile Arrangement of a Configurable IC |
| 05/22/2008 | US20080116671 Method of Manufacturing a Ignition Device and a Semiconductor Device |
| 05/22/2008 | US20080115352 Electronic device and method of manufacturing the same |
| 05/21/2008 | EP1923913A1 Integrated circuit packaging and method of making the same |
| 05/21/2008 | EP1922757A2 Method for preparing an electric comprising multiple leds |
| 05/21/2008 | CN201063345Y Non-insulation bi-tower type diode module |
| 05/21/2008 | CN201063344Y Silicon chain module |
| 05/21/2008 | CN201063343Y Bracket structure of LED |
| 05/21/2008 | CN201063342Y Multiple-chip packaging structure |
| 05/21/2008 | CN101185175A Flexible display device |
| 05/21/2008 | CN101183677A Packaging structure and method for manufacturing the packaging structure |
| 05/21/2008 | CN101183676A 封装结构及其制造方法 Package structure and method for manufacturing |
| 05/21/2008 | CN101183675A Hermetically sealed wafer level packaging for optical mems devices |
| 05/21/2008 | CN101183674A Liquid crystal display apparatus |
| 05/21/2008 | CN101183673A Stacked multi-chip semiconductor package structure and package method |
| 05/21/2008 | CN101183670A Semiconductor device, stacked semiconductor device and interposer substrate |
| 05/21/2008 | CN101183652A Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus |
| 05/21/2008 | CN100389496C White light emitting element and producing method thereof |
| 05/20/2008 | US7376318 Circuit board and its manufacturing method |
| 05/20/2008 | US7375435 Chip package structure |
| 05/20/2008 | US7375429 Integrated circuit component and mounting method thereof |
| 05/20/2008 | US7375421 High density multilayer circuit module |
| 05/20/2008 | US7375419 Stacked mass storage flash memory package |
| 05/20/2008 | US7375381 LED illumination apparatus and card-type LED illumination source |
| 05/20/2008 | US7375340 Packaging structure for imaging detectors |
| 05/20/2008 | US7375007 Method of manufacturing a semiconductor device |
| 05/20/2008 | US7374967 Multi-stack chip size packaging method |
| 05/20/2008 | US7374966 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
| 05/20/2008 | US7374107 Method of manufacturing a contactless card |
| 05/15/2008 | WO2008057680A2 Display system |
| 05/15/2008 | WO2008055722A1 Micromechanical sensor with integrated chip capacitor |
| 05/15/2008 | WO2008055406A1 A white light led |
| 05/15/2008 | WO2007127995A3 Current source circuit and design methodology |
| 05/15/2008 | US20080113471 Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice |
| 05/15/2008 | US20080111582 Memory module and memory device |
| 05/15/2008 | US20080111151 Power Module, Method of Producing Same, and Air Conditioner |
| 05/15/2008 | US20080110493 Ventilated photovoltaic module frame |
| 05/15/2008 | DE102007052515A1 Halbleiterchipstapelpackung Semiconductor chip stack package |
| 05/15/2008 | DE102006052754A1 Transistor, Inverter und Verfahren zur Herstellung eines Transistors Transistor, and inverter process for the preparation of a transistor |
| 05/15/2008 | DE102006049949B3 Semiconductor module, has flat conductor chip island defining electrically conducting portion and insulation layer, and semiconductor chip arranged on electrically conducting portion and positively bonded on insulation layer |
| 05/15/2008 | DE10144207B4 Anordnung mit mindestens zwei unterschiedlichen elektronischen Halbleiterschaltungen und Verwendung der Anordnung zur schnellen Datenübertragung Arrangement with at least two different electronic semiconductor circuits and use of the arrangement for fast data transfer |
| 05/14/2008 | EP1685600A4 Stackable electronic assembly |
| 05/14/2008 | CN201060875Y Light-emitting diode structure |
| 05/14/2008 | CN201060873Y Plate type LED substrates |
| 05/14/2008 | CN201059481Y Four-primary-color LED |
| 05/14/2008 | CN101180728A Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip |
| 05/14/2008 | CN101179103A Luminous chip packaging body and manufacturing method therefor |
| 05/14/2008 | CN101179102A LED lamp and producing process |
| 05/14/2008 | CN101179069A Electronic element packaging structure |
| 05/14/2008 | CN101179068A Multi stack package and method of fabricating the same |
| 05/14/2008 | CN101179067A Light source assembly and luminous chip packaging body |
| 05/14/2008 | CN101179066A Chip embedding bury type packaging structure |
| 05/14/2008 | CN101179065A Semi-conductor light source device |
| 05/14/2008 | CN101179058A 半导体芯片及半导体装置 The semiconductor chip and semiconductor device |
| 05/14/2008 | CN100388516C Light source module |
| 05/14/2008 | CN100388486C Power semiconductor module |
| 05/14/2008 | CN100388485C Resin sealing semiconductor device and producing method thereof |
| 05/14/2008 | CN100388484C Composite LED package structure |
| 05/14/2008 | CN100388483C Composite LED package structure |
| 05/14/2008 | CN100388482C Semiconductor device and switching element |
| 05/14/2008 | CN100388469C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/14/2008 | CN100388449C Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
| 05/13/2008 | US7372146 Semiconductor module |
| 05/13/2008 | US7372144 High speed electronics interconnect and method of manufacture |
| 05/13/2008 | US7372135 Multi-chip image sensor module |
| 05/13/2008 | US7372132 Resin encapsulated semiconductor device and the production method |
| 05/13/2008 | US7371612 Method of fabrication of stacked semiconductor devices |
| 05/13/2008 | US7371609 Stacked module systems and methods |
| 05/13/2008 | US7371608 Method of fabricating a stacked die having a recess in a die BGA package |
| 05/13/2008 | US7371607 Method of manufacturing semiconductor device and method of manufacturing electronic device |
| 05/13/2008 | US7371606 Manufacturing method of a semiconductor device |
| 05/13/2008 | US7371594 Nitride semiconductor device and method for fabricating the same that minimizes cracking |
| 05/13/2008 | CA2454289C High speed circuit board and method for fabrication |
| 05/08/2008 | WO2008054012A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | WO2008054011A1 Semiconductor electronic component and semiconductor device using the same |
| 05/08/2008 | WO2008053586A1 Semiconductor device |
| 05/08/2008 | WO2008053012A1 Use of phosphor led's for fine tuning the performance of a lighting assembly |
| 05/08/2008 | WO2008024839A3 Galvanic isolation integrated in a signal channel |
| 05/08/2008 | WO2008007008A3 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 05/08/2008 | US20080108232 Device for controlling a vehicle |
| 05/08/2008 | US20080107375 Optoelectric composite substrate and method of manufacturing the same |
| 05/08/2008 | US20080106875 Circuit Device And Method Of Manufacturing The Same |
| 05/08/2008 | US20080106861 Multi-configuration processor-memory substrate device |