| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/11/2008 | CN101197356A Multi-chip package structure and its forming method |
| 06/11/2008 | CN101197355A Electronic device and method for producing the same, lbd display unit and method for producing the same |
| 06/11/2008 | CN101197354A Stack packaging structure |
| 06/11/2008 | CN101197353A 可堆叠式半导体封装结构 Stackable semiconductor package structure |
| 06/11/2008 | CN101197352A Packaging structure and its manufacturing method |
| 06/11/2008 | CN101197343A Semiconductor device including microstrip line and coplanar line |
| 06/11/2008 | CN101197297A Wafer press welding and bonding method and structure thereof |
| 06/11/2008 | CN100394602C Electronic circuit device and method for manufacturing the same |
| 06/11/2008 | CN100394601C Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method |
| 06/11/2008 | CN100394600C Surface mounted electrical components and method for mounting and retaining same |
| 06/11/2008 | CN100394599C Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith |
| 06/11/2008 | CN100394598C Ultrathin stack components |
| 06/11/2008 | CN100394591C Functional coating of an SCFM preform |
| 06/11/2008 | CN100394590C Manufacture structure and method for leadless chip carrier with embedded inductor |
| 06/10/2008 | US7385835 Membrane 3D IC fabrication |
| 06/10/2008 | US7385653 LED package and backlight assembly for LCD comprising the same |
| 06/10/2008 | US7385457 Flexible capacitive coupler assembly and method of manufacture |
| 06/10/2008 | US7385420 Repeatable block producing a non-uniform routing architecture in a field programmable gate array having segmented tracks |
| 06/10/2008 | US7385286 Semiconductor module |
| 06/10/2008 | US7385281 Semiconductor integrated circuit device |
| 06/10/2008 | US7384863 Semiconductor device and method for manufacturing the same |
| 06/10/2008 | US7384176 Vehicular headlamp employing semiconductor light source |
| 06/10/2008 | CA2326455C Wafer-pair having deposited layer sealed chambers |
| 06/10/2008 | CA2276885C Molding for holding heat sinks in a clamped stack |
| 06/05/2008 | WO2008066028A1 Interposer with built-in passive part |
| 06/05/2008 | WO2008065896A1 Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method |
| 06/05/2008 | WO2008027746A3 Metal core foldover packages structures, systems including the same and methods of fabrication |
| 06/05/2008 | US20080134126 Data processing in digital systems |
| 06/05/2008 | US20080131989 Method of producing acceleration sensor chip package |
| 06/05/2008 | US20080128880 Die stacking using insulated wire bonds |
| 06/05/2008 | US20080128879 Film-on-wire bond semiconductor device |
| 06/05/2008 | US20080128863 Fabrication method of semiconductor device and semiconductor device |
| 06/05/2008 | US20080127489 Wiring substrate, manufacturing method thereof, and semiconductor device |
| 06/05/2008 | DE102007042761A1 Erweiterbare LED-Array-Zusammenschaltung Expandable LED array interconnection |
| 06/05/2008 | DE102006056363A1 Halbleitermodul mit mindestens zwei Substraten A semiconductor module having at least two substrates, |
| 06/05/2008 | DE102006043785B4 Elektronische Baugruppe Electronic assembly |
| 06/04/2008 | EP1928222A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module |
| 06/04/2008 | EP1928033A2 Light-emitting apparatus and method of producing the same |
| 06/04/2008 | EP1842408A4 Low thermal resistance power module assembly |
| 06/04/2008 | CN201069773Y Luminant structure |
| 06/04/2008 | CN201069772Y A modular LED encapsulation structure |
| 06/04/2008 | CN201069771Y Mounting type LED |
| 06/04/2008 | CN201069769Y Encapsulation structure for small communication module |
| 06/04/2008 | CN101194373A Method of removing the growth substrate of a semiconductor light-emitting device |
| 06/04/2008 | CN101192640A Luminous diode with heat radiating device |
| 06/04/2008 | CN101192637A Luminous diode element |
| 06/04/2008 | CN101192602A Solar-powered illuminator |
| 06/04/2008 | CN101192601A Illumination device with semiconductor light-emitting elements |
| 06/04/2008 | CN101192600A Stack type chip package with radiation structure |
| 06/04/2008 | CN101192599A Stack type chip package structure with wire frame inner pin installed with transfer welding pad |
| 06/04/2008 | CN101192598A Luminous diode with jointing construction and its system |
| 06/04/2008 | CN101192585A Stackable semi-conductor packaging structure |
| 06/04/2008 | CN101192548A Chip packaging and chip packaging method |
| 06/04/2008 | CN101192547A Semiconductor component buried loading plate splicing structure and its manufacture method |
| 06/04/2008 | CN101192546A Luminous diode color matching method |
| 06/04/2008 | CN101192544A Semiconductor component buried loading plate splicing structure and its manufacture method |
| 06/04/2008 | CN100392882C Light-emitting device and manufacturing process of the light-emitting device |
| 06/04/2008 | CN100392856C Power semiconductor module |
| 06/04/2008 | CN100392855C U-grooved integrated chip and method for fabricating same |
| 06/04/2008 | CN100392849C Package body and package body module |
| 06/04/2008 | CN100392831C Semiconductor device and process for manufacturing the same |
| 06/04/2008 | CN100392694C Power module and display device |
| 06/03/2008 | US7382005 Circuit component with bump formed over chip |
| 06/03/2008 | US7382000 Semiconductor device |
| 06/03/2008 | US7381953 Infrared imaging device |
| 06/03/2008 | CA2401461C Led light source with field-of-view-controlling optics |
| 05/29/2008 | WO2008062767A1 Semiconductor chip provided with side surface electrode, method for manufacturing the semiconductor chip, and three-dimensional mounting module wherein the semiconductor chip is laminated |
| 05/29/2008 | WO2008061865A1 Wire and solder bond forming methods |
| 05/29/2008 | WO2007090664A8 Power electronics assembly |
| 05/29/2008 | US20080124830 Method of manufacturing image sensor |
| 05/29/2008 | US20080123299 Circuit Device and Manufacturing Method of the Same |
| 05/29/2008 | US20080122088 Electronic Packaging Materials for Use with Low-K Dielectric-Containing Semiconductor Devices |
| 05/29/2008 | US20080121879 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/29/2008 | DE112004000572B4 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes |
| 05/29/2008 | DE102006055340A1 Explosionsfester Modulaufbau für Leistungsbauelemente, insbesondere Leistungshalbleiterbauelemente und dessen Herstellung Explosion-proof module structure for power devices, in particular power semiconductor components and its preparation |
| 05/29/2008 | DE102004005666B4 Hochfrequenzanordnung, Verfahren zur Herstellung einer Hochfrequenzanordnung und Verwendung der Hochfrequenzanordnung A radio frequency device, method for manufacturing a high frequency assembly and use of the high-frequency arrangement |
| 05/28/2008 | EP1926145A2 Self-aligned through vias for chip stacking |
| 05/28/2008 | EP1926136A2 Electronic component and method for manufacturing the same |
| 05/28/2008 | EP1926135A2 Electronic component and method for manufacturing the same |
| 05/28/2008 | EP1497852A4 Method and apparatus for connecting vertically stacked integrated circuit chips |
| 05/28/2008 | CN201066697Y Encapsulation structure for side emission LED part |
| 05/28/2008 | CN201066696Y Encapsulation structure for high-power LED chip and high-power LED lighting part |
| 05/28/2008 | CN201066690Y A multi-light source LED |
| 05/28/2008 | CN201066689Y Improved luminescent thermoelectric effect chip |
| 05/28/2008 | CN201066688Y LED and backlight module |
| 05/28/2008 | CN101189929A Semiconductor circuit base plate and semiconductor circuit |
| 05/28/2008 | CN101189719A Lead free solar cell contacts |
| 05/28/2008 | CN101188261A LED with high dispersion angle and surface light source |
| 05/28/2008 | CN101188247A An organic electric luminescent display and its making method |
| 05/28/2008 | CN101188235A Layered integrated circuit memory |
| 05/28/2008 | CN101188234A Quanta trap infrared detector for multi-folded light dispersion coupling |
| 05/28/2008 | CN101188233A Encapsulation structure of spacer with ventilation hole |
| 05/28/2008 | CN101188232A Laminated encapsulation structure and its making method |
| 05/28/2008 | CN101188231A Semiconductor device and semiconductor wafer and method for manufacturing the same |
| 05/28/2008 | CN101188230A Package structure and its making method |
| 05/28/2008 | CN101188229A Semiconductor device |
| 05/28/2008 | CN101188228A Transistor tube valve with force top pressing structure |
| 05/28/2008 | CN101188227A 半导体装置 Semiconductor device |
| 05/28/2008 | CN101188226A Chip package structure and fabricating process thereof |
| 05/28/2008 | CN101188225A Semiconductor package structure |