| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/25/2008 | CN101207102A High-power diode supporting structure and encapsulation combination |
| 06/25/2008 | CN101207096A Semiconductor component with through-vias |
| 06/25/2008 | CN101207055A Gestapelte halbleiterbausteine |
| 06/25/2008 | CN101207053A Semiconductor device manufacturing method |
| 06/25/2008 | CN101207050A Light emitting device package and method for manufacturing the same |
| 06/25/2008 | CN101206369A Pixels array module group and flat display device |
| 06/25/2008 | CN101206345A Backlight module with complementary concolores light source and manufacturing method thereof |
| 06/25/2008 | CN100397769C Circuit structure of small inductor |
| 06/25/2008 | CN100397669C LED light source packaging structure for low-temperature coburning ceramic by thermoelectric separating design |
| 06/25/2008 | CN100397663C White light led with multicolor light-emitting layers of macroscopic structure widths, arranged on a light-diffusing glass |
| 06/25/2008 | CN100397641C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397640C Circuit component built-in module and method for manufacturing the same |
| 06/25/2008 | CN100397639C Structure and method for forming multiple lead line frame semiconductor device |
| 06/25/2008 | CN100397632C Modular heat sink decoupling capacitor array and printed circuit board assembly |
| 06/25/2008 | CN100397623C 半导体芯片侧接触方法 The semiconductor chip side contact method |
| 06/25/2008 | CN100397600C Transistor modular assembling method and its equipment |
| 06/24/2008 | US7391255 Semiconductor phase adjustment system module |
| 06/24/2008 | US7391200 P-channel power chip |
| 06/24/2008 | US7391118 Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same |
| 06/24/2008 | US7391105 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same |
| 06/19/2008 | WO2008072551A1 Ic chip-mounted package and image display device using the same |
| 06/19/2008 | WO2008072510A1 Semiconductor device |
| 06/19/2008 | WO2008072196A1 Tunable white point light source using a wavelength converting element |
| 06/19/2008 | WO2008071763A1 Luminous panel |
| 06/19/2008 | WO2008022901A3 Process for the collective manufacturing of electronic 3d modules |
| 06/19/2008 | US20080144298 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080143387 Software programmable multiple function integrated circuit module |
| 06/19/2008 | US20080142940 Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate |
| 06/19/2008 | US20080142922 Semiconductor chip |
| 06/19/2008 | US20080142847 Semiconductor apparatus having a large-size bus connection |
| 06/19/2008 | US20080142818 Flip chip type LED lighting device manufacturing method |
| 06/19/2008 | US20080142763 Directional crystallization of silicon sheets using rapid thermal processing |
| 06/19/2008 | US20080142714 Image Pickup Device, Vision Enhancement Device, Night-Vision Device, Navigation Supporting Device, And Monitoring Device |
| 06/19/2008 | US20080142255 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | DE10297224B4 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zum Verbinden von Substraten und Verwendung eines derartigen Klebstoffs zur Verknüpfung und Verbindung von Substraten einer Halbleitervorrichtung Die attach adhesives for semiconductor applications, and methods of bonding substrates using such an adhesive for bonding substrates and linking of a semiconductor device |
| 06/19/2008 | DE10229625B4 Halbleitereinrichtung Semiconductor device |
| 06/19/2008 | DE102007059128A1 Mikrominiatur-Leistungswandler Microminiature power converter |
| 06/19/2008 | DE102007049033A1 Modulare Sensoranordnung und Verfahren zur Herstellung Modular sensor assembly and method for producing |
| 06/19/2008 | DE102006059074A1 Construction unit has two chips that are arranged one above other in connecting area by blocking or tilting microstructures in each other turned chip surfaces, which are mechanically and electrically connected |
| 06/19/2008 | DE102006057332A1 Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip und ein Verfahren zur Herstellung derselben Assembly comprising a substrate and a chip mounted on the substrate and a method of manufacturing the same |
| 06/19/2008 | DE102006057248A1 Leistungshalbleitermodul The power semiconductor module |
| 06/18/2008 | EP1933383A2 Silicon carbide diode voltage limiter |
| 06/18/2008 | EP1933380A2 Power semiconductor module with contact springs |
| 06/18/2008 | EP1933379A2 Power semiconductor module with contact springs |
| 06/18/2008 | EP1933079A1 Illuminated panel |
| 06/18/2008 | EP1932178A2 High brightness light emitting diode device |
| 06/18/2008 | CN101202472A Rectifier circuit, power supply circuit, and semiconductor device |
| 06/18/2008 | CN101202317A LED radiating device combination |
| 06/18/2008 | CN101202299A Organic light emitting diode display device and method of manufacturing the same |
| 06/18/2008 | CN101202276A AC-LED single chip having three contact points |
| 06/18/2008 | CN101202275A Package having shield case |
| 06/18/2008 | CN101202274A Multi-chip electronic circuit module and a method of manufacturing |
| 06/18/2008 | CN101202273A LED module |
| 06/18/2008 | CN101202272A Sealing structure for MEMS devices and method of the same |
| 06/18/2008 | CN101202271A Light source component and method for making |
| 06/18/2008 | CN101202270A LED module set and method of manufacture |
| 06/18/2008 | CN101202259A Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture |
| 06/18/2008 | CN100395927C Luminescent device and optical device using the luminescent device |
| 06/18/2008 | CN100395889C Encapsulation structure for multiple chips |
| 06/17/2008 | US7388295 Multi-chip module |
| 06/17/2008 | US7388294 Semiconductor components having stacked dice |
| 06/17/2008 | US7388277 Chip and wafer integration process using vertical connections |
| 06/17/2008 | US7387907 Image sensor with optical guard ring and fabrication method thereof |
| 06/17/2008 | US7387406 Modular mounting arrangement and method for light emitting diodes |
| 06/17/2008 | US7387400 Light-emitting device with spherical photoelectric converting element |
| 06/17/2008 | CA2312285C Disc-shaped light-emitting diode illumination device |
| 06/12/2008 | WO2008070541A1 Lighting device and lighting method |
| 06/12/2008 | WO2008070511A1 Film-on-wire bond semiconductor device |
| 06/12/2008 | WO2008068006A1 Photovoltaic module and its use |
| 06/12/2008 | WO2007089380A3 METHOD OF MAKING OPTICAL LIGHT ENGINES WITH ELEVATED LEDs AND RESULTING PRODUCT |
| 06/12/2008 | US20080139855 comprising a chainlike perfluoroalkyne having 5 or 6 carbon atoms, preferably perfluoro-2-pentyne. This plasma reaction gas is suitable for dry etching for formation of a fine pattern, for plasma CVD for formation of a thin film, and for plasma ashing. |
| 06/12/2008 | US20080138934 Method of manufacturing multi-stack package |
| 06/12/2008 | US20080138701 Battery-integrated semiconductor module and method for producing the same |
| 06/12/2008 | US20080137333 Lighting Equipment |
| 06/12/2008 | US20080136920 Image Module |
| 06/12/2008 | US20080136046 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
| 06/12/2008 | US20080136045 Stacked die in die BGA package |
| 06/12/2008 | US20080135842 Method For Manufacturing Array Board For Display Device |
| 06/12/2008 | US20080135757 Infrared radiation imager having sub-pixelization and detector interdigitation |
| 06/12/2008 | DE10343502B4 Verfahren zum Herstellen einer wärmeleitenden Verbindung A method of manufacturing a thermally conductive compound |
| 06/12/2008 | DE102007059161A1 Multi-Chip Package Struktur und Verfahren zu deren Herstellung Multi-chip package structure and methods for their preparation |
| 06/12/2008 | DE102007038937A1 Baugruppenanordnung Assembly arrangement |
| 06/12/2008 | DE102006058068A1 Halbleiterbauelement mit Halbleiterchip und passivem Bauelement sowie Verfahren zu dessen Herstellung A semiconductor device having semiconductor chip and a passive element as well as method for its preparation |
| 06/11/2008 | EP1930954A1 Photovoltaic module and its application |
| 06/11/2008 | EP1930947A1 Backlight assembly and display device having the same |
| 06/11/2008 | EP1930945A1 Semiconductor power module |
| 06/11/2008 | EP1929540A2 Land grid array semiconductor device packages, assemblies including same, and methods of fabrication |
| 06/11/2008 | EP1929524A2 Microelectronic device packages, stacked microlecetronic device packages, and methods for manufacturing microelectronic devices |
| 06/11/2008 | EP1929521A2 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 06/11/2008 | CN201072759Y Surface labeling type three-color light emitting diode packaging structure |
| 06/11/2008 | CN201072042Y Harden LED light source body bubble |
| 06/11/2008 | CN101199052A Packaging logic and memory integrated circuits |
| 06/11/2008 | CN101197538A Microminiature power converter and thin film magnetic induction device thereof |
| 06/11/2008 | CN101197402A Led |
| 06/11/2008 | CN101197389A AC illuminating body and AC illuminating device |
| 06/11/2008 | CN101197361A Power module and method of manufacturing the same |
| 06/11/2008 | CN101197360A Multi-chips package and method of forming the same |
| 06/11/2008 | CN101197359A Image sensor module |
| 06/11/2008 | CN101197358A Electronic circuit device and method for producing the same |
| 06/11/2008 | CN101197357A Light emitting diode package, and light source unit and backlight unit including the same |