| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/09/2008 | CN101217249A Detachable transducer of comparatively better efficiency |
| 07/09/2008 | CN101217142A A bar-shaped LED light source |
| 07/09/2008 | CN101217141A IC package and method of manufacturing the same |
| 07/09/2008 | CN101217140A Package structures |
| 07/09/2008 | CN100401540C 光半导体装置 The optical semiconductor device |
| 07/09/2008 | CN100401534C Lighting device, backligh module, and light resource adjusting method of LED element |
| 07/09/2008 | CN100401517C 半导体装置 Semiconductor device |
| 07/09/2008 | CN100401516C White light LED assembly making method |
| 07/09/2008 | CN100401515C Semiconductor device with inverted chip packer coating and its production thereof |
| 07/09/2008 | CN100401514C Communication method between chips |
| 07/09/2008 | CN100401486C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/09/2008 | CN100401485C Packing method capable of increasing percent of pass for multiple chip package |
| 07/09/2008 | CN100401164C LED lamp unit |
| 07/09/2008 | CN100400961C Lighting device and lighting fixture for a vehicle |
| 07/08/2008 | US7397178 Luminescence cell, luminescence device with luminescence cell, luminescence unit, luminescence device with luminescence unit, frame for luminescence device, and method for manufacturing luminescence cell |
| 07/08/2008 | US7397116 Semiconductor apparatus and production method thereof suitable for electric power devices |
| 07/08/2008 | US7397068 Solid state lighting device |
| 07/08/2008 | US7397038 Nuclear imaging using three-dimensional gamma particle interaction detection |
| 07/08/2008 | US7397000 Wiring board and semiconductor package using the same |
| 07/08/2008 | US7396763 Semiconductor package using flexible film and method of manufacturing the same |
| 07/08/2008 | US7396702 Module assembly and method for stacked BGA packages |
| 07/08/2008 | US7395611 System processing a substrate using dynamic liquid meniscus |
| 07/03/2008 | WO2008078898A1 High frequency module and manufacturing method thereof |
| 07/03/2008 | WO2008078544A1 Electronic circuit device and method for manufacturing the same |
| 07/03/2008 | WO2008077627A1 Led lamp with omnidirectional light radiation and optimized heat dissipation |
| 07/03/2008 | WO2008041150A3 A light module package |
| 07/03/2008 | WO2007076519A3 One piece, collapsible pv assembly |
| 07/03/2008 | US20080158841 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080158838 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080157098 Semiconductor device and method of manufacturing the same |
| 07/03/2008 | DE10248644B4 Leistungshalbleitermodul The power semiconductor module |
| 07/03/2008 | DE102007059337A1 Halbleiterkomponente mit Durchkontakten Semiconductor component with vias |
| 07/03/2008 | DE102007050417A1 Leistungsmodul mit einem in sich geschlossenen Kühlungssystem Power module with a self-contained cooling system |
| 07/03/2008 | DE102007032274A1 Light source has multiple chips, where each chip has light emitting diode, and encapsulating layer is presented on each chip, and cover is connected with light emitting diode carrier |
| 07/03/2008 | DE102006062473A1 Semiconductor device for use in semiconductor component, has chip with active and rear sides, where chip is arranged over one side of substrate, and completely encapsulated with only one material |
| 07/03/2008 | DE102006061941A1 Optoelectronic arrangement, has power light emitting diode, where radiation is emitted from power light emitting diode, and adjusting light emitting diode, where another radiation is emitted from adjusting light emitting diode |
| 07/03/2008 | DE102005007333B4 Mehrchip-Gehäuse mit seriellen Hochgeschwindigkeitskommunikationen zwischen Halbleiterformen Multi-chip package with high-speed serial communications between semiconductor forms |
| 07/03/2008 | DE102004021927B4 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module |
| 07/02/2008 | EP1939939A2 A lamp and method of producing a lamp |
| 07/02/2008 | EP1939937A2 Bidirectional switch module |
| 07/02/2008 | EP1938380A1 Wavelength-converting light-emitting devices |
| 07/02/2008 | CN201081205Y Steam-chamber heat dissipation structure for high power LED street lamp |
| 07/02/2008 | CN201081174Y Four-leg full color LED |
| 07/02/2008 | CN101212015A Light emitting device |
| 07/02/2008 | CN101211996A LED module group |
| 07/02/2008 | CN101211906A Packaged chip structure |
| 07/02/2008 | CN101211905A Press-loading valve stack for large power all-controlled semiconductor device |
| 07/02/2008 | CN101211904A Bidirectional switch module |
| 07/02/2008 | CN101211903A RF module package structure and its forming method |
| 07/02/2008 | CN101211902A 半导体装置 Semiconductor device |
| 07/02/2008 | CN101211901A Electronic component contained substrate |
| 07/02/2008 | CN101211900A Electronic component contained substrate |
| 07/02/2008 | CN101211899A Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same |
| 07/02/2008 | CN101211898A Packaging structure for electrostatic protection, electromagnetic isolation and antioxidation and method of manufacture |
| 07/02/2008 | CN101211897A Multi-chip semiconductor packaging structure and encapsulation method |
| 07/02/2008 | CN101211896A Image sensing module |
| 07/02/2008 | CN101211792A Semi-conductor package and its manufacture method and stacking structure |
| 07/02/2008 | CN100399565C Light-emitting diode module |
| 07/01/2008 | US7395474 Lab-on-chip system and method and apparatus for manufacturing and operating same |
| 07/01/2008 | US7394665 LSI package provided with interface module and method of mounting the same |
| 07/01/2008 | US7394663 Electronic component built-in module and method of manufacturing the same |
| 07/01/2008 | US7394662 Optimization of the number of power outputs for an integrated circuit |
| 07/01/2008 | US7394147 Semiconductor package |
| 07/01/2008 | US7393718 Unmolded package for a semiconductor device |
| 06/26/2008 | WO2008077099A1 Lighting device comprising light emitting diode thermally connected to and electrically in series with a ptc resistor |
| 06/26/2008 | WO2008076635A2 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate |
| 06/26/2008 | WO2008075409A1 Base for power module, method for producing base for power module and power module |
| 06/26/2008 | WO2008074218A1 Light emitting stick having led chips |
| 06/26/2008 | WO2008074185A1 Integrated circuit package and its manufacturing method, memory system |
| 06/26/2008 | WO2008074164A1 Semiconductor module |
| 06/26/2008 | WO2008050783B1 Light-emitting device and display unit and lighting unit using the same |
| 06/26/2008 | WO2008047851B1 Light-emitting apparatus |
| 06/26/2008 | WO2008016895A3 Integrating light source module |
| 06/26/2008 | WO2007133301A3 Light emitting diodes with improved light collimation |
| 06/26/2008 | WO2007064779A8 Stacked microelectronic packages |
| 06/26/2008 | US20080153204 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
| 06/26/2008 | US20080150153 Single mask via method and device |
| 06/26/2008 | US20080150063 Process for making contact with and housing integrated circuits |
| 06/26/2008 | DE19720275B4 Substrat für eine Halbleiteranordnung, Herstellungsverfahren für dasselbe und eine das Substrat verwendende stapelbare Halbleiteranordnung Substrate for a semiconductor device manufacturing method thereof, and a stackable semiconductor device, the substrate used |
| 06/26/2008 | DE112006001849T5 Verfahren zum Montieren von elektronischen Bauelementen A method of mounting electronic components |
| 06/26/2008 | DE102007060640A1 Gestapelte Halbleiterbausteine Stacked semiconductor devices |
| 06/26/2008 | DE102006060429A1 Electrical components, has leadframe structure, which is provided as electrical connection of component and another leadframe structure has conducting is fixed on one of two chips |
| 06/26/2008 | DE102004051039B4 Leistungshalbleitermodul mit Druckkontakteinrichtung Power semiconductor module with a pressure-contact means |
| 06/25/2008 | EP1936704A2 Semiconductor light emitting device package and method for manufacturing the same |
| 06/25/2008 | EP1936688A1 Process of fabricating an optoelectronic module and optoelectronic module obtained by this process |
| 06/25/2008 | EP1936687A1 Electrical terminal |
| 06/25/2008 | EP1936686A2 Semiconductor Device, Method for Manufacturing the same, and Method for Mounting the same |
| 06/25/2008 | CN101208789A Method of manufacturing an assembly and assembly |
| 06/25/2008 | CN101207970A Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 06/25/2008 | CN101207969A Electronic component built-in substrate and method for manufacturing the same |
| 06/25/2008 | CN101207175A Electronic cooling device and fabrication method thereof |
| 06/25/2008 | CN101207169A Luminous chip encapsulation body and light source component |
| 06/25/2008 | CN101207117A System grade encapsulation body and fabrication methods thereof |
| 06/25/2008 | CN101207116A Semiconductor package on package having plug-socket type wire connection between packages |
| 06/25/2008 | CN101207115A Semiconductor integrated circuit |
| 06/25/2008 | CN101207114A Semiconductor device and manufacturing method of the same |
| 06/25/2008 | CN101207113A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 06/25/2008 | CN101207112A Light emitting diode radiating module and applied display apparatus |
| 06/25/2008 | CN101207111A Potted element |
| 06/25/2008 | CN101207110A Light emitting diode module |