| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/29/2008 | US7405138 Manufacturing method of stack-type semiconductor device |
| 07/29/2008 | US7405104 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 07/24/2008 | WO2008087740A1 Semiconductor device |
| 07/24/2008 | WO2008087701A1 Three-dimensional semiconductor integrated circuit device and method for manufacturing the same |
| 07/24/2008 | WO2008087572A1 Light emitting device with improved heat transport |
| 07/24/2008 | WO2008054862A3 Radiation detector with co-planar grid structure |
| 07/24/2008 | WO2008043264A8 Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| 07/24/2008 | WO2007132683B1 Power semiconductor module |
| 07/24/2008 | US20080174515 Tiled electronic display structure |
| 07/24/2008 | US20080174008 Structure of Memory Card and the Method of the Same |
| 07/24/2008 | US20080173816 Aviation vision apparatus |
| 07/24/2008 | DE102007003182A1 Elektrisches Bauelement Electrical component |
| 07/23/2008 | EP1947694A1 Supporting substrate for electronic components |
| 07/23/2008 | EP1947693A1 Plane structure of light-emitting diode lighting apparatus |
| 07/23/2008 | EP1602133B1 Modular shade system with solar tracking panels |
| 07/23/2008 | CN201091031Y LED chip packaging structure with high efficiency lateral luminous effect |
| 07/23/2008 | CN101228628A Integrated circuit package having stacked integrated circuits and method thereof |
| 07/23/2008 | CN101228627A Electronic module assembly with heat spreader |
| 07/23/2008 | CN101226976A LED device and locating structure thereof |
| 07/23/2008 | CN101226975A High-power light emitting diode chip packaging structure and method for manufacturing the same |
| 07/23/2008 | CN101226929A Semiconductor package structure and manufacturing method thereof |
| 07/23/2008 | CN101226928A Stack type chip packaging structure and manufacturing method thereof |
| 07/23/2008 | CN101226927A Chip module with power amplifier and manufacturing method thereof |
| 07/23/2008 | CN101226926A Assembled structure of large area array infrared detector on cold platform and assembled method thereof |
| 07/23/2008 | CN101226925A Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| 07/23/2008 | CN101226924A Quartering shot type light emitting diode |
| 07/23/2008 | CN101225934A Laminating integral crystalline silicon solar energy photovoltaic device and method of preparing the same |
| 07/23/2008 | CN100405624C Integrated thermoelectric cooling devices and methods for fabricating same |
| 07/23/2008 | CN100405596C Method for wireless data interchange between circuit units within a package, and circuit arrangement for performing the method |
| 07/23/2008 | CN100405592C Multipurpose LED support |
| 07/23/2008 | CN100405591C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/23/2008 | CN100405499C Memory modular and memory system |
| 07/23/2008 | CN100405175C LED package and backlight assembly for LCD comprising the same |
| 07/22/2008 | US7403035 Low-power transceiver architectures for programmable logic integrated circuit devices |
| 07/22/2008 | US7402903 Semiconductor device |
| 07/22/2008 | US7402902 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 07/22/2008 | US7402900 Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
| 07/22/2008 | US7402897 Vertical system integration |
| 07/22/2008 | US7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
| 07/17/2008 | WO2008085391A2 Stacked packages |
| 07/17/2008 | WO2008084841A1 Semiconductor device |
| 07/17/2008 | WO2008084276A1 A semiconductor package |
| 07/17/2008 | WO2008083672A2 Housing for an optoelectronic component and arrangement of an optoelectronic component in a housing |
| 07/17/2008 | WO2008064068A3 Planarized led with optical extractor |
| 07/17/2008 | WO2007109326A3 Methods and materials useful for chip stacking, chip and wafer bonding |
| 07/17/2008 | US20080171402 Method of fabricating a semiconductor multi-package module having inverted land grid array (lga) package stacked over ball grid array (bga) package |
| 07/17/2008 | US20080169550 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 07/17/2008 | US20080169120 Printed circuit board and method of manufacturing printed ciruit board |
| 07/17/2008 | DE102008003952A1 Mikrominiatur-Umrichter Microminiature inverter |
| 07/17/2008 | DE102008003670A1 Mehrchip gepackte LED-Lichtquelle Multi-chip packaged LED light source |
| 07/16/2008 | EP1945013A1 Multilayer printed wiring board and method for manufacturing same |
| 07/16/2008 | EP1944802A2 Method for manufacturing a leadframe, packaging method for using the leadframe and semiconductor package product |
| 07/16/2008 | EP1253649B1 Light-emitting or light-receiving semiconductor device and method for fabricating the same |
| 07/16/2008 | CN201087904Y Light emitting diode chip packaging structure with ceramic as substrate |
| 07/16/2008 | CN101223644A 半导体装置 Semiconductor device |
| 07/16/2008 | CN101222025A Novel packaging device of organic EL device and its packaging method |
| 07/16/2008 | CN101222007A Light emitting diode with heat radiating device (3) |
| 07/16/2008 | CN101222006A Light emitting diode with heat radiating device (2) |
| 07/16/2008 | CN101221948A Bonding pad structure for optoelectronic device and fabricating method thereof |
| 07/16/2008 | CN101221947A Semiconductor component including a semiconductor chip and a passive component |
| 07/16/2008 | CN101221946A System-in-package packaging for minimizing bond wire contamination and yield loss |
| 07/16/2008 | CN101221945A Packaging body capable of repeatedly stacking |
| 07/16/2008 | CN101221944A Cooling type semiconductor packaging member |
| 07/16/2008 | CN101220908A Modularized semiconductor light source |
| 07/16/2008 | CN101219568A Method for producing a lens mould |
| 07/16/2008 | CN100403549C 半导体器件及保持电路 The semiconductor device and hold circuit |
| 07/16/2008 | CN100403537C Semiconductor device and its manufacturing method |
| 07/16/2008 | CN100403534C Microelectronic substrate with integrated devices and its manufacturing method |
| 07/16/2008 | CN100403501C Method and apparatus for filling vias |
| 07/16/2008 | CN100403500C Circuit device manufacturing method |
| 07/16/2008 | CN100403491C Semiconductor device manufacturing method |
| 07/15/2008 | US7400439 Uniform illumination system |
| 07/15/2008 | US7400134 Integrated circuit device with multiple chips in one package |
| 07/15/2008 | US7400032 Module assembly for stacked BGA packages |
| 07/15/2008 | US7400029 LED illumination system |
| 07/15/2008 | US7399683 Manufacturing method of semiconductor device |
| 07/10/2008 | WO2008082644A1 Semiconductor device and method of manufacturing the same |
| 07/10/2008 | WO2008082615A2 Semiconductor device and method for manufacturing the same |
| 07/10/2008 | WO2008080991A1 Method for determining the cooling efficiency and method for determining a heat sink surface |
| 07/10/2008 | WO2008080383A1 Optoelectronic arrangement and method for operating such an optoelectronic arrangement |
| 07/10/2008 | WO2008064081A3 High efficiency light emitting diodes and methods of forming the same |
| 07/10/2008 | WO2008021575A3 Microelectronic package |
| 07/10/2008 | US20080166836 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
| 07/10/2008 | US20080164621 Electric power semiconductor device |
| 07/10/2008 | US20080164611 Method for making an integrated circuit having a via hole |
| 07/10/2008 | US20080164586 Thin semiconductor package having stackable lead frame and method of manufacturing the same |
| 07/10/2008 | US20080164482 Light-Emitting Device and Method for Manufacturing Same |
| 07/10/2008 | DE69738172T2 Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat An integrated circuit on a substrate and a method for ultrabiegsamen a wire connection between a integrated circuit and a substrate ultrabiegsamen |
| 07/10/2008 | DE19549705B4 High-density packaging multi-chip semiconductor module - includes signal transmission substrate with wiring layer for transmitting signals and feeder substrate with containers for accommodating semiconductor bare chips which are bonded to wiring layer |
| 07/10/2008 | DE112005003614T5 Halbleiterbaugruppe für ein Schaltnetzteil und Verfahren zu dessen Montage A semiconductor assembly for a switching power supply and process for its mounting |
| 07/10/2008 | DE102008003092A1 Method for manufacturing of light emitting diode matrix, involves providing multiple light emitting diode chip strips and intermediate layer is formed between adjacent light emitting diode chip strips |
| 07/10/2008 | DE102007001285A1 Method for assembly and contacting of electrically conducting semiconductor components, involves bonding electrically conducting bearing surface of individual semiconductor components directly on electrically isolating supporting substrate |
| 07/10/2008 | DE102004042367B4 Leistungshalbleitermodul The power semiconductor module |
| 07/09/2008 | EP1942301A2 Microelectronics package and method |
| 07/09/2008 | EP1743369A4 Micropede stacked die component assembly |
| 07/09/2008 | CN201084731Y A two-color chip-type light-emitting diode |
| 07/09/2008 | CN201084730Y LED encapsulation structure |
| 07/09/2008 | CN201084504Y An electro-sensitive rheostat |
| 07/09/2008 | CN101218862A 电子元件安装方法 Electronic component mounting method |
| 07/09/2008 | CN101217251A A monocycle feedforward switch control circuit |