| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/07/2008 | DE102007003587A1 Leistungshalbleitermodul mit Druckkörper Power semiconductor module with a pressure body |
| 08/07/2008 | DE102005050534B4 Leistungshalbleitermodul The power semiconductor module |
| 08/06/2008 | EP1952439A2 Semiconductor device comprising a housing containing a triggering unit |
| 08/06/2008 | CN101238579A Method of assembling semiconductor devices with LEDs |
| 08/06/2008 | CN101238578A Method for preparing circuit containing multiple LED |
| 08/06/2008 | CN101237746A Electronic board incorporating a heater wire |
| 08/06/2008 | CN101237219A Oscillator |
| 08/06/2008 | CN101237012A LED and its assembly method |
| 08/06/2008 | CN101236964A Semiconductor device including switching element and two diodes |
| 08/06/2008 | CN101236963A Semiconductor device and packaging structure therefor |
| 08/06/2008 | CN101236962A Multi-chip stacking structure and its making method |
| 08/06/2008 | CN101236961A LED device |
| 08/06/2008 | CN101236960A Multifold LED device for mine lamp |
| 08/06/2008 | CN101236959A Encapsulation structure for multi-chip interleaving stack |
| 08/06/2008 | CN101236946A 布线板和半导体器件 Wiring boards and semiconductor devices |
| 08/06/2008 | CN101236944A Added layer encapsulation structure for photoelectric chip and its method |
| 08/06/2008 | CN101236939A Semiconductor encapsulation device |
| 08/06/2008 | CN101236909A Chip package structure and its package method |
| 08/06/2008 | CN100409440C Matrix type LED and manufacturing method thereof |
| 08/06/2008 | CN100409435C Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof |
| 08/06/2008 | CN100409425C Fabrication process and using method for three dimensional structure memory |
| 08/05/2008 | US7409659 System and method for suppressing crosstalk glitch in digital circuits |
| 08/05/2008 | US7409190 Radio-frequency circuit module and radio communication apparatus |
| 08/05/2008 | US7408566 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 08/05/2008 | US7408383 FPGA architecture having two-level cluster input interconnect scheme without bandwidth limitation |
| 08/05/2008 | US7408381 Circuit for and method of implementing a plurality of circuits on a programmable logic device |
| 08/05/2008 | US7408291 Piezoelectric oscillator, manufacturing method thereof, and electronic device |
| 08/05/2008 | US7408256 Integrated circuit chip module |
| 08/05/2008 | US7408255 Assembly for stacked BGA packages |
| 08/05/2008 | US7408249 Packaged integrated circuits and methods of producing thereof |
| 08/05/2008 | US7408226 Electronic card with protection against aerial discharge |
| 08/05/2008 | US7408203 Light emitting device and fabrication method thereof and light emitting system using the same |
| 08/05/2008 | US7408169 Image sensing apparatus and method using radiation |
| 08/05/2008 | US7408167 Imaging apparatus, radiation imaging apparatus, and radiation imaging system |
| 08/05/2008 | US7408165 Detector arrangement |
| 08/05/2008 | US7408156 System and method for identifying and classifying dynamic thermodynamic processes in mammals and discriminating between and among such processes |
| 07/31/2008 | WO2008091474A2 Stackable leadless electronic package |
| 07/31/2008 | WO2008091220A1 Trench isolation for reduced cross talk |
| 07/31/2008 | WO2008090734A1 Semiconductor device for power |
| 07/31/2008 | WO2008089855A1 Power converter |
| 07/31/2008 | WO2008089725A2 Electrical component with a carrier substrate and a semiconductor chip |
| 07/31/2008 | WO2008070417A3 Color tunable illumination source and method for controlled illumination |
| 07/31/2008 | WO2008027746B1 Metal core foldover packages structures, systems including the same and methods of fabrication |
| 07/31/2008 | US20080180121 Probe card assembly and kit |
| 07/31/2008 | US20080179732 Working Method of Metal Material and Semiconductor Apparatus Fabricated by the Method |
| 07/31/2008 | US20080179723 Semiconductor device including a plural chips with protruding edges laminated on a die pad section that has a through section |
| 07/31/2008 | US20080179603 Light-emitting device having light-emitting elements |
| 07/31/2008 | US20080179520 Direct-view focal plane array |
| 07/31/2008 | US20080178463 Modular board device, high frequency module, and method of manufacturing the same |
| 07/31/2008 | DE102008003156A1 Mehrchip-Packung und Verfahren zu ihrer Ausbildung Multi-chip package and method for their education |
| 07/31/2008 | DE102007004393A1 Semiconductor light source i.e. high power LED, control circuit for use in circuit carrier, is provided in circuit carrier, produces pulse with pulse length less than three microseconds, and regulates rated current within pulse |
| 07/31/2008 | DE102007004284A1 Method for manufacturing semiconductor chips, involves providing semiconductor wafers with multiple lines and columns arranged in semiconductor chip positions, where semiconductor wafers have integrated circuits |
| 07/31/2008 | DE102007002961A1 Memory device for electrical devices, mobile phones and personal digital assistants, has memory pack of stored memory chips, which are displaced in relation to each other |
| 07/30/2008 | EP1951015A1 Printed wiring board and method for manufacturing printed wiring board |
| 07/30/2008 | EP1950807A1 Power semiconductor module with pressure body |
| 07/30/2008 | EP1950806A1 Interposer with built-in passive part |
| 07/30/2008 | EP1949441A2 Chip assembly and method of manufacturing thereof |
| 07/30/2008 | EP1949427A2 High density three dimensional semiconductor die package |
| 07/30/2008 | EP1948993A1 Tiles for solid state lighting |
| 07/30/2008 | EP1886343A4 Lead free solar cell contacts |
| 07/30/2008 | EP1534992A4 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 07/30/2008 | EP1108180B1 Vehicle headlamp and a vehicle |
| 07/30/2008 | CN201093376Y Polycrystal packaging LED lamp |
| 07/30/2008 | CN101233614A Capacitor-equipped semiconductor device |
| 07/30/2008 | CN101232783A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232779A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232778A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232777A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232776A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232775A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232064A Illuminating device |
| 07/30/2008 | CN101232033A Image sensor module and the method of the same |
| 07/30/2008 | CN101232014A Organic illuminated display element and manufacturing method thereof |
| 07/30/2008 | CN101232013A Organic illuminated display element and manufacturing method thereof |
| 07/30/2008 | CN101232012A Stack type semiconductor packaging structure |
| 07/30/2008 | CN101232011A Stack type chip packaging structure and manufacturing method thereof |
| 07/30/2008 | CN101232010A Thick film mixed circuit device |
| 07/30/2008 | CN101232009A Mounting structures for integrated circuit modules |
| 07/30/2008 | CN101232008A Multi-chips package and method of forming the same |
| 07/30/2008 | CN101232007A Light emitting diode package, backlight unit and liquid crystal display having the same |
| 07/30/2008 | CN101232006A Multiple grains module device |
| 07/30/2008 | CN101232005A Alternating-current/direct-current converter of MCM (Multi crystal grain module) |
| 07/30/2008 | CN101232004A Chip stack package structure |
| 07/30/2008 | CN101231709A Structure of memory card and the method of the same |
| 07/30/2008 | CN101231196A Temperature detection method of semiconductor device and power conversion apparatus |
| 07/30/2008 | CN100407455C 用于辐射元件的外壳及其加工方法和辐射元件 Housing and a processing method for the radiating element and the radiating element |
| 07/30/2008 | CN100407445C 用于成像探测器的封装结构 Package for imaging detector |
| 07/30/2008 | CN100407423C 半导体器件以及半导体封装 A semiconductor device and a semiconductor package |
| 07/30/2008 | CN100407422C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/30/2008 | CN100407421C 层叠型半导体存储装置 The layered semiconductor memory device |
| 07/30/2008 | CN100407420C 半导体装置及其制造方法、电路基板以及电子设备 Semiconductor device and manufacturing method of a circuit board and an electronic device |
| 07/29/2008 | US7405991 Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices |
| 07/29/2008 | US7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 07/29/2008 | US7405486 Circuit device |
| 07/29/2008 | US7405485 Semiconductor device |
| 07/29/2008 | US7405484 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 07/29/2008 | US7405472 Semiconductor device |
| 07/29/2008 | US7405471 Carrier-based electronic module |
| 07/29/2008 | US7405468 Plastic package and method of fabricating the same |
| 07/29/2008 | US7405407 Ion beam therapy system and its couch positioning method |