| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/21/2008 | WO2008099711A1 Semiconductor device |
| 08/21/2008 | WO2008082615A3 Semiconductor device and method for manufacturing the same |
| 08/21/2008 | WO2008051596A3 Solid state light sheet and encapsulated bare die semiconductor circuits |
| 08/21/2008 | WO2007147278A3 Led light source and method |
| 08/21/2008 | DE202008008414U1 Photodiodenmodul The photodiode module |
| 08/21/2008 | DE10334079B4 Transistormodul Transistor module |
| 08/21/2008 | DE102008008141A1 Leistungshalbleitermodul und Verfahren zu seiner Herstellung The power semiconductor module and method for its preparation |
| 08/21/2008 | DE102008008057A1 Verfahren zur Herstellung von in Kompaktgehäusen untergebrachten Lichtemissionsvorrichtungen mit mehreren optischen Elementen durch Formpressen A process for preparing accommodated in compact housings light emitting device having a plurality of optical elements by molding |
| 08/21/2008 | DE102007007142A1 Nutzen, Halbleiterbauteil sowie Verfahren zu deren Herstellung Use semiconductor device, and methods for their preparation |
| 08/21/2008 | DE102007005630A1 Halbleiterchip-Modul A semiconductor chip module |
| 08/21/2008 | DE102007002403A1 Illuminating arrangement for e.g. dome light of vehicle, has light decoupling surface turned away from semiconductor components, and side surfaces running perpendicular or transverse to light outlet surface |
| 08/21/2008 | DE102005005622B4 Sicherheits-Chipstapel und ein Verfahren zum Herstellen eines Sicherheits-Chipstapels Security chip stack and a method for manufacturing a security chip stack |
| 08/21/2008 | DE102004025773B4 Elektronisches Bauelement mit thermisch voneinander isolierten Bereichen Electronic component with thermally insulated from one another areas |
| 08/21/2008 | DE102004018477B4 Halbleitermodul Semiconductor module |
| 08/21/2008 | DE10113967B4 Leistungsmodule Power Modules |
| 08/20/2008 | EP1959494A1 Semiconductor power module |
| 08/20/2008 | EP1958257A2 Light emitting diode construction |
| 08/20/2008 | CN101248527A Power semiconductor module with load connecting element installed on circuit carrier |
| 08/20/2008 | CN101248526A Semiconductor device and method of producing the same |
| 08/20/2008 | CN101246945A Edge transmitting type LED packaging structure |
| 08/20/2008 | CN101246882A Semiconductor device package with multi-chips and method of the same |
| 08/20/2008 | CN101246881A Electronic packaging structure |
| 08/20/2008 | CN101246880A LED array packaging structure with silica carrier plate and its production method |
| 08/20/2008 | CN101246879A White light LED packaging structure with silica substrate and its production method |
| 08/20/2008 | CN101246878A LED chip packaging structure with ceramic as substrate and its production method |
| 08/20/2008 | CN101246877A Poly-crystal face-to-face stacking and packaging construction |
| 08/20/2008 | CN101246876A High-light efficiency high-color rendering LED lamp and method for acquiring the same |
| 08/20/2008 | CN101246861A Package board and method for manufacturing thereof |
| 08/20/2008 | CN100413386C Method of mounting wafer on printed wiring substrate |
| 08/20/2008 | CN100413079C Method for making image sensor with recessed planarizing layers |
| 08/20/2008 | CN100413071C Light-emitting diode lamp using AC power supply and its manufacturing method |
| 08/20/2008 | CN100413070C Module with a built-in component, electronic device with the same, and manufacturing method of module with a built-in component |
| 08/20/2008 | CN100413060C Semiconductor device |
| 08/20/2008 | CN100413057C High-heat-resistant semiconductor device |
| 08/20/2008 | CN100413056C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 08/20/2008 | CN100412891C Package structure and method of radio-frequency identifying volume label jointed with microassembly |
| 08/20/2008 | CN100412688C Light source device and projection display device |
| 08/20/2008 | CN100412644C Illumination device for backlighting an image reproduction device |
| 08/19/2008 | US7415688 Method of manufacturing surface-emitting backlight, by molding contact member integrally with molded case |
| 08/19/2008 | US7414858 Method of manufacturing an electronic device |
| 08/19/2008 | US7414433 Interconnect structure enabling indirect routing in programmable logic |
| 08/19/2008 | US7414429 Integration of high-speed serial interface circuitry into programmable logic device architectures |
| 08/19/2008 | US7414320 Semiconductor device and method of manufacturing same |
| 08/19/2008 | US7414311 Ball grid array housing having a cooling foil |
| 08/19/2008 | US7414269 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component |
| 08/19/2008 | US7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
| 08/19/2008 | US7413928 Die-wafer package and method of fabricating same |
| 08/14/2008 | WO2008097997A1 Semiconductor module with micro-buffers |
| 08/14/2008 | WO2008097090A1 Sealed ball grid array package |
| 08/14/2008 | WO2008095811A1 Method of interconnecting electronic wafers |
| 08/14/2008 | WO2008057686A3 Template for three-dimensional thin-film solar cell manufacturing and methods of use |
| 08/14/2008 | WO2008030587A3 Small footprint high power light emitting package with plurality of light emitting diode chips |
| 08/14/2008 | US20080192450 Electronics Module and Method for Manufacturing the Same |
| 08/14/2008 | US20080191805 Electronic Circuit and Method for Manufacturing an Electronic Circuit |
| 08/14/2008 | US20080191620 Light Emitting Device and Illuminating Device |
| 08/14/2008 | US20080191364 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
| 08/14/2008 | US20080191338 Semiconductor memory device, memory device support and memory module |
| 08/14/2008 | US20080191220 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| 08/14/2008 | US20080190477 Terminal Box for Solar Cell Modules |
| 08/14/2008 | DE10257100B4 Leistungsschalter Circuit breaker |
| 08/13/2008 | EP1956654A2 Semiconductor switch for high voltages |
| 08/13/2008 | EP1956653A1 Switching device with bonded SMD component |
| 08/13/2008 | EP1956652A1 Sealed ball grid array package |
| 08/13/2008 | EP1955375A2 Method and apparatus for blocking light to peripheral circuitry of an imager device |
| 08/13/2008 | EP1955374A1 3d electronic module |
| 08/13/2008 | EP1454516B1 Power module and power module assembly |
| 08/13/2008 | CN201100917Y Efficient LED encapsulation structure |
| 08/13/2008 | CN101243547A Semiconductor chip and method of manufacturing semiconductor chip and semiconductor device |
| 08/13/2008 | CN101241928A Electric module, methods of manufacturing the same, and electronic instrument |
| 08/13/2008 | CN101241910A Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip |
| 08/13/2008 | CN101241906A Semiconductor device and manufacturing method thereof, semiconductor package, electronic device and manufacturing method thereof, and electronic apparatus |
| 08/13/2008 | CN101241905A Semiconductor device |
| 08/13/2008 | CN101241904A Square flat non-connection pin multi-chip encapsulation structure |
| 08/13/2008 | CN101241903A Wiring board, semiconductor device having the wiring board, and manufacturing and packaging method thereof |
| 08/13/2008 | CN101241902A Multi-chip semiconductor encapsulation part and its making method |
| 08/13/2008 | CN101241895A Printed circuit board and semiconductor memory module using the same |
| 08/13/2008 | CN101241892A Multi-wafer piling base plate and multi-wafer piling encapsulation structure based on this base plate |
| 08/13/2008 | CN100411261C 半导体装置 Semiconductor device |
| 08/13/2008 | CN100411202C White light emitting diode |
| 08/13/2008 | CN100411197C Solar cell module edge face sealing member and solar cell module employing same |
| 08/13/2008 | CN100411196C Light receiving or emitting semiconductor apparatus |
| 08/13/2008 | CN100411172C 半导体器件 Semiconductor devices |
| 08/13/2008 | CN100411171C Three-primary color LED pixel module |
| 08/13/2008 | CN100411170C Stack architecture of multiple chips |
| 08/13/2008 | CN100411169C Apparatus and methods for cooling semiconductor integrated circuit chip packages |
| 08/13/2008 | CN100411156C Resin-sealed semiconductor device and method of manufacturing the same |
| 08/13/2008 | CN100411127C Semiconductor device and manufacturing method of the same |
| 08/12/2008 | US7412031 Radiation imaging apparatus, radiation imaging system and radiation imaging method |
| 08/12/2008 | US7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 08/12/2008 | US7411282 LSI package provided with interface module, and transmission line header employed in the package |
| 08/12/2008 | US7410832 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 08/12/2008 | US7410827 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
| 08/07/2008 | WO2008093957A1 High frequency module and manufacturing method thereof |
| 08/07/2008 | WO2008093549A1 Substrate module |
| 08/07/2008 | WO2008092437A1 Assembly and method for generating mixed light |
| 08/07/2008 | WO2007120175A3 Apparatus and methods for solar energy conversion using nanoscale cometal structures |
| 08/07/2008 | US20080188071 Low fabrication cost, fine pitch and high reliability solder bump |
| 08/07/2008 | US20080185733 Lsi package provided with interface module, and transmission line header employed in the package |
| 08/07/2008 | US20080185520 Photothermal Inspection Camera Having an Offset Adjusting Device |
| 08/07/2008 | DE102008006129A1 Elektromagnetische Bandlückenstruktur und Leiterplatte Electromagnetic bandgap structure and printed circuit board |