| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/04/2008 | US20080211105 Method of assembling chips |
| 09/04/2008 | US20080211077 Low profile chip scale stacking system and method |
| 09/04/2008 | US20080211010 Semiconductor device |
| 09/04/2008 | DE10312238B4 Leistungshalbleitereinrichtung Power semiconductor device |
| 09/04/2008 | DE10250877B4 Lichtemittierendes Halbleiterbauelement, Herstellungsverfahren und Verwendung dafür, eine Vielzahl der lichtemittierenden Halbleiterbauelemente enthaltendes Modul und dessen Verwendung A light-emitting semiconductor device, production process and use for a plurality of light emitting semiconductor devices containing module and its use |
| 09/04/2008 | DE102008006835A1 Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements An electronic device and method for manufacturing an electronic component |
| 09/04/2008 | DE102007007223A1 Power semiconductor module comprises partial modules, which have housing, where partial modules are connected with each other by connecting elements in power semiconductor module |
| 09/03/2008 | EP1965445A2 Semiconductor light emitting apparatus |
| 09/03/2008 | EP1964450A1 Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof |
| 09/03/2008 | EP1964186A2 Collimation arrangement and illumination system and display device using the same |
| 09/03/2008 | EP1964173A1 Microcomponent comprising two wafers interconnected by pins and the associated interconnection process |
| 09/03/2008 | EP0885483B1 Push-pull power amplifier |
| 09/03/2008 | CN101258596A 半导体器件 Semiconductor devices |
| 09/03/2008 | CN101258439A Backlighting arrangement with semiconductor light sources arranged in light groups and lighting device |
| 09/03/2008 | CN101257074A Novel LED and LCD back light source using the same |
| 09/03/2008 | CN101257073A Optical module |
| 09/03/2008 | CN101257015A Organic electroluminescent device and fabrication method thereof |
| 09/03/2008 | CN101257014A LED white source with improved color rendering |
| 09/03/2008 | CN101257013A Semiconductor device and semiconductor module using the same |
| 09/03/2008 | CN101257012A Light-emmitting device |
| 09/03/2008 | CN101257011A Low profile flip chip power module and method of making |
| 09/03/2008 | CN101257010A LED illuminating device with high heat radiation performance |
| 09/03/2008 | CN101257009A LED encapsulation body and encapsulation method thereof |
| 09/03/2008 | CN101257008A 半导体装置 Semiconductor device |
| 09/03/2008 | CN101257007A Semiconductor device having time sequence structure |
| 09/03/2008 | CN101257006A Illuminating device |
| 09/03/2008 | CN101256968A LED illuminating device and manufacture method thereof |
| 09/03/2008 | CN101256966A Semiconductor component and method of manufacture |
| 09/03/2008 | CN101256964A Method for manufacturing a plurality of surface adhering type LED structure thereof |
| 09/03/2008 | CN101256963A LED chip packaging structure with thick guide feet and manufacturing method thereof |
| 09/03/2008 | CN100416828C Integrated lamp with feedback and wireless control |
| 09/03/2008 | CN100416827C 封装元件 Packaging components |
| 09/03/2008 | CN100416826C Capacitance type physical quantity sensor having sensor chip and circuit chip |
| 09/03/2008 | CN100416825C Packaging structure of poly crystal sheet |
| 09/03/2008 | CN100416808C Chip packaging body without kernel dielectric layer and stack chip packaging structure |
| 09/03/2008 | CN100416789C Method for arraying chip of first lining to second lining |
| 09/03/2008 | CN100416781C System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
| 09/02/2008 | US7420392 Programmable gate array and embedded circuitry initialization and processing |
| 09/02/2008 | US7420389 Clock distribution in a configurable IC |
| 09/02/2008 | US7420281 Stacked chip semiconductor device |
| 09/02/2008 | US7420266 Circuit device and manufacturing method thereof |
| 09/02/2008 | US7420262 Electronic component and semiconductor wafer, and method for producing the same |
| 09/02/2008 | US7420224 Active rectifier module for three-phase generators of vehicles |
| 08/28/2008 | WO2008103518A1 Packaged ic device comprising an embedded flex circuit, and methods of making same |
| 08/28/2008 | WO2008102814A1 Semiconductor device performing signal transmission by using inductor coupling |
| 08/28/2008 | WO2008102476A1 Electronic circuit device, process for manufacturing the same and display apparatus |
| 08/28/2008 | WO2008102287A1 A led luminaire |
| 08/28/2008 | WO2008101525A1 Illuminant |
| 08/28/2008 | WO2008101524A1 Electrical connection for semiconductor structures, method for the production thereof, and use of such a connection in a luminous element |
| 08/28/2008 | WO2008101481A1 Led module |
| 08/28/2008 | WO2008101456A1 Radiation emitting semi-conductor body having an electrically conductive contact layer permeable to the emitted radiation |
| 08/28/2008 | WO2007132432A3 Stacked dies and manufacturing method thereof |
| 08/28/2008 | US20080203584 Stacked-type semiconductor package |
| 08/28/2008 | US20080203575 Integrated Circuit with Re-Route Layer and Stacked Die Assembly |
| 08/28/2008 | US20080203554 Semiconductor integrated circuit device |
| 08/28/2008 | US20080203457 Fast switching power insulated gate semiconductor device |
| 08/28/2008 | US20080202899 Power electronic switching device with laminated bus |
| 08/28/2008 | DE102008011061A1 Led-Weisslichtquelle mit verbesserter Farbwiedergabe Led white light source with improved color reproduction |
| 08/28/2008 | DE102008008514A1 Multichipmodul Multi-chip module |
| 08/28/2008 | DE102008008058A1 Verfahren zur Herstellung von in Kompaktgehäusen untergebrachten Lichtemissionsvorrichtungen mit vorderseitigen Kontakten durch Formpressen A process for preparing accommodated in compact housings light emitting devices with front-side contacts by compression molding |
| 08/28/2008 | DE102007009531A1 Jet device manufacturing method, involves separating common casting bodies and common separation body in carrier body, and arranging transmission units, receiving units, transparent casting bodies and opaque separation body on carrier body |
| 08/28/2008 | DE102007009351A1 Leuchtmittel Lamp |
| 08/28/2008 | DE102007009229A1 Light source for illuminant for illuminant arrangement, has multiple carrier element plates, each carrier element plate is flat surface section on which light emitting diode is arranged |
| 08/28/2008 | DE102007007224A1 Leistungshalbleitermodul The power semiconductor module |
| 08/28/2008 | DE102005015036B4 Verfahren zur Montage eines Chips auf einer Unterlage A method of mounting a chip on a base |
| 08/28/2008 | DE102004049249B4 Elektronikmodul, Waferprodukt und Herstellungsverfahren Electronics module, wafer product and manufacturing process |
| 08/28/2008 | DE102004027185B4 Niederinduktives Halbleiterbauelement mit Halbbrückenkonfiguration Niederinduktives semiconductor component with a half-bridge configuration |
| 08/27/2008 | EP1962342A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 08/27/2008 | EP1962331A2 Thin-film solar cell and method of manufacturing the same |
| 08/27/2008 | CN101253627A Circuit device and method for manufacturing same |
| 08/27/2008 | CN101253626A Circuit device and method for manufacturing same |
| 08/27/2008 | CN101253362A Light emitting diode comprising multiple dies and optical system with number of lens elements |
| 08/27/2008 | CN101252125A Multi-chips package with reduced structure and method for forming the same |
| 08/27/2008 | CN101252124A Semiconductor device and method of manufacturing the same |
| 08/27/2008 | CN101252123A High-frequency signal processing module and electronic device |
| 08/27/2008 | CN101252122A Hermetically sealed optoelectronic mems wafer level package |
| 08/27/2008 | CN101252121A Stack package and method of manufacturing the same |
| 08/27/2008 | CN101252120A Adjustable color temperature and color development luminous diode |
| 08/27/2008 | CN101252115A Semiconductor package and manufacture method thereof as well as electric system and manufacture method thereof |
| 08/27/2008 | CN101252109A Optoelectronic module provided with at least one photoreceptor cell |
| 08/27/2008 | CN101252092A Multi-chip packaging structure and making method thereof |
| 08/27/2008 | CN100414726C LED chip package and packaging method thereof |
| 08/27/2008 | CN100414704C Plane flip-chip LED integrated chip and producing method |
| 08/27/2008 | CN100414703C Method of manufacturing a semiconductor device |
| 08/27/2008 | CN100414702C Semiconductor packing and manufacturing method |
| 08/27/2008 | CN100414701C Light-emitting system, light-emitting device, and forming method therefor |
| 08/27/2008 | CN100414697C DC-DC converter implemented in a land grid array package |
| 08/27/2008 | CN100414696C Lead frame, its manufacturing method and resin sealed semiconductor device and its manufacturing method |
| 08/27/2008 | CN100414690C Great power device and its heat sink pressure-mounting method |
| 08/27/2008 | CN100414378C LED illumination system having an intensity monitoring system |
| 08/26/2008 | US7417716 Multiple ranging apparatus |
| 08/26/2008 | US7417323 Neo-wafer device and method |
| 08/26/2008 | US7417322 Multi-chip module with embedded package and method for manufacturing the same |
| 08/26/2008 | US7417299 Direct connection multi-chip semiconductor element structure |
| 08/26/2008 | US7417259 Light-emitting device having light-emitting elements |
| 08/26/2008 | US7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it |
| 08/26/2008 | US7417016 Composition for the removing of sidewall residues |
| 08/26/2008 | US7416919 Method for wafer level stack die placement |
| 08/21/2008 | WO2008101232A1 Multiple-wavelength opto- electronic device including a semiconductor atomic superlattice and associated fabrication methods |
| 08/21/2008 | WO2008099856A1 Elecric device-installed apparatus and its noise reduction method |