| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 12/24/2014 | CN104241209A 一种室外用电源专用功率模块 One kind of special power supply module for outdoor use |
| 12/24/2014 | CN104241208A 半导体装置 Semiconductor device |
| 12/24/2014 | CN104233579A 一种含芯压电纤维织物 Piezoelectric fabric containing core |
| 12/24/2014 | CN102693969B 一种igbt功率模块 One kind igbt power module |
| 12/24/2014 | CN102629657B 一种拉夹式薄片led贴片结构及其贴片方法 Pull one kind of clip-thin SMD led structure and placement method |
| 12/24/2014 | CN102210022B 包括多个封装的半导体芯片的固态驱动器或者其它存储装置 Includes a plurality of encapsulated solid state drive of the semiconductor chip or other memory device |
| 12/24/2014 | CN102169938B 发光器件、发光器件封装以及照明系统 A light emitting device, a light emitting device package and a lighting system |
| 12/24/2014 | CN102157506B 发光装置 Light-emitting device |
| 12/23/2014 | US8917522 Semiconductor device |
| 12/23/2014 | US8917509 Electric power conversion apparatus |
| 12/23/2014 | US8917235 User control input device |
| 12/23/2014 | US8917107 Circuit board having bypass pad |
| 12/23/2014 | US8916981 Epoxy-amine underfill materials for semiconductor packages |
| 12/23/2014 | US8916976 Semiconductor device and method of manufacturing the same |
| 12/23/2014 | US8916963 Power module for an automobile |
| 12/23/2014 | US8916958 Semiconductor package with multiple chips and substrate in metal cap |
| 12/23/2014 | US8916956 Multiple die packaging interposer structure and method |
| 12/23/2014 | US8916955 Nearly buffer zone free layout methodology |
| 12/23/2014 | US8916905 Photoelectric conversion device |
| 12/23/2014 | US8916903 Light emitting device |
| 12/23/2014 | US8916901 Semiconductor light emitting device and method for manufacturing the same |
| 12/23/2014 | US8916900 Optoelectronic module and method of producing an optoelectronic module |
| 12/23/2014 | US8916886 Optoelectronic semiconductor component |
| 12/23/2014 | US8916875 Semiconductor packages |
| 12/23/2014 | US8916481 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture |
| 12/23/2014 | US8916473 Method for forming through-base wafer vias for fabrication of stacked devices |
| 12/23/2014 | US8916468 Semiconductor device fabrication method |
| 12/23/2014 | US8916452 Semiconductor device and method of forming WLCSP using wafer sections containing multiple die |
| 12/23/2014 | US8916449 Package structure and substrate bonding method |
| 12/23/2014 | US8916423 Semiconductor device and method of manufacturing the same |
| 12/23/2014 | US8916417 Method of manufacturing semiconductor device having chip stacks combined in relation to the number of chips having defects |
| 12/18/2014 | US20140369646 Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates |
| 12/18/2014 | US20140369148 Memory module and memory system |
| 12/18/2014 | US20140369018 Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters |
| 12/18/2014 | US20140368394 Packaged electronic device with integrated electronic circuits having transceiving antennas |
| 12/18/2014 | US20140368266 Integrated circuit packaging for implantable medical devices |
| 12/18/2014 | US20140368242 Method and apparatus for control of a digital phase locked loop (dpll) with exponentially shaped digitally controlled oscillator (dco) |
| 12/18/2014 | US20140367867 Packaging Methods and Packaged Semiconductor Devices |
| 12/18/2014 | US20140367853 Solid-state imaging device, imaging apparatus, substrate, semiconductor device and method of manufacturing the solid-state imaging device |
| 12/18/2014 | US20140367839 Semiconductor package |
| 12/18/2014 | US20140367713 Multi-layer conversion material for down conversion in solid state lighting |
| 12/18/2014 | US20140367709 Semiconductor light emitting device lamp that emits light at large angles |
| 12/18/2014 | US20140367708 Light-emitting diode arrangement |
| 12/18/2014 | US20140367685 Semiconductor substrate and semiconductor chip |
| 12/17/2014 | CN204029858U 一种新型照明用双控三色cob A new dual-control lighting cob tricolor |
| 12/17/2014 | CN204029857U 一种光反射基板及其组成的led模组 A light reflective substrate and composition led module |
| 12/17/2014 | CN204029803U 一种平面光学耦合器 A planar optical coupler |
| 12/17/2014 | CN204029802U 一种光学耦合器 An optical coupler |
| 12/17/2014 | CN204029801U 采用倒装芯片封装的集成模组led光源 Flip chip package integrated module led light |
| 12/17/2014 | CN204029800U 白光发光器件 White light emitting device |
| 12/17/2014 | CN204029799U 八脚贴片式led灯 Eight feet SMD led lights |
| 12/17/2014 | CN204029798U Led灯芯组合光源 Led wick combination of light |
| 12/17/2014 | CN204029797U 一种c0b封装led模组 One kind of led module package c0b |
| 12/17/2014 | CN204029796U 一种单相整流桥 A single-phase rectifier bridge |
| 12/17/2014 | CN204029795U 瞬变电压抑制二极管器件 Transient voltage suppression diode device |
| 12/17/2014 | CN204029794U Igbt模块灌胶孔防护结构及防护塞 Igbt module Glue protective structure and protective plug hole |
| 12/17/2014 | CN204026300U 发光二极管模组以及由发光二极管模组所组成的发光装置 A light emitting diode module and light emitting means comprises a light emitting diode modules consisting of |
| 12/17/2014 | CN204026217U 一种360°发光led日光灯 One kind of fluorescent light led 360 ° |
| 12/17/2014 | CN204026216U 一种led镜面玻璃集成光源 One kind of mirror glass led integrated light source |
| 12/17/2014 | CN104221173A 发光半导体器件和用于制造发光半导体器件的方法 A light emitting semiconductor device and a method of manufacturing a light emitting semiconductor device |
| 12/17/2014 | CN104220914A 用于光电组件的晶圆级封装的模制玻璃盖 Optical components for wafer-level packaging of molded glass cover |
| 12/17/2014 | CN104218138A 一种wfc0b光源 One kind of light source wfc0b |
| 12/17/2014 | CN104218137A Led发光基片、led芯片c0b封装结构及采用该结构的led灯 Led light emitting chip, led chip package structure and c0b the structure using led lights |
| 12/17/2014 | CN104218034A 半导体封装 The semiconductor package |
| 12/17/2014 | CN104218033A 一种高s/p值led发光体 A high-s / p values led emitters |
| 12/17/2014 | CN104218032A 半导体装置 Semiconductor device |
| 12/17/2014 | CN104218031A 母排联接式高性能igbt模块及其制作方法 Busbar connection, high-performance igbt module and its manufacturing method |
| 12/17/2014 | CN104218030A 堆叠式多封装模块及其制造方法 Stacked multi-package module and its manufacturing method |
| 12/17/2014 | CN104218018A 一种射频功放模块及其组装方法、射频模块、基站 A radio frequency power amplifier module and assembly methods, RF modules, base station |
| 12/17/2014 | CN102569275B 堆叠式半导体封装结构及其制造方法 Stacked semiconductor package structure and manufacturing method |
| 12/17/2014 | CN102484108B 高带宽倾斜叠层芯片封装 High bandwidth tilt stacked chip package |
| 12/17/2014 | CN102412241B 半导体芯片封装件及其制造方法 The semiconductor chip package and method of manufacturing |
| 12/17/2014 | CN102194932B 发光器件及其制造方法 The light emitting device and manufacturing method thereof |
| 12/17/2014 | CN101866906B 用于降低功率电子系统中的干扰辐射的装置 Reducing interference in the system power electronic means for the radiation |
| 12/17/2014 | CN101859756B 交流式覆晶发光二极管结构及其制造方法 AC-type flip-chip light emitting diode structure and its manufacturing method |
| 12/17/2014 | CN101281919B 金属氧化物半导体型固态图像拾取器件 Metal oxide semiconductor type solid-state image pickup device |
| 12/16/2014 | US8914061 Contactless integrated circuit having NFC and UHF operating modes |
| 12/16/2014 | US8913443 Voltage regulation for 3D packages and method of manufacturing same |
| 12/16/2014 | US8913356 Composite electronic circuit assembly |
| 12/16/2014 | US8913213 Light emitting apparatus and display apparatus using the same |
| 12/16/2014 | US8913035 Optical touch panel and light guide module thereof |
| 12/16/2014 | US8912865 Power combiner, power amplifying module having the same, and signal transceiving module |
| 12/16/2014 | US8912728 Lighting device |
| 12/16/2014 | US8912662 Wafer-level package and method of manufacturing the same |
| 12/16/2014 | US8912661 Stacked die assembly having reduced stress electrical interconnects |
| 12/16/2014 | US8912659 Stacked semiconductor package and method for manufacturing the same |
| 12/16/2014 | US8912654 Semiconductor chip with integrated via |
| 12/16/2014 | US8912646 Integrated circuit assembly and method of making |
| 12/16/2014 | US8912555 Semiconductor light-emitting device |
| 12/16/2014 | US8912540 Semiconductor device |
| 12/16/2014 | US8912451 Multilayered printed circuit board and method for manufacturing the same |
| 12/16/2014 | US8912052 Semiconductor device and structure |
| 12/16/2014 | US8912050 Capping coating for 3D integration applications |
| 12/16/2014 | US8912049 PEC biasing technique for LEDs |
| 12/16/2014 | US8912043 Dual-side interconnected CMOS for stacked integrated circuits |
| 12/16/2014 | US8912023 Method and system for forming LED light emitters |
| 12/16/2014 | US8912015 Operating method of hardwired switch |
| 12/16/2014 | US8911108 Light bulb shaped lamp and lighting apparatus |
| 12/11/2014 | US20140363928 Micro device stabilization post |
| 12/11/2014 | US20140363923 Stack semiconductor package and manufacturing the same |