| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/24/2008 | CN100421174C Stacked layered type semiconductor memory device |
| 09/24/2008 | CN100421136C Plasma display device |
| 09/23/2008 | US7427810 Semiconductor device including semiconductor element mounted on another semiconductor element |
| 09/23/2008 | US7427804 Optoelectronic semiconductor device and light signal input/output device |
| 09/23/2008 | US7427782 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| 09/23/2008 | US7427535 Semiconductor/printed circuit board assembly, and computer system |
| 09/23/2008 | US7427517 Stacking apparatus and method for stacking integrated circuit elements |
| 09/18/2008 | WO2008112128A2 Light emitting diode for harsh environments |
| 09/18/2008 | WO2008111409A1 Semiconductor chip, and semiconductor device |
| 09/18/2008 | WO2008111408A1 Multilayer wiring board and method for manufacturing the same |
| 09/18/2008 | WO2008094835A3 Socket mounting of component in an optical system |
| 09/18/2008 | WO2008024177A3 Solar cpv cell module and method of safely assembling, installing, and/or maintaining the same |
| 09/18/2008 | US20080227237 Method of assembling chips |
| 09/18/2008 | DE112006002909T5 Geschichtetes Wafer- oder Die-Packaging mit verbesserter Wärme- und Bauteil-Leistungsfähigkeit Layered wafer or die packaging with improved thermal efficiency and component |
| 09/18/2008 | DE102008014323A1 Bildsensormodul mit einer Packageeinbauausnehmung und Verfahren zu deren Herstellung Image sensor module with a process for their preparation and Packageeinbauausnehmung |
| 09/17/2008 | EP1970968A1 Light emitting device, semiconductor device, and its manufacturing method |
| 09/17/2008 | EP1970422A2 Adhesive film for stacking semiconductor chips |
| 09/17/2008 | EP1969631A2 Microelectronic intercionnect substrate and packaging techniques |
| 09/17/2008 | EP1969630A1 Illumination device, illumination control apparatus, illumination system |
| 09/17/2008 | EP1969629A2 One piece, collapsible pv assembly |
| 09/17/2008 | EP1969626A1 Electronic module, and method for producing one |
| 09/17/2008 | EP1969600A2 Configurable inputs and outputs for memory stacking system and method |
| 09/17/2008 | CN201118441Y High-performance and high-reliability negative voltage generation circuit |
| 09/17/2008 | CN201118433Y Plastic encapsulated insertion slice one-way commutation square bridge |
| 09/17/2008 | CN201118432Y Plastic three-phase bridge commutator |
| 09/17/2008 | CN201118431Y One-way commutation square bridge for plastic round lead |
| 09/17/2008 | CN201117679Y Light-emitting component radiating module |
| 09/17/2008 | CN201117664Y Solar cell possessing LED |
| 09/17/2008 | CN201117657Y Light emitting diode packaging structure |
| 09/17/2008 | CN201117656Y Luminous diode packaging structure |
| 09/17/2008 | CN201117655Y Led |
| 09/17/2008 | CN201117654Y luminous diode sub-adhesion substrate packaging structure |
| 09/17/2008 | CN201117651Y Modified type sticker type hyper-high-frequency bridge rectifier |
| 09/17/2008 | CN101268550A Hybrid integrated circuit device and method for manufacturing same |
| 09/17/2008 | CN101268548A Microelectronic packages and methods therefor |
| 09/17/2008 | CN101266990A Image sensor module having build-in package cavity and the method of the same |
| 09/17/2008 | CN101266968A Light emitting device and method for manufacturing the same |
| 09/17/2008 | CN101266967A Stacking chip encapsulation structure and its making method |
| 09/17/2008 | CN101266966A Multi-core encapsulation module and its making method |
| 09/17/2008 | CN101266965A Overlapping structure for semiconductor encapsulation body and its making method |
| 09/17/2008 | CN101265393A Adhesive film for stacking semiconductor chip |
| 09/17/2008 | CN100420050C A light emitting source and a light emitting source array |
| 09/17/2008 | CN100420019C Packaging method for colony light-emitting diode chips and devices thereof |
| 09/17/2008 | CN100420018C Circuit module and method for manufacturing the same |
| 09/17/2008 | CN100420017C Packaging structure with mixed circuitry and composite substrate |
| 09/17/2008 | CN100419479C Snap-fit optical element for optical coupling between a light source and target element |
| 09/16/2008 | US7426259 Imaging system and method that removes an electrical charge from a sensor |
| 09/16/2008 | US7425763 Electronic circuit package |
| 09/16/2008 | US7425757 Semiconductor power module |
| 09/16/2008 | US7425755 Semiconductor package, method for manufacturing the same and lead frame for use in the same |
| 09/16/2008 | US7425747 Semiconductor device |
| 09/16/2008 | US7425466 Wire bonding system and method of use |
| 09/16/2008 | US7425462 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
| 09/16/2008 | US7425459 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 09/12/2008 | WO2008108970A2 Chips having rear contacts connected by through vias to front contacts |
| 09/12/2008 | WO2008108335A1 Semiconductor device |
| 09/12/2008 | WO2008108334A1 Semiconductor device and method for manufacturing the semiconductor device |
| 09/12/2008 | WO2008106941A1 Light emitting module and method for the production of a light emitting module |
| 09/12/2008 | WO2008085391A3 Stacked packages |
| 09/12/2008 | WO2008083133A3 Semiconductor device having multiple die redistribution layer |
| 09/11/2008 | US20080217767 Stacked-Chip Semiconductor Device |
| 09/11/2008 | US20080217615 Method for arranging chips of a first substrate on a second substrate |
| 09/11/2008 | DE102007011123A1 Licht emittierendes Modul und Herstellungsverfahren für ein Licht emittierendes Modul Light-emitting module and manufacturing method for emitting a light module |
| 09/10/2008 | EP1968188A1 Class D amplifier assembly |
| 09/10/2008 | EP1968116A1 Display apparatus |
| 09/10/2008 | EP1968115A2 Light emitting device |
| 09/10/2008 | EP1968107A1 Soldering method and semiconductor module manufacturing method |
| 09/10/2008 | EP1966825A1 Process for the collective fabrication of 3d electronic modules |
| 09/10/2008 | EP1716595B1 Semiconductor component comprising a stack of semiconductor chips and method for producing the same |
| 09/10/2008 | EP0985226B1 Method for manufacturing electric modules |
| 09/10/2008 | CN201112415Y Pin type high power LED device |
| 09/10/2008 | CN201112392Y Decorative solar energy battery components |
| 09/10/2008 | CN201112386Y Perforation type luminescent diode chip packing structure using ceramic as substrate |
| 09/10/2008 | CN201112385Y High power element die set combination structure |
| 09/10/2008 | CN201112384Y Circuit modular structure |
| 09/10/2008 | CN101261987A Electronic-component-mounting board |
| 09/10/2008 | CN101261986A Electronic part encapsulation module, external cover and its making method |
| 09/10/2008 | CN101261985A Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding |
| 09/10/2008 | CN101261984A Structure of semiconductor device package and the method of the same |
| 09/10/2008 | CN101261983A Semiconductor device with image pick-up element |
| 09/10/2008 | CN101261982A LED encapsulation structure and its making method |
| 09/10/2008 | CN101261981A Warm color light source |
| 09/10/2008 | CN101261975A 半导体器件 Semiconductor devices |
| 09/10/2008 | CN101261969A Display apparatus |
| 09/10/2008 | CN101261945A Semiconductor structure manufacture method |
| 09/10/2008 | CN100418215C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/09/2008 | US7423418 Module part |
| 09/09/2008 | US7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/09/2008 | US7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/09/2008 | US7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 09/09/2008 | US7423332 Vertical laminated electrical switch circuit |
| 09/09/2008 | US7422930 Integrated circuit with re-route layer and stacked die assembly |
| 09/09/2008 | US7421781 Method of forming a module component having a plurality of penetration holes |
| 09/09/2008 | CA2349059C Semiconductor device |
| 09/09/2008 | CA2273474C Electronic circuit device and method of fabricating the same |
| 09/04/2008 | WO2008105426A1 Bonding apparatus, and bonding method |
| 09/04/2008 | WO2008105425A1 Bonding apparatus, and bonding method |
| 09/04/2008 | WO2008105169A1 Adhesive film for semiconductor and semiconductor device using the adhesive film |
| 09/04/2008 | WO2007109568A3 Method and structure for fabricating solar cells |
| 09/04/2008 | WO2007087343A3 Solar modules with tracking and concentrating features |