Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2008
10/07/2008US7432599 Memory module having interconnected and stacked integrated circuits
10/07/2008US7432588 Semiconductor device and method of fabricating the same
10/07/2008US7432583 Leadless leadframe package substitute and stack package
10/07/2008US7432575 Two-layer electrical substrate for optical devices
10/07/2008US7432131 Stacked memory and manufacturing method thereof
10/07/2008US7431477 Methods and apparatus for an LED light engine
10/02/2008WO2008117736A1 Interposer substrate, lsi chip and information terminal device using the interposer substrate, interposer substrate manufacturing method, and lsi chip manufacturing method
10/02/2008WO2008091474A3 Stackable leadless electronic package
10/02/2008WO2008045422A3 Edge connect wafer level stacking
10/02/2008US20080241995 Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet
10/02/2008US20080241992 Method of assembling chips
10/02/2008US20080239863 Memory circuit arrangement and method for the production thereof
10/02/2008US20080238582 Flexible Capacitive Coupler Assembly And Method Of Manufacture
10/02/2008US20080237890 Semiconductor Device and Wiring Board
10/02/2008US20080237888 Multichip semiconductor device, chip therefor and method of formation thereof
10/02/2008US20080237591 Vertical system integration
10/02/2008US20080237479 Radiation image detection method and apparatus
10/02/2008DE112006002686T5 Integrierte Mikrokanäle für 3D Through-Silicon-Architekturen Integrated micro-channels for 3D through-silicon architectures
10/02/2008DE102008016960A1 Leistungshalbleitermodul und Leistungshalbleitervorrichtung mit dem darin befestigten Modul The power semiconductor module and power semiconductor device with the module mounted therein
10/02/2008DE102007018837A1 Verfahren zum Herstellen eines Lumineszenzdiodenchips und Lumineszenzdiodenchip A method for producing an LED chip and LED chip
10/02/2008DE102007015474A1 Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Electromagnetic radiation-emitting optoelectronic component and process for producing an optoelectronic component
10/02/2008DE102007015295A1 Temperatursensorstruktur für ein Halbleiterbauelement Temperature sensor structure for a semiconductor device
10/02/2008DE102007014363A1 Halbleitermodul Semiconductor module
10/02/2008DE102007002807A1 Chipanordnung und Verfahren zur Herstellung einer Chipanordnung Chip arrangement and method for producing a chip arrangement
10/01/2008EP1976023A2 Optical semiconductor module and light receiving element
10/01/2008EP1974381A2 Package for a light emitting diode with integrated electrostatic discharge protection
10/01/2008EP1627430B1 An integrated circuit package employing a flexible substrate
10/01/2008EP0881680B1 Semiconductor device
10/01/2008CN201126827Y 发光二极管 Led
10/01/2008CN201126821Y 发光二极管 Led
10/01/2008CN201126820Y Improved transistor stack encapsulation structure
10/01/2008CN201126819Y Novel eight-feed trinity LED
10/01/2008CN101278397A 高亮度发光二级管设备 High-brightness light-emitting diode device
10/01/2008CN101278383A Electronic circuit device and method for manufacturing same
10/01/2008CN101277388A Solid-state imaging device and electronic device including same
10/01/2008CN101276815A Semiconductor device
10/01/2008CN101276809A Semiconductor device and method of manufacturing the same
10/01/2008CN101276808A 半导体发光装置 The semiconductor light emitting device
10/01/2008CN101276807A Semiconductor device and method of manufacturing the same
10/01/2008CN101276806A Bond wireless power module with double-sided single device cooling and immersion bath cooling
10/01/2008CN101276796A Carbon nanotube-reinforced solder caps methods of assembling same and chip packages and systems containing same
10/01/2008CN100423299C Semiconductor device and method of manufacturing the same
10/01/2008CN100423292C Solar cell module-mounting structure and solar cell module array
10/01/2008CN100423262C Light emitting device
10/01/2008CN100423261C Luminous device
10/01/2008CN100423260C Semiconductor device
10/01/2008CN100423259C Stacked electronic part
10/01/2008CN100423258C Semiconductor device and its mfg. method
10/01/2008CN100423257C Lighting stick with LBD wafer
10/01/2008CN100423255C Semiconductor devices with wire bond inductor and method
10/01/2008CN100423252C Low profile integrated module interconnects
10/01/2008CN100423251C Semiconductor device package and lead frame with die overhanging lead frame pad
10/01/2008CN100423241C 电路装置及其制造方法 Circuit device and manufacturing method thereof
09/2008
09/30/2008US7429794 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
09/30/2008US7429781 Memory package
09/30/2008US7429759 Optical semiconductor device with improved illumination efficiency
09/30/2008US7429738 Solid state detector module structure and radiation imaging system
09/30/2008US7429723 Conversion apparatus, radiation detection apparatus, and radiation detection system
09/30/2008US7429371 Stable charge storage device; dispersed oxidized or reduced carbon nanotube in an aqueous solution, associated with a nucleic acid dispersant
09/25/2008WO2008116230A2 Side stacking apparatus and method
09/25/2008WO2008114430A1 Stacked package element, method for forming terminal of stacked package element, stacked package, and method for forming stacked package
09/25/2008WO2008114374A1 Semiconductor device and method of manufacturing same
09/25/2008US20080233677 Semiconductor device and method of manufacturing the same
09/25/2008US20080233676 Integrated circuit device with embedded passive component by flip-chip connection and method for manfacturing the same
09/25/2008US20080232065 Mounting Plate for Electronic Components
09/25/2008US20080231354 Semiconductor Device
09/25/2008US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts
09/25/2008US20080230903 Semiconductor chip, semiconductor device and method for producing the same
09/25/2008US20080230891 Chip and wafer integration process using vertical connections
09/25/2008DE10257184B4 LED-Array und LED-Modul LED array and LED module
09/25/2008DE102008014930A1 Ausgangsschaltung und Leistungsbauteil Output circuit and power device
09/25/2008DE102008013121A1 Elektrische/elektronische Einrichtung zur Erzeugung von Farbdarstellungen Electrical / electronic device for generating color illustrations
09/25/2008DE102008010004A1 Multi-Chip-Packung mit reduzierter Struktur und Verfahren zur Herstellung derselben Multi-die package with reduced structure and method of manufacturing the same
09/25/2008DE102007012154A1 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing
09/25/2008DE102007010876A1 Module for semiconductors, has semiconductor chip which has partly filled recess at main surface, where electrically non-conducting spacer is applied on main surface
09/24/2008CN201122607Y Light emitting diode structure
09/24/2008CN201122600Y Parallel arrangement of IGBT module
09/24/2008CN201122599Y Light emitting diode chip packaging structure with high efficiency illumination effect
09/24/2008CN201122598Y Plate type LED light source chip
09/24/2008CN201122597Y Light emitting diode chip packaging structure with thick guiding pin
09/24/2008CN201122596Y Afterflow diode module of solar cell panel
09/24/2008CN201122595Y LED capable of adjusting color temperature and developing color
09/24/2008CN101273679A Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module
09/24/2008CN101271943A LED module structure and manufacturing method thereof
09/24/2008CN101271938A Multi-wavelength LED element and multi-wavelength luminous module
09/24/2008CN101271915A 发光二极管 Led
09/24/2008CN101271889A LED device
09/24/2008CN101271888A Integrated circuit package and manufacturing method thereof
09/24/2008CN101271887A Semiconductor light emitting device
09/24/2008CN101271886A High-density circuit module
09/24/2008CN101271885A Image sensor encapsulation and image taking device using the same
09/24/2008CN101271884A Luminous source encapsulation body
09/24/2008CN101271883A Production method of circuit substrates and inductor wire
09/24/2008CN101271879A Element-mounting board and semiconductor module
09/24/2008CN101271873A Semiconductor grain and package structure
09/24/2008CN100421266C Light-emitting device having light-emitting elements
09/24/2008CN100421252C Organic electro-luminescence display device and method for fabricating the same
09/24/2008CN100421251C Semiconductor device and its producing method
09/24/2008CN100421250C Three-dimensional semiconductor device provided with interchip interconnection selection means
09/24/2008CN100421249C Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
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