Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2008
10/21/2008US7439622 Semiconductor device
10/21/2008US7439549 LED module
10/21/2008US7439452 Multi-chip module packaging with thermal expansion coefficiencies
10/21/2008US7439099 Thin ball grid array package
10/16/2008WO2008123481A1 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
10/16/2008WO2008123399A1 Three-dimensional structure semiconductor device
10/16/2008WO2008123386A1 Power module and inverter for vehicle
10/16/2008WO2008123172A1 Heat spreader module, heat sink and method for manufacturing the heat spreader module and the heat sink
10/16/2008WO2008076635A3 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate
10/16/2008WO2008008451A3 Injection device and case with reporting ability
10/16/2008WO2007120856A3 Double-sided solar module
10/16/2008US20080254572 Vertical system integration
10/16/2008US20080251941 Vertical system integration
10/16/2008US20080251902 Half-etching a processed sheet; attaching the sheet to a semiconductor device supporting tape; connecting the inner terminals to the semiconductor device with bond wires;sealing the processed sheet and the semiconductor device held between a pair of flat molding plates, removing plates
10/16/2008US20080251895 Apparatus for shielding integrated circuit devices
10/16/2008US20080251721 Thermal infrared solid state imaging device and infrared camera
10/16/2008US20080251496 Optoelectric composite substrate and method of manufacturing the same
10/16/2008DE20321678U1 Stromversorgung für Lumineszenzdioden Power supply for light-emitting diodes
10/16/2008DE10331335B4 Leistungs-Halbleitervorrichtung Power semiconductor device
10/16/2008DE102007019320A1 Integrierte Schaltkreise und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same
10/16/2008DE102007017461A1 Power supply module for electrical device i.e. electrical measuring device, has electronic component provided for stabilization of voltage produced by thermal generator and cooperating with thermal generator
10/16/2008DE102004013056B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
10/15/2008EP1981082A1 Light-emitting device with power supply structure
10/15/2008EP1979956A1 Rare earth doped layer or substrate for light conversion
10/15/2008EP1979945A2 Light emission device with chromatic control
10/15/2008EP1413054B1 Auxiliary circuitry for monolithic microwave integrated circuit
10/15/2008EP1161772B1 Iii-nitride light-emitting device with increased light generating capability
10/15/2008CN201134747Y Module component
10/15/2008CN201134437Y Optoelectronic component
10/15/2008CN201134431Y Series arrangement with quickly replaceable thyristor
10/15/2008CN201134430Y Thyristor valve with force dividing and top pressing mechanism
10/15/2008CN201134429Y LED point array module
10/15/2008CN201134428Y High-power LED encapsulation structure
10/15/2008CN101286508A High-power LED encapsulation structure
10/15/2008CN101286507A Semiconductor apparatus and mobile apparatus
10/15/2008CN101286506A Multi-chip encapsulation structure having single chip support base
10/15/2008CN101286505A Semi-conductor encapsulation structure having an antenna
10/15/2008CN101286504A Light-emitting device with power supply structure
10/15/2008CN101286503A Semiconductor device package having multi-chips with side-by-side configuration and method of the same
10/15/2008CN101286502A Semiconductor encapsulation structure
10/15/2008CN101286501A Electron Image sensor and image pickup device applying image sensor
10/15/2008CN101286500A Semiconductor module and mobile apparatus
10/15/2008CN101286499A Electronic packing structure and method
10/15/2008CN101286492A 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
10/15/2008CN101286484A Semiconductor device and fabrication method
10/15/2008CN101286460A Integrated circuit package system with heat sink spacer structures
10/15/2008CN101286459A Stacktable semiconductor apparatus and manufacturing method
10/15/2008CN100426541C Light-emitting device generating visible light
10/15/2008CN100426540C Optical semiconductor module and semiconductor device including the same
10/15/2008CN100426530C Panel for light receiving or light-emitting and its manufacturing method
10/15/2008CN100426503C Device for producing a bundled light flux
10/15/2008CN100426496C Semiconductor device and method for manufacturing the same
10/15/2008CN100426478C Three-dimensional interconnection interpolator applied in system packaging and its producing method
10/15/2008CN100426050C Bulk lens, light emitting body, lighting device and optical information system
10/14/2008US7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/14/2008US7436070 Semiconductor device
10/14/2008US7436069 Semiconductor device, having a through electrode semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode
10/14/2008US7436061 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
10/14/2008US7435997 Component comprising a large number of light-emitting-diode chips
10/14/2008US7435626 Rearrangement sheet, semiconductor device and method of manufacturing thereof
10/09/2008WO2008120564A1 Mounting structure of electronic component and method for mounting electronic component
10/09/2008WO2008120170A1 Light output device
10/09/2008WO2008119327A1 Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
10/09/2008WO2008014385A3 Power source
10/09/2008WO2007041140A3 Nicam processor
10/09/2008US20080246540 Semiconductor integrated circuit for voltage detection
10/09/2008US20080246510 Repeatable block producing a non-uniform routing architecture in a field programmable gate array having segmented tracks
10/09/2008US20080246040 Light emitting device having light emitting elements
10/09/2008DE102008011810A1 Lichtemittierendes Bauteil und Herstellungsverfahren eines solchen Light-emitting component and manufacturing method of such a
10/09/2008DE102007015473A1 LED-Bauelement LED device
10/08/2008EP1977448A2 Ferrous component
10/08/2008EP1627179B1 Method and apparatus for led panel lamp systems
10/08/2008EP1449263B9 Optoelectronic component
10/08/2008EP1028463B1 Method for manufacturing a module with a flexible package having a very thin semiconductor chip
10/08/2008CN201130926Y Ceramic packing piece for SMD crystal resonator
10/08/2008CN201130664Y Omnidirectional LED
10/08/2008CN101283450A Integrated micro-channels for 3D through silicon architectures
10/08/2008CN101281920A Solid-state image sensing device and electronic apparatus comprising same
10/08/2008CN101281919A MOS type solid-state image pickup device
10/08/2008CN101281904A Power semiconductor module for inverter circuit system
10/08/2008CN101281903A Multiple encapsulation structure
10/08/2008CN101281902A High power LED lighting lamp and radiating module thereof
10/08/2008CN101281901A Multi-chip conformity type image sensing chip module and encapsulating method thereof
10/08/2008CN101281900A Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof
10/08/2008CN101281894A Semiconductor component bearing structure and splicing structure
10/08/2008CN101281875A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281874A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281612A Modularized memory card apparatus capable of dividing memory body magnetic region
10/08/2008CN100424872C Light source structure of luminous diode
10/08/2008CN100424871C Overhang support for a stacked semiconductor device, and method of forming thereof
10/08/2008CN100424870C 半导体模块 Semiconductor Modules
10/08/2008CN100424863C Chip buried base plate encapsulation structure
10/08/2008CN100424859C Electronic device and producing method thereof
10/08/2008CN100424858C Electronic device and producing method thereof
10/08/2008CN100424847C Method for preparing transistor and combined improved structure obtained thereby
10/08/2008CN100424846C Light emitting diode with static damage protective function and its producing method
10/07/2008US7434192 Techniques for optimizing design of a hard intellectual property block for data transmission
10/07/2008US7432775 High speed electronics interconnect having a dielectric system with cylindrical holes therein
10/07/2008US7432734 Versatile logic element and logic array block
10/07/2008US7432600 System having semiconductor component with multiple stacked dice
1 ... 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 ... 409