Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2008
11/05/2008CN201146188Y Side edge type LED structure
11/05/2008CN201146187Y LED device
11/05/2008CN101300913A Spaced, bumped component structure
11/05/2008CN101300911A Circuit module and method for manufacturing circuit module
11/05/2008CN101300589A Chip-spacer integrated radio frequency id tags, methods of making same, and systems containing same
11/05/2008CN101299427A Luminescence module
11/05/2008CN101299426A Module and electronic device
11/05/2008CN100431161C LED module
11/05/2008CN100431159C Image pick equipment and its manufacturing method
11/05/2008CN100431148C Organic luminescent display device and its manufacture
11/05/2008CN100431143C Semiconductor encapsulation structure
11/05/2008CN100431135C Chip of memory, chip-on-chip device of using same and its mfg. method
11/04/2008US7446563 Three dimensional integrated circuits
11/04/2008US7446562 Programmable semiconductor device
11/04/2008US7446347 Optoelectronic component and method for the production thereof, module and device comprising a module of this type
10/2008
10/30/2008WO2008130012A1 Power semiconductor module
10/30/2008WO2008129424A2 Ultra-thin stacked chios packaging
10/30/2008WO2008014248A3 Thin film photovoltaic module wiring for improved efficiency
10/30/2008WO2007118223A3 Solar plant employing cultivation of organisms
10/30/2008WO2007112452A3 Technique for manufacturing photovoltaic modules
10/30/2008US20080265985 A self-metallized polymeric film from single-stage processing of a homogeneous solution of a metal precursor and a poly(amic acid) precursor to form thermally-conductive polymeric film region and a continuous metal surface on polymeric film region; measuring temperature of to small shapes/surfaces
10/30/2008US20080265430 Semiconductor Device an Process for Fabricating the Same
10/30/2008US20080265424 Semiconductor device
10/30/2008DE102007020618B3 Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul A method for producing a solid power module and thus produced transistor module
10/30/2008DE102007019031A1 Optoelectronic device, has optoelectronic module fastened to module carrier e.g. molded interconnect device, and under-filling inserted into region between optoelectronic module and carrier, and forming lens
10/30/2008DE102007017546A1 Multichipmodul Multi-chip module
10/30/2008DE102007016901A1 Semiconductor component i.e. direct current-direct current converter, for use in electronic module, has power semiconductor chips applied on respective carriers that are arranged such that extensions point in different directions
10/30/2008DE102007010755A1 Anordnung mit einem Halbleiterchip und einer Lichtleiterschicht Arrangement with a semiconductor chip and a light guide layer
10/29/2008EP1986239A2 Method for producing a matrix for detecting electromagnetic radiation and, in particular, infrared radiation.
10/29/2008EP1986236A1 Method of manufacturing an optoelectronic module and optoelectronic module obtained by the method
10/29/2008EP1986235A2 Packaging method of LED of high heat-conducting efficiency and structure thereof
10/29/2008EP1986234A2 Power semiconductor module for inverter circuit system
10/29/2008EP1986233A2 On-chip reconfigurable memory
10/29/2008EP1984944A1 Method for making a neo-layer comprising embedded discrete components
10/29/2008EP1984681A1 Electromagnetic radiation collection device
10/29/2008EP1418617B1 Semiconductor device and method of manufacturing the same
10/29/2008CN201142326Y Plastic package type cooling insulation commutation bridge
10/29/2008CN101297606A Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
10/29/2008CN101295854A Optoelectronic element encapsulation structure with temperature compensation
10/29/2008CN101295710A 半导体器件 Semiconductor devices
10/29/2008CN101295709A Stack package with releasing layer and method for forming the same
10/29/2008CN101295708A Stacked semiconductor device assembly and package
10/29/2008CN101295707A Image capturing device
10/29/2008CN101295693A 半导体器件 Semiconductor devices
10/29/2008CN101295651A Semiconductor device and its manufacturing method
10/29/2008CN101295650A Semiconductor device and its manufacturing method
10/29/2008CN101295649A Packaging method for LED with high cooling efficiency and structure thereof
10/29/2008CN101295648A Packaging method for low thermoresistance LED and its structure
10/29/2008CN100429794C Integrated AC type LED lamp filament
10/29/2008CN100429775C Packaging device of ic circuit and its producing method
10/29/2008CN100429774C Semiconductor packaging device and its manufacturing method
10/29/2008CN100429773C Module and mounting structure using the same
10/28/2008US7443956 X-ray transmissive optical mirror apparatus
10/28/2008US7443021 Electronic component packaging structure and method for producing the same
10/28/2008US7442872 Method for regenerating photovoltaic module and photovoltaic module
10/23/2008WO2008127196A1 Composite structure for an electronic circuit
10/23/2008WO2008126447A1 Wiring structure of electronic apparatus and method for manufacturing electronic apparatus package
10/23/2008WO2008019349A3 Thin film solar cell with finger pattern
10/23/2008WO2008018986A3 Apparatus for obtaining radiant energy
10/23/2008US20080261336 Semiconductor device and manufacturing method thereof
10/23/2008US20080259607 LED illumination system
10/23/2008US20080258765 Low-power transceiver architectures for programmable logic integrated circuit devices
10/23/2008US20080258305 Low fabrication cost, fine pitch and high reliability solder bump
10/23/2008US20080258283 Wiring board and semiconductor package using the same
10/23/2008US20080258129 Phase-Change Memory Device
10/23/2008DE10310809B4 Leistungshalbleitereinrichtung Power semiconductor device
10/23/2008DE102008014736A1 Halbleiterbausteinpackung mit Multi-Chips in einer Seite-an-Seite-Anordnung und das dazugehörige Verfahren Semiconductor device package with multiple chips in a side-by-side arrangement and the associated method
10/23/2008DE102007019033A1 Optoelectronic assembly, has carrier i.e. molded interconnect device, with opening i.e. linear hopper, in wall region to ensure coupling between component and fiber, where opening is designed such that size of opening changes between sides
10/23/2008DE102007018914A1 Halbleiterbauelement mit einem Halbleiterchipstapel und Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip stack and processes for preparing
10/23/2008CA2628138A1 Light emitting diode (led) light bulb
10/22/2008EP1983571A2 Light emission device
10/22/2008EP1982355A2 Power electronics assembly
10/22/2008EP1618570B1 Memory-circuit arrangement and method for the production thereof
10/22/2008EP1231639B1 Power module
10/22/2008EP1157420A4 Light extractor apparatus
10/22/2008CN101292367A Photovoltaic cells comprising two photovoltaic cells and two photon sources
10/22/2008CN101292349A Device comprising an element with electrodes coupled to connections
10/22/2008CN101292348A Stackable wafer or die packaging with enhanced thermal and device performance
10/22/2008CN101291042A Encapsulation structure of optoelectronic component
10/22/2008CN101290931A Self-cooled thyristor valve of high power and mounting vehicle
10/22/2008CN101290930A Semiconductor device comprising a semiconductor chip stack and method for producing the same
10/22/2008CN101290929A Stack type chip packaging structure
10/22/2008CN101290928A Light emission device
10/22/2008CN101290927A Circuit arrangement having a free-wheel diode
10/22/2008CN101290926A 半导体装置 Semiconductor device
10/22/2008CN101290925A Single-encapsulated LED and illuminating device
10/22/2008CN101290924A Luminous diode
10/22/2008CN101290920A 半导体装置 Semiconductor device
10/22/2008CN101290919A Memory encapsulation component and module card using the same
10/22/2008CN101290918A Chip packaging structure
10/22/2008CN101290896A Stackable semiconductor device and manufacture thereof
10/22/2008CN100428617C Temperature detection method of semiconductor device and power conversion apparatus
10/22/2008CN100428591C Encapsulation structure and method of the high-speed semiconductor light emission component
10/22/2008CN100428512C Light-emitting diode apparatus
10/22/2008CN100428505C 白色发光装置 White light emitting device
10/22/2008CN100428467C 功率半导体模块 Power semiconductor module
10/22/2008CN100428466C Organic electroluminescence display and method for manufacturing the same
10/22/2008CN100428465C Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
10/22/2008CN100428449C Semiconductor device and method for mfg. same
10/21/2008US7439659 Piezoelectric actuator, droplet ejection apparatus, and manufacturing method thereof
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