| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 11/20/2008 | WO2008060326A3 Deicing of radiation detectors in analytical instruments |
| 11/20/2008 | WO2008040315A3 Light-emitting diode arrangement and method for producing the same |
| 11/20/2008 | WO2007139709A3 Method of making solar cell with antireflective coating using combustion chemical vapor deposition (ccvd) and corresponding product |
| 11/20/2008 | US20080288906 Integrated system on module |
| 11/20/2008 | US20080284611 Vertical system integration |
| 11/20/2008 | US20080284043 Base Semiconductor Component For a Semiconductor Component Stack and Method For the Production Thereof |
| 11/20/2008 | US20080283986 System-in-package type semiconductor device |
| 11/20/2008 | US20080283847 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities |
| 11/20/2008 | US20080283760 Radiation Detector, Radiation Detector Element, And Radiation Imaging Apparatus |
| 11/20/2008 | DE19905220B4 Multichipanordnung Multichip assembly |
| 11/20/2008 | DE102008018930A1 Electronic component for use in imaging system i.e. camera system, for surgical instrument, has integrated circuit fastened to front side of substrate and electrically connected with continuous lines at front side |
| 11/20/2008 | DE102008018221A1 Schutz für Schaltungsplatinen Protection for circuit boards |
| 11/20/2008 | DE102007022959A1 Semiconductor device manufacturing method, involves coating semiconductor chip with casting compound e.g. thermoplastic material, forming through hole in casting compound, and depositing electric conductive materials in through hole |
| 11/20/2008 | DE102007007223B4 Modular aufgebautes Leistungshalbleitermodul Modular power semiconductor module |
| 11/19/2008 | EP1993149A2 LED device and method by which it is produced |
| 11/19/2008 | EP1110242B1 Thermal capacity for electronic component operating in long pulses |
| 11/19/2008 | CN201153128Y Encapsulation construction of LED |
| 11/19/2008 | CN201153121Y Omnidirectional luminous diode construction |
| 11/19/2008 | CN101308842A Stacked package, method of manufacturing the same, and memory card having the stacked package |
| 11/19/2008 | CN101308841A Semiconductor light emitting diode |
| 11/19/2008 | CN101308840A Multi-wafer 3d cam cell and manufacture process |
| 11/19/2008 | CN101308839A Compact multi-port cam cell implemented in 3d vertical integration |
| 11/19/2008 | CN101308838A Flip LED integrated chip with high break-over voltage |
| 11/19/2008 | CN101308837A Light source in warm color |
| 11/19/2008 | CN101308836A Light emitting diode, light emitting diode component and llight emitting diode lamp string |
| 11/19/2008 | CN101308804A Encapsulation construction of radio frequency module and manufacturing method thereof |
| 11/19/2008 | CN101308803A 半导体器件 Semiconductor devices |
| 11/19/2008 | CN100435604C Composite multi-layer substrate and module using the substrate |
| 11/19/2008 | CN100435365C Light-emitting diode, backlight device and method of manufacturing the light-emitting diode |
| 11/19/2008 | CN100435363C Lens-attached light-emitting element |
| 11/19/2008 | CN100435361C Semiconductor luminous element packing structure |
| 11/19/2008 | CN100435336C Semiconductor light emitting device, backlight device for liquid crystal display |
| 11/19/2008 | CN100435335C Method for manufacturing semiconductor device and semiconductor device |
| 11/19/2008 | CN100435334C Semiconductor device and its mfg. method |
| 11/19/2008 | CN100435333C 电力半导体装置 Power semiconductor devices |
| 11/19/2008 | CN100435331C Method for producing microsystems |
| 11/18/2008 | US7453189 Piezoelectric transformer |
| 11/18/2008 | US7453159 Semiconductor chip having bond pads |
| 11/18/2008 | US7453157 Microelectronic packages and methods therefor |
| 11/18/2008 | US7453147 Semiconductor device, its manufacturing method, and radio communication device |
| 11/18/2008 | US7453146 High power MCM package with improved planarity and heat dissipation |
| 11/18/2008 | US7453143 High speed electronics interconnect and method of manufacture |
| 11/18/2008 | US7453138 Electronic circuit device and manufacturing method thereof |
| 11/18/2008 | US7452751 Semiconductor device and method of manufacturing the same |
| 11/18/2008 | US7452736 Surface emitting device, manufacturing method thereof and projection display device using the same |
| 11/13/2008 | WO2008138015A2 Light-emitting diode assembly without solder |
| 11/13/2008 | WO2008136352A1 Method for bonding semiconductor wafers and method for manufacturing semiconductor device |
| 11/13/2008 | WO2008135142A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 11/13/2008 | WO2008016453A3 Method and apparatus for arranging a solar cell and reflector |
| 11/13/2008 | US20080282214 Reconfigurable integrated circuit |
| 11/13/2008 | US20080280803 Aqueous solution of sulfuric acid, hydrogen peroxide, H2SiF6, HBF4; clean residual polymers from aluminium or aluminium-containing surfaces, during the production of semiconductor elements |
| 11/13/2008 | US20080280395 Semiconducting device with stacked dice |
| 11/13/2008 | US20080278061 Light Emitting Diode Module |
| 11/13/2008 | US20080277674 Semiconductor Light Emitting Device, Lighting Module, Lighting Apparatus, and Manufacturing Method of Semiconductor Light Emitting Device |
| 11/13/2008 | US20080276988 Method for regenerating photovoltaic module and photovoltaic module |
| 11/13/2008 | DE102007021073A1 Circuit configuration has two construction elements with contact surface in each element and contact surfaces is roughened and construction element is galvanically or mechanically connected |
| 11/13/2008 | DE102007007142B4 Nutzen, Halbleiterbauteil sowie Verfahren zu deren Herstellung Use semiconductor device, and methods for their preparation |
| 11/12/2008 | EP1989441A1 Apparatus for suppling power to buildings using solar power as a power source |
| 11/12/2008 | EP1644996A4 A two stage energy storage device |
| 11/12/2008 | EP1402575B1 Vertically contacted stacked chips |
| 11/12/2008 | CN201149869Y LED encapsulation structure |
| 11/12/2008 | CN101305464A Chip assembly and method of manufacturing thereof |
| 11/12/2008 | CN101305463A Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same |
| 11/12/2008 | CN101304022A 多芯片电子系统 Multi-chip electronic system |
| 11/12/2008 | CN101304021A LED encapsulation structure as well as backlight module and LCD device applying the same |
| 11/12/2008 | CN101304015A Semiconductor device and manufacturing method thereof |
| 11/12/2008 | CN101304011A Power semiconductor device and manufacturing method thereof, electronic apparatus and lead frame component |
| 11/12/2008 | CN101303984A Method of manufacturing semiconductor device |
| 11/12/2008 | CN101303982A Method for making component of surface adhesion type diode support and structure thereof |
| 11/12/2008 | CN100433389C Light emitting device including RGB light emitting diodes and phosphor |
| 11/12/2008 | CN100433380C White light emitting device with light-emitting diode and application thereof |
| 11/12/2008 | CN100433328C Infrared focal plane detector with antireflective convergence microlens and microlens preparing method |
| 11/12/2008 | CN100433327C Chip packaging body and stack chip packaging structure |
| 11/12/2008 | CN100433326C Slave device, master device and stacked device |
| 11/12/2008 | CN100433324C Semiconductor device |
| 11/12/2008 | CN100433323C Electronic member |
| 11/12/2008 | CN100433282C Power type light-emitting diode device and its manufacturing method |
| 11/12/2008 | CN100433279C Manufacturing method of a semiconductor device |
| 11/12/2008 | CN100433277C Method for producing semiconductor device |
| 11/12/2008 | CN100432641C Optical sensor |
| 11/11/2008 | US7449943 Matching for time multiplexed resistors |
| 11/11/2008 | US7449777 Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies |
| 11/11/2008 | US7449774 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
| 11/11/2008 | US7449067 Method and apparatus for filling vias |
| 11/06/2008 | WO2008131939A1 Led module with silicon platform |
| 11/06/2008 | WO2008131825A1 X-ray apparatus and detection unit for an x-ray apparatus |
| 11/06/2008 | WO2008131713A2 Apparatus for the production of a rigid power module |
| 11/06/2008 | WO2008057680A3 Display system |
| 11/06/2008 | US20080274588 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
| 11/06/2008 | US20080274571 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 11/06/2008 | US20080274035 Stable charge storage device; oxidation and reduction using catalyst in solution |
| 11/06/2008 | DE102007024159B3 Leistungshalbleitermodul The power semiconductor module |
| 11/06/2008 | DE102007014789B3 Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul Arranging at least one power semiconductor module and a printed circuit board and the power semiconductor module |
| 11/05/2008 | EP1988577A1 LED module with silicon platform |
| 11/05/2008 | EP1988575A2 Semiconductor device |
| 11/05/2008 | EP1988574A1 Semiconductor device |
| 11/05/2008 | EP1988572A1 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips |
| 11/05/2008 | EP1357597B1 Voltage converter module |
| 11/05/2008 | CN201146190Y Lead frame |
| 11/05/2008 | CN201146189Y Side edge type LED structure |