Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2008
12/03/2008CN101315963A 半导体发光装置 The semiconductor light emitting device
12/03/2008CN101315927A High power LED phase transition heat sink structure
12/03/2008CN101315926A Semiconductor device and method of manufacturing the same
12/03/2008CN101315925A Electronic component-containing module and manufacturing method thereof
12/03/2008CN101315924A Semiconductor package body
12/03/2008CN101315923A Chip stack package structure
12/03/2008CN101315922A Semiconductor packaging stack device for preventing semiconductor stack from micro-contact soldering point rupture
12/03/2008CN101315921A Chip stack packaging structure and method of producing the same
12/03/2008CN101315920A Chip stack packaging structure and method of producing the same
12/03/2008CN101315918A Semiconductor device and method of manufacturing the same
12/03/2008CN101315900A Packaging method for LED with high cooling efficiency and packaging structure thereof
12/03/2008CN101315898A Maintaining assemblage method and structure of contact type image sensor
12/03/2008CN101314909A Washing machine with energy resource system itself
12/03/2008CN100440714C Power inverter
12/03/2008CN100440570C Luminescence unit, luminescence device with luminescence unit, and method for manufacturing luminescence cell
12/03/2008CN100440555C Light-emitting device and method for manufacturing same
12/03/2008CN100440509C Circuit device and method for manufacturing same
12/03/2008CN100440508C Apparatus for producing a beam of light having a controlled luminous flux spectrum
12/03/2008CN100440507C Carrying structure for electron element
12/03/2008CN100440488C Intermediate chip module,semiconductor element, circuit substrate and electronic equipment
12/03/2008CN100440467C Semiconductor chip and manufacturing method for the same, and semiconductor device
12/03/2008CN100440464C Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
12/02/2008US7460851 Method and apparatus for integrating a surface acoustic wave filter and a transceiver
12/02/2008US7460385 Memory circuit arrangement with a cell array substrate and a logic circuit substrate and method for the production thereof
12/02/2008US7460373 Heat radiation device for memory module
12/02/2008US7459965 Semiconductor integrated circuit
12/02/2008US7459797 Standoffs for centralizing internals in packaging process
12/02/2008US7459781 Fan out type wafer level package structure and method of the same
12/02/2008US7459776 Stacked die assembly having semiconductor die projecting beyond support
12/02/2008US7459773 Stackable ball grid array
12/02/2008US7459684 Long-wavelength infra-red night vision goggles
12/02/2008US7459393 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
12/02/2008US7459341 Method of manufacturing an electronic device
12/02/2008US7459065 Hydrogen generator photovoltaic electrolysis reactor system
11/2008
11/27/2008WO2008143359A1 Electronic circuit device
11/27/2008WO2008142887A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142886A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142885A1 Semiconductor module and inverter apparatus
11/27/2008WO2008142764A1 Stacked package and method of forming stacked package
11/27/2008WO2008142763A1 Stacked package and method of forming stacked package
11/27/2008WO2008142760A1 Semiconductor module for electric power
11/27/2008WO2008142759A1 Arc discharge device
11/27/2008WO2008142758A1 Power semiconductor module
11/27/2008WO2008141500A1 A circuit board for heat dispersion
11/27/2008WO2007024483A8 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
11/27/2008US20080290820 Light emitting device and fabrication method thereof and light emitting system using the same
11/27/2008US20080290493 Stacked chip semiconductor device
11/27/2008US20080290488 semiconductor device and a method of manufacturing the same
11/27/2008US20080290354 Light Emitting Diode Assembly
11/27/2008DE10303969B4 Leuchtdiodenanordnung mit einem Leuchtdiodenträger und einer Mehrzahl von Leuchtdioden Light emitting diode device having a light emitting diode support and a plurality of light emitting diodes
11/27/2008DE102008020469A1 Stapelpackung mit Freigabeschicht und Verfahren zum Bilden derselben Stackable pack release layer and method of forming same
11/27/2008DE102007023651A1 Beleuchtungseinrichtung, Hinterleuchtungsvorrichtung und Anzeigevorrichtung Illumination device, backlighting and display device
11/26/2008EP1995780A1 Semiconductor light emitting apparatus
11/26/2008EP1995779A2 Power semiconductor module
11/26/2008EP1995778A2 Method for stacking integrated circuits and resultant device
11/26/2008EP1995439A2 Engine control unit
11/26/2008EP1994570A1 Light-emitting diode module
11/26/2008EP1994560A1 Lighting device, image pickup apparatus and portable terminal unit
11/26/2008EP1993962A1 Solar cell using low iron transmission glass and corresponding method
11/26/2008EP1993961A1 Low iron high transmission float glass for solar cell applications and method of making same
11/26/2008CN201156543Y Encapsulation construction of LED display unit
11/26/2008CN201156542Y Encapsulation construction of LED
11/26/2008CN101313405A Light emitting diode construction
11/26/2008CN101313404A Apparatus and methods for solar energy conversion using nanoscale cometal structures
11/26/2008CN101313402A Double-faced electrode package, and its manufacturing method
11/26/2008CN101312185A Light emitting device and method for manufacturing the same
11/26/2008CN101312184A An integrated light emitting diode die/lens structure, and process for the preparation thereof
11/26/2008CN101312183A Semiconductor device
11/26/2008CN101312182A Image sensory element packaging structure image-forming module group applying same
11/26/2008CN101312175A Semiconductor memory device, memory support and memory module
11/26/2008CN101312174A Line component
11/26/2008CN101312172A Semiconductor package with reinforced joint reliability and its manufacture method
11/26/2008CN101312162A Method for manufacturing semiconductor device
11/26/2008CN101312133A Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure
11/26/2008CN101312132A Multi- chip semiconductor device possessing leads and its manufacture method
11/26/2008CN100438719C Hybrid integrated circuit device and method of manufacturing the same
11/26/2008CN100438095C Light emitting diode with quasi-omnibearing reflector
11/26/2008CN100438089C Light semiconductor device and optical signal input and output device
11/26/2008CN100438027C Optical interconnecting integrated circuit, method for producing optical interconnecting integrated circuit, photoelectrical apparatus and electronic instrument
11/26/2008CN100438026C White light light-emitting diode and producing method thereof
11/26/2008CN100438025C Stacked chip semiconductor device and method for manufacturing the same
11/26/2008CN100438024C 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
11/26/2008CN100438023C Imaging module and method for forming the same
11/26/2008CN100438022C Semiconductor device and its making method, circuit substrate and electronic machine
11/26/2008CN100438021C External pin lens semiconductor packaging structure and its manufacturing method
11/26/2008CN100438001C Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ
11/26/2008CN100437968C High temperature electrostatic chuck
11/26/2008CN100437418C Providing in package power supplies for integrated circuits
11/25/2008US7457490 Micro-optics on optoelectronics
11/25/2008US7456701 Flexible substrate and electronic equipment
11/25/2008US7456531 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
11/25/2008US7456500 Light source module and method for production thereof
11/25/2008US7456495 Semiconductor module with a semiconductor stack, and methods for its production
11/25/2008US7456048 Semiconducting device with folded interposer
11/25/2008US7456047 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
11/25/2008US7456035 Flip chip light emitting diode devices having thinned or removed substrates
11/25/2008US7455441 Linear light source, method for manufacturing the same and surface emitting device
11/25/2008CA2483645C Light-receiving or light-emitting device and its production method
11/20/2008WO2008139605A1 Stacked package and method of forming stacked package
11/20/2008WO2008116230A3 Side stacking apparatus and method
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