Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2008
12/18/2008WO2008112643A3 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
12/18/2008WO2008083672A3 Housing for an optoelectronic component and arrangement of an optoelectronic component in a housing
12/18/2008WO2008014248B1 Thin film photovoltaic module wiring for improved efficiency
12/18/2008WO2007149495A3 Program binding system, method and software for a resilient integrated circuit architecture
12/18/2008US20080311737 Manufacturing method for semiconductor device containing stacked semiconductor chips
12/18/2008US20080311702 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
12/18/2008US20080311685 Methods relating to the reconstruction of semiconductor wafers for wafer level processing
12/18/2008US20080309913 Systems and methods for laser radar imaging for the blind and visually impaired
12/18/2008US20080308141 Photovoltaic power converter system with a controller configured to actively compensate load harmonics
12/18/2008DE102008027999A1 Halbleitersensor Semiconductor sensor
12/18/2008DE102007031877A1 Integrierter Schaltkreis mit einer Finnenstruktur Integrated circuit with a fin structure
12/18/2008DE102006009978B4 Leistungshalbleitermodul The power semiconductor module
12/18/2008DE102004020038B4 Speichermodul und Speichersystem Memory module and the memory system
12/17/2008EP2003693A2 Pressure contact three-phase converter module
12/17/2008EP2002484A2 Method and structure for fabricating solar cells using a layer transfer process
12/17/2008EP2002472A2 Technique for manufacturing photovoltaic modules
12/17/2008CN201167093Y Side-glance type LED structure
12/17/2008CN201167092Y LED packaging structure
12/17/2008CN201166324Y Encapsulated circuit using LED chip light fitting
12/17/2008CN101325233A Encapsulation structure and light source of luminous element
12/17/2008CN101325232A Combined LED device
12/17/2008CN101325197A High voltage and high power boost conveter with co-packaged schottky diode
12/17/2008CN101325196A Boost converter with integrated high power discrete fet and low voltage controller
12/17/2008CN101325195A Semiconductor light emitting apparatus
12/17/2008CN101325194A Stacking encapsulation structure with symmetric multi-chip migration up and down
12/17/2008CN101325193A Encapsulation body of LED
12/17/2008CN101324306A Light-emitting diode arrays and methods of manufacture
12/17/2008CN101324305A Light-emitting diode arrays and methods of manufacture
12/17/2008CN100444415C Air tight high-heat conducting chip packaging assembly
12/17/2008CN100444381C Backward integrated micro-lens infrared focal plane detector and micro-lens producing method
12/17/2008CN100444380C Stacked semiconductor device
12/17/2008CN100444379C Stacked semiconductor device and semiconductor chip control method
12/16/2008US7466029 Chip on chip device including basic chips capable of functioning independently from each other, and a system in package device including the chip on chip device
12/16/2008US7466020 Power module
12/16/2008US7466000 Semiconductor device having multiple substrates
12/16/2008US7465974 Integrated circuit device and method for forming the same
12/16/2008US7465872 Photovoltaic power converter system with a controller configured to actively compensate load harmonics
12/16/2008US7465608 Three-dimensional multichip module
12/11/2008WO2008150344A1 Array of small contacts for solar cell fabrication
12/11/2008WO2008149508A1 Semiconductor module and portable devices
12/11/2008WO2008149268A1 Light output device
12/11/2008WO2008148847A1 3d integration of vertical components in reconstituted substrates
12/11/2008WO2008116335A3 Method of producing a wafer scale package
12/11/2008WO2008024722A3 Solar charged mobile working stations
12/11/2008WO2007112452B1 Technique for manufacturing photovoltaic modules
12/11/2008US20080303175 Electronic circuit package
12/11/2008US20080302559 Flexible and elastic dielectric integrated circuit
12/11/2008US20080302410 Solar cell module connector and method of producing solar cell module panel
12/11/2008US20080301890 Electric Toothbrush Comprising An Electrically Powered Element
12/11/2008DE202004021550U1 Beleuchtungseinrichtung Lighting device
12/11/2008DE112006002962T5 Chip-Abstandhalter, der in Radiofrequenz ID Tags integriert ist, Verfahren zu deren Herstellung und Systeme, die diese beinhalten Chip spacer that is integrated into a radio frequency ID tags, to processes for their preparation and to systems containing these
12/11/2008DE102008021572A1 Multichip LED Leuchten Multichip LED lights
12/10/2008EP2001050A2 Method for manufacturing substrate having electric component
12/10/2008EP2001048A1 Liquid Cooled Power Electronic Circuit Comprising Stacked Direct Die Cooled Packages
12/10/2008EP1553638B1 Light receiving or light emitting device and its production method
12/10/2008EP1356521B1 Power transistor with internally combined low-pass and band-pass matching stages
12/10/2008EP1234331B1 Planar hybrid diode rectifier bridge
12/10/2008CN201163632Y High power LED device
12/10/2008CN201163628Y Improved LED light source packaging structure
12/10/2008CN201163627Y Forced heat radiating device for semiconductor lighting device
12/10/2008CN201163601Y Relay with combined semiconductor luminous tube
12/10/2008CN101322246A 层叠式微电子封装 Stacked microelectronic packaging
12/10/2008CN101322231A High density three dimensional semiconductor die package
12/10/2008CN101320938A Multi-use power module
12/10/2008CN101320774A Light emitting diode with good light radiation and color development
12/10/2008CN101320727A Light emitting device and camera-equipped cellular phone incorporating the same
12/10/2008CN101320718A Memory devices including separating insulating structures on wires and methods of forming
12/10/2008CN101320699A LED packaging method and packaged LED
12/10/2008CN101320696A Stack type packaging structure and its manufacturing method
12/10/2008CN100442554C LED and production thereof
12/10/2008CN100442516C Semiconductor integrated circuit device and electronic card using it
12/10/2008CN100442514C Semiconductor integrated circuit device and electronic card using it
12/10/2008CN100442513C Semiconductor integrated circuit device and electronic card using it
12/10/2008CN100442504C Multi-chip module semiconductor devices
12/10/2008CN100442503C Semiconductor integrated circuit device
12/10/2008CN100442502C Semiconductor, electronic device and their producing method and electronic instrument
12/10/2008CN100442497C Semiconductor device having layered chips
12/10/2008CN100442493C Contact unit for high power semiconductor module an round disk
12/10/2008CN100442480C Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer
12/10/2008CN100442465C Producing process for chip packaging body without kernel dielectric layer
12/10/2008CN100441939C LED bulb for common lighting
12/09/2008US7463062 Structured integrated circuit device
12/09/2008US7462935 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
12/09/2008US7462879 Display device and display unit using the same
12/09/2008US7462870 Molded package and semiconductor device using molded package
12/09/2008US7462510 Standoffs for centralizing internals in packaging process
12/04/2008WO2008147928A1 Vlsi layouts of fully connected generalized networks
12/04/2008WO2008146426A1 Semiconductor device
12/04/2008WO2008146211A1 A tillable sensor device
12/04/2008WO2008043352A3 Optoelectronic module, and method for the production thereof
12/04/2008WO2008014492A3 Individually encapsulated solar cells and/or solar cell strings
12/04/2008US20080297192 Techniques for optimizing design of a hard intellectual property block for data transmission
12/04/2008US20080296761 Cylindrical Bonding Structure and method of manufacture
12/04/2008US20080295326 Manufacture of a Layer Including a Component
12/04/2008DE10353139B4 Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung A stackable modular housing system and a method for its preparation
12/03/2008EP1998380A2 Semiconductor light-emitting device
12/03/2008EP1997138A2 Methods and materials useful for chip stacking, chip and wafer bonding
12/03/2008EP1997124A2 Method and structure for fabricating solar cells
12/03/2008CN201160073Y Chip die set and electric connector assemblage using the same
12/03/2008CN101316485A Electronic component module and method of manufacturing the same
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