| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 12/31/2008 | WO2009002998A1 An interconnect implementing internal controls |
| 12/31/2008 | WO2009001554A1 Circuit device |
| 12/31/2008 | WO2009001492A1 Adhesive film and semiconductor device obtained with the same |
| 12/31/2008 | WO2009000105A1 A light-emitting diode lighting device |
| 12/31/2008 | WO2009000104A1 The package structure of led |
| 12/31/2008 | WO2008135142A3 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 12/31/2008 | WO2008117213A3 An assembly of at least two printed circuit boards and a method of assembling at least two printed circuit boards |
| 12/31/2008 | WO2007120175A9 Apparatus and methods for solar energy conversion using nanoscale cometal structures |
| 12/31/2008 | EP2009965A1 Supporting substrate for electronic components |
| 12/31/2008 | EP2009693A1 Method of fabricating a secured electronic system, corresponding device for securing an integrated circuit, and corresponding electronic system |
| 12/31/2008 | EP2009692A1 Electronic module and fabrication method thereof |
| 12/31/2008 | EP2009676A2 A Semiconductor Materials Inspection System |
| 12/31/2008 | EP2009344A1 Plane illumination device, manufacturing method for a plane illumination device |
| 12/31/2008 | EP2008316A2 Multi-element led lamp package |
| 12/31/2008 | EP2008306A1 Light emitting diode module |
| 12/31/2008 | EP2008305A2 Electronic component module |
| 12/31/2008 | EP2008303A1 Elastically deformable integrated-circuit device |
| 12/31/2008 | EP2008018A2 Lighting device and lighting method |
| 12/31/2008 | CN201174383Y Combined semiconductor luminous tube |
| 12/31/2008 | CN101336477A Chip stage integrated radio frequency passive device, manufacturing method thereof and system comprising the same |
| 12/31/2008 | CN101336476A One piece, collapsible pv assembly |
| 12/31/2008 | CN101335323A Transparent substrate heat dissipater |
| 12/31/2008 | CN101335267A Image sensing module having crystal three-dimensional stacking construction |
| 12/31/2008 | CN101335266A Light emitting panel, display device and light source device |
| 12/31/2008 | CN101335265A Semiconductor device package having pseudo chips |
| 12/31/2008 | CN101335264A Chip stacked structure and method of fabricating the same |
| 12/31/2008 | CN101335263A Semiconductor module and manufacturing method thereof |
| 12/31/2008 | CN101335262A Stack package and method for manufacturing the same |
| 12/31/2008 | CN101335261A Formation of through via before contact processing |
| 12/31/2008 | CN101334679A Temperature sensing device for powered electronic apparatus |
| 12/31/2008 | CN100448005C Photoelectric integrative infrared receiver and packaging method |
| 12/31/2008 | CN100448004C Day-light diode light-source and making method for fluorescent powder |
| 12/31/2008 | CN100448003C 半导体器件 Semiconductor devices |
| 12/31/2008 | CN100448002C Method for producing stacked wafer |
| 12/31/2008 | CN100448001C Semiconductor apparatus having stacked semiconductor components |
| 12/31/2008 | CN100447995C Semiconductor device and manufacturing method therefor |
| 12/31/2008 | CN100447993C Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
| 12/31/2008 | CN100447480C LED illuminator having high power and high radiation efficiency |
| 12/30/2008 | US7470998 Semiconductor device and method of manufacturing the same |
| 12/30/2008 | US7470977 Modular board device, high frequency module, and method of manufacturing same |
| 12/30/2008 | US7470903 Digital imaging assembly & methods thereof |
| 12/30/2008 | US7469812 Wire bonding apparatus |
| 12/25/2008 | US20080315978 Method and apparatus for non-conductively interconnecting integrated circuits |
| 12/25/2008 | US20080315435 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 12/25/2008 | US20080315432 Electrical Shielding in Stacked Dies by Using Conductive Die Dttach Adhesive |
| 12/25/2008 | US20080315346 Passivation of Deep Isolating Separating Trenches with Sunk Covering Layers |
| 12/25/2008 | US20080315215 Semiconductor Module |
| 12/24/2008 | WO2008156093A1 Method of forming film, heat transfer member, power module, inverter for vehicle and vehicle |
| 12/24/2008 | WO2008155368A1 Method and device for improving optical led performance |
| 12/24/2008 | WO2008155233A1 Method of producing a via in a reconstituted substrate |
| 12/24/2008 | WO2008155231A1 Device including integrated components imbedded in cavities of a reception semi-conductor plate and corresponding method |
| 12/24/2008 | WO2008124160A3 Low resistance tunnel junctions for high efficiency tandem solar cells |
| 12/24/2008 | WO2008108970A3 Chips having rear contacts connected by through vias to front contacts |
| 12/24/2008 | EP2006910A2 Power electronics module |
| 12/24/2008 | EP2006895A1 Electronic component module |
| 12/24/2008 | DE112007000378T5 Halbleitermodul und Hybridfahrzeugantriebsvorrichtung, die dieses umfasst Semiconductor module and hybrid vehicle propulsion apparatus which includes this |
| 12/24/2008 | DE102008013180A1 Struktur einer Halbleiterbausteinpackung und deren Verfahren Structure of a semiconductor device package and its method |
| 12/24/2008 | DE102007027447B3 Schaltungsanordnung und integrierte Schaltung Circuitry and integrated circuit |
| 12/24/2008 | DE102005053398B4 Leistungshalbleitermodul The power semiconductor module |
| 12/24/2008 | DE102005046404B4 Verfahren zur Minderung von Streuungen in der Durchbiegung von gewalzten Bodenplatten und Leistungshalbleitermodul mit einer nach diesem Verfahren hergestellten Bodenplatte A method for reducing variations in the deflection of the rolled plates, and bottom power semiconductor module with a base plate prepared by this method |
| 12/24/2008 | DE102004011719B4 Halbleitervorrichtung Semiconductor device |
| 12/24/2008 | CN201171050Y Improved structure of microcircuit module |
| 12/24/2008 | CN201171049Y Luminous semiconductor component |
| 12/24/2008 | CN101331619A Collimation arrangement and illumination system and display device using the same |
| 12/24/2008 | CN101331607A Illumination device, illumination control apparatus, illumination system |
| 12/24/2008 | CN101331605A Module having built-in electronic parts and manufacture method thereof |
| 12/24/2008 | CN101330081A LED array module and packaging method thereof |
| 12/24/2008 | CN101330080A High on-stage voltage right-handed LED integrated chip and manufacturing method thereof |
| 12/24/2008 | CN101330079A Semiconductor subassemblies with interconnects and methods for manufacturing the same |
| 12/24/2008 | CN101330078A High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof |
| 12/24/2008 | CN101330077A Stacked semiconductor package and method for manufacturing the same |
| 12/24/2008 | CN101330076A Through silicon via chip stack package capable of facilitating chip selection during device operation |
| 12/24/2008 | CN101330075A Stereo encapsulation structure |
| 12/24/2008 | CN101330068A Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
| 12/24/2008 | CN101330067A Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof |
| 12/24/2008 | CN100446288C Semiconductor chip or device with vertical structure through-hole |
| 12/24/2008 | CN100446282C LED light source product |
| 12/24/2008 | CN100446248C Process for producing microelectromechanical components |
| 12/24/2008 | CN100446247C Lighting source unit, illuminating apparatus using the same and display apparatus using the same |
| 12/24/2008 | CN100446246C Semiconductor device and method for producing the same |
| 12/24/2008 | CN100446245C Stacked dram memory chip for a dual inline memory module (dimm) |
| 12/24/2008 | CN100446244C Semiconductor chip mounting body and manufacturing method thereof |
| 12/24/2008 | CN100446243C Design of an insulated cavity |
| 12/24/2008 | CN100446242C Lsi package with interface module, transmission line package, and ribbon optical transmission line |
| 12/24/2008 | CN100446241C Semiconductor device capable of holding large size chip and producing method and relative carrier thereof |
| 12/23/2008 | US7468614 Configurable integrated circuit with offset connections |
| 12/23/2008 | US7468551 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 12/23/2008 | US7468485 Back side contact solar cell with doped polysilicon regions |
| 12/23/2008 | US7468316 Low fabrication cost, fine pitch and high reliability solder bump |
| 12/23/2008 | US7468294 Semiconductor device and a method of manufacturing the same |
| 12/23/2008 | US7467897 Light transmitting modules with optical power monitoring |
| 12/23/2008 | US7467464 Method of manufacturing a memory card |
| 12/18/2008 | WO2008154265A1 Insulated gate bipolar transistor assembly |
| 12/18/2008 | WO2008154255A2 Electrically interconnected stacked die assemblies |
| 12/18/2008 | WO2008153245A2 Semiconductor package module using anodized oxide layer and manufacturing method thereof |
| 12/18/2008 | WO2008153206A1 Power module |
| 12/18/2008 | WO2008153172A1 Structure for cooling semiconductor element |
| 12/18/2008 | WO2008152774A1 Memory card and method for manufacturing the same |
| 12/18/2008 | WO2008152730A1 Laminated package and method for forming the same |
| 12/18/2008 | WO2008129424A3 Ultra-thin stacked chios packaging |