| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/20/2009 | US7479694 Membrane 3D IC fabrication |
| 01/20/2009 | US7479413 Method for fabricating semiconductor package with circuit side polymer layer |
| 01/20/2009 | US7479408 Stack package made of chip scale packages |
| 01/20/2009 | US7479407 Digital and RF system and method therefor |
| 01/15/2009 | WO2009009588A1 Interconnects for packaged semiconductor devices and methods for manufacturing such devices |
| 01/15/2009 | WO2009009436A2 Packaged semiconductor assemblies and methods for manufacturing such assemblies |
| 01/15/2009 | WO2007124462A3 Solar collector arrangement with reflecting surface |
| 01/15/2009 | US20090015322 Integrated circuit with multiple layers of circuits |
| 01/15/2009 | US20090015185 Semiconductor Module, and Hybrid Vehicle Drive Device Including the Same |
| 01/15/2009 | DE102008031096A1 Befestigungselement für ein Halbleiter-Sensorbauelement Fastening element for a semiconductor sensor device |
| 01/15/2009 | DE102007031490A1 Halbleitermodul Semiconductor module |
| 01/15/2009 | DE10147376B4 Elektronisches Bauteil und Systemträger sowie Verfahren zur Herstellung derselben Electronic component and system carrier, as well as methods for making same |
| 01/15/2009 | DE10006164B4 Anzeigevorrichtung Display device |
| 01/14/2009 | EP2015392A1 High-frequency semiconductor device |
| 01/14/2009 | EP2015361A2 Semi conductor device |
| 01/14/2009 | EP1610132B1 Fabricating interconnects using sacrificial substrates |
| 01/14/2009 | EP1327226B1 Module having a lead frame equipped with components on both sides |
| 01/14/2009 | EP1275153B1 Carrier substrate for electronic components |
| 01/14/2009 | CN201181705Y Multi-chip packaging structure |
| 01/14/2009 | CN201181704Y LED packaging structure and distant range irradiation structure including the same |
| 01/14/2009 | CN201181703Y Led发光面板 Led light-emitting panel |
| 01/14/2009 | CN201181702Y Thin soldering type commutation bridge stack |
| 01/14/2009 | CN201181701Y Axial multi-grain flexible-welded transient voltage eliminator |
| 01/14/2009 | CN101345239A Electronic device |
| 01/14/2009 | CN101345238A Packaging of semiconductor devices for increased reliability |
| 01/14/2009 | CN101345237A Embedded tenon type packaging structure and manufacturing method thereof |
| 01/14/2009 | CN101345236A Evenly illuminated white light LED module group packaging optical scheme |
| 01/14/2009 | CN101345235A LED chip with electrostatic protection function and production method thereof |
| 01/14/2009 | CN101345234A Electronic module and fabrication method thereof |
| 01/14/2009 | CN101345231A Semiconductor chip, method of fabricating the same and stack package having the same |
| 01/14/2009 | CN101345223A Semiconductor devices, semiconductor modules and methods for cooling semiconductor devices |
| 01/14/2009 | CN100452452C Light emitting device with LED flipped side-structure |
| 01/14/2009 | CN100452450C Optical surface mount technology package |
| 01/14/2009 | CN100452401C Semiconductor memory device and package thereof, and memory card using the same |
| 01/14/2009 | CN100452396C Semiconductor device and manufacturing method therefor |
| 01/14/2009 | CN100452395C Housing device and contact element used therein |
| 01/14/2009 | CN100452394C Piled double-face electrode package and multi-chip assembly |
| 01/14/2009 | CN100452393C 存储器模块 Memory Modules |
| 01/14/2009 | CN100452382C Wiring board, semiconductor device, and method of manufacturing the same |
| 01/14/2009 | CN100452373C Connecting structure of integrated circuit and its production |
| 01/14/2009 | CN100452372C Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 01/14/2009 | CN100452342C Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 01/14/2009 | CN100452336C Method for manufacturing optocoupler |
| 01/14/2009 | CN100450432C Soft physiological signal monitoring device |
| 01/13/2009 | US7477074 Multiple data rate interface architecture |
| 01/13/2009 | US7477072 Circuit for and method of enabling partial reconfiguration of a device having programmable logic |
| 01/13/2009 | US7476981 Electronic module with layer of adhesive and process for producing it |
| 01/13/2009 | US7476972 Circuit device, manufacturing method thereof, and sheet-like board member |
| 01/13/2009 | US7476595 Method for the molecular bonding of microelectronic components to a polymer film |
| 01/13/2009 | CA2469002C Light-receiving or light-emitting semiconductor apparatus |
| 01/08/2009 | WO2009005898A1 Die attachment, die stacking, and wire embedding using film |
| 01/08/2009 | WO2009004878A1 Electronic part package, package parts and electronic device having the package, and package part manufacturing method |
| 01/08/2009 | WO2009004243A2 Assemblage of radiofrequency chips |
| 01/08/2009 | WO2009003879A1 Method for fabricating a security-protected electronic system, corresponding integrated circuit security protection device and corresponding electronic system |
| 01/08/2009 | WO2009003791A1 Electronic module and method for producing an electronic module |
| 01/08/2009 | US20090011548 Hybrid integrated circuit device and manufacturing method thereof |
| 01/08/2009 | US20090011540 Die-wafer package and method of fabricating same |
| 01/08/2009 | US20090008798 Semiconductor device suitable for a stacked structure |
| 01/08/2009 | US20090008797 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 01/08/2009 | US20090008774 Semiconductor device |
| 01/08/2009 | DE19903342B4 Multi-Chipmodul-Gehäuse für Mikrowellenanwendungen mit Hochfrequenz-Anschlußstift-Gitteranordnung Multi-chip module housing for microwave applications with high frequency pin grid array |
| 01/08/2009 | DE102008027703A1 Halbleiterbauelement Semiconductor device |
| 01/07/2009 | EP2012358A1 Semiconductor device and semiconductor device manufacturing method |
| 01/07/2009 | EP2012357A2 Method of manufacturing a semi conductor device |
| 01/07/2009 | EP2011844A1 Adhesive tape, semiconductor package, and electronic device |
| 01/07/2009 | EP2011762A2 Semiconductor device with a sensor connected to an external element |
| 01/07/2009 | EP2011163A2 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 01/07/2009 | EP0910121B1 Semiconductor device |
| 01/07/2009 | CN201178100Y Organic electro-luminescence display screen having organic solar cell |
| 01/07/2009 | CN101339972A Backlight module and LED thereof |
| 01/07/2009 | CN101339942A Semi-conductor encapsulation connecting construction avoiding welding defect induced by warp of substrate |
| 01/07/2009 | CN101339932A Support construction LED |
| 01/07/2009 | CN101339927A 半导体器件 Semiconductor devices |
| 01/07/2009 | CN100449932C Power module and electric transportation apparatus incorporating the same |
| 01/07/2009 | CN100449776C Interlayer dielectric and pre-applied die attach adhesive materials |
| 01/07/2009 | CN100449756C Electric motor and method for producing said motor |
| 01/07/2009 | CN100449755C Three-dimensional semiconductor package, and spacer chip used therein |
| 01/07/2009 | CN100449754C Semiconductor device and its aking method |
| 01/07/2009 | CN100449753C Capsulation structure of luminous secondary body |
| 01/07/2009 | CN100449752C Method for manufacturing circuit device |
| 01/07/2009 | CN100449747C Chip scale stacking system and method |
| 01/07/2009 | CN100449745C Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 01/07/2009 | CN100449743C Chip structure and stacked chip packing structure |
| 01/06/2009 | US7474351 Solder reflux method for holding cryogenically aligned parts |
| 01/06/2009 | US7474121 Configurable memory design for masked programmable logic |
| 01/06/2009 | US7473992 Multi-layer interconnection circuit module and manufacturing method thereof |
| 01/06/2009 | US7473989 Flip-chip package |
| 01/06/2009 | US7473934 Semiconductor light emitting device, light emitting module and lighting apparatus |
| 01/06/2009 | US7473879 LED illumination system having an intensity monitoring system |
| 01/06/2009 | US7473582 Method for fabricating semiconductor component with thinned substrate having pin contacts |
| 01/06/2009 | US7473014 Light emitting diode lamp and light emitting diode display unit |
| 01/02/2009 | DE4338432B4 Integrierte Halbleiterschaltungsbaueinheit, Herstellungsverfahren dafür und Montageverfahren dafür Integrated Halbleiterschaltungsbaueinheit, manufacturing method thereof, and assembly method thereof |
| 01/02/2009 | DE10313917B4 Halbleitervorrichtung Semiconductor device |
| 01/02/2009 | DE10296619B4 Leistungsmodul Power module |
| 01/02/2009 | DE10234951B4 Verfahren zur Herstellung von Halbleiterschaltungsmodulen A method for manufacturing semiconductor circuit modules |
| 01/02/2009 | DE102008023127A1 Halbleiterbauelement Semiconductor device |
| 01/02/2009 | DE102006011473B4 Mehrchipgehäuse und Verfahren zum Bilden von Mehrchipgehäusen für eine ausgeglichene Leistung Multi-chip package and method of forming of multi-chip packages for a balanced performance |
| 01/02/2009 | DE102004047681B4 LED-Schaltungsanordnung mit einem Diodengleichrichter LED circuit arrangement with a diode rectifier |
| 01/01/2009 | US20090004779 Fabrication method of semiconductor integrated circuit device |
| 01/01/2009 | US20090004762 Stacking apparatus and method for stacking integrated circuit elements |