| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/04/2009 | CN101359654A Structure of semiconductor component-buried loading board and preparation thereof |
| 02/04/2009 | CN101359653A Memory module encapsulation construction and encapsulation method thereof |
| 02/04/2009 | CN101359652A Coil type chip encapsulation construction |
| 02/04/2009 | CN101359645A Semiconductor device, premolding packaging structure and manufacture method |
| 02/04/2009 | CN101359623A Semiconductor device and method of manufacturing the same |
| 02/04/2009 | CN100459426C Single package multi-chip RF power amplifier |
| 02/04/2009 | CN100459173C Light-receiving module |
| 02/04/2009 | CN100459172C Photoelectrical coupling semiconductor device and its manufacturing method |
| 02/04/2009 | CN100459125C Semiconductor device manufacturing method |
| 02/04/2009 | CN100459124C Multiple chip packaging arrangement |
| 02/04/2009 | CN100459123C Stack type chip packaging structure, chip packaging body and manufacturing method |
| 02/04/2009 | CN100459122C Multi-chip package and producing method thereof |
| 02/04/2009 | CN100459121C RF power transistor with internal bias feed |
| 02/04/2009 | CN100459109C Cu-Mo substrate and method for producing same |
| 02/04/2009 | CN100459108C Semiconductor device |
| 02/04/2009 | CN100457036C Guard ring for direct photo-to-electron conversion detector array |
| 02/03/2009 | US7486307 Semiconductor apparatus having conductive layers and semiconductor thin films |
| 02/03/2009 | US7485971 Electronic device package |
| 02/03/2009 | US7485955 Semiconductor package having step type die and method for manufacturing the same |
| 02/03/2009 | US7485951 Modularized die stacking system and method |
| 02/03/2009 | US7485848 Optical device and production method thereof |
| 02/03/2009 | US7485571 Method of making an integrated circuit |
| 02/03/2009 | US7485490 Method of forming a stacked semiconductor package |
| 02/03/2009 | US7485489 Electronics circuit manufacture |
| 02/03/2009 | US7485202 Method for making a flat-top pad |
| 01/29/2009 | WO2009014989A1 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 01/29/2009 | WO2009014115A1 Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device |
| 01/29/2009 | WO2009013186A1 Semiconductor module |
| 01/29/2009 | WO2007118223A8 Solar plant employing cultivation of organisms |
| 01/29/2009 | US20090027863 Method for making a semiconductor multipackage module including a processor and memory package assemblies |
| 01/29/2009 | US20090026631 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 01/29/2009 | US20090026544 Semiconductor device |
| 01/29/2009 | DE102008033465A1 Halbleiterbaugruppe mit einem Gehäuse Semiconductor device having a housing |
| 01/29/2009 | DE102008031151A1 Auf einem Ultraschalltransducer eingebettete Schaltungen und Verfahren zur Herstellung von Selbigem On an ultrasonic transducer embedded circuits and methods for producing Selbigem |
| 01/29/2009 | DE102008029645A1 Halbleiter-Waferstruktur A semiconductor wafer structure |
| 01/29/2009 | DE102008026545A1 Halbleiter-Teilbaugruppen mit Verbünden und Verfahren zum Herstellen derselben Semiconductor subassemblies with composites and methods of making the same |
| 01/29/2009 | DE102007035065A1 Beleuchtungsvorrichtung Lighting device |
| 01/29/2009 | DE102007034252A1 Modul und Verfahren zu seiner Herstellung Module and method for its preparation |
| 01/29/2009 | DE10042839B4 Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung Electronic component having heat sink and method for its preparation |
| 01/28/2009 | EP2019571A2 Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | EP2019429A1 Module with an electronic component electrically connected between two substrates, in particular DCB ceramic substrates, and production method thereof |
| 01/28/2009 | EP2019428A1 Semiconductor device |
| 01/28/2009 | EP2019424A2 High performance semiconductor module with sealant device on substrate carrier and corresponding production method |
| 01/28/2009 | EP2019423A2 Standardized power packages independent of the assembly of components |
| 01/28/2009 | EP2018667A2 Power semiconductor module |
| 01/28/2009 | CN201188421Y Ultra-thin type high light effect piece type LED for middle dimension backlight source |
| 01/28/2009 | CN201188420Y Led |
| 01/28/2009 | CN201188419Y Antistatic encapsulation structure for LED |
| 01/28/2009 | CN101356584A Volatile memory elements with elevated power supply levels for programmable logic device integrated circuits |
| 01/28/2009 | CN101355080A Semiconductor integrated circuit and semiconductor device with the same |
| 01/28/2009 | CN101355079A Semiconductor device and method of fabricating the same |
| 01/28/2009 | CN101355067A Improved electrical connections for multichip modules |
| 01/28/2009 | CN101355040A Stacking structure for multiple chips and manufacturing method thereof |
| 01/28/2009 | CN101355038A Method and chip for integrating micro electromechanical system device and integrated circuit |
| 01/28/2009 | CN101354755A Semiconductor device and method for manufacturing the same |
| 01/28/2009 | CN101353572A Wavelength conversion system |
| 01/28/2009 | CN100456474C Semiconductor device, manufacturing method for semiconductor device, and electronic equipment |
| 01/28/2009 | CN100456473C Package structure of power power-supply module |
| 01/28/2009 | CN100456472C Power converter package with enhanced thermal management |
| 01/28/2009 | CN100456471C Electronic apparatus |
| 01/27/2009 | US7482861 Semiconductor integrated circuit device, and method of manufacturing the same |
| 01/27/2009 | US7482836 High bandwidth reconfigurable on-chip network for reconfigurable systems |
| 01/27/2009 | US7482698 Semiconducting device with folded interposer |
| 01/27/2009 | US7482696 Light-emitting diode package structure |
| 01/27/2009 | US7482695 Stack MCP and manufacturing method thereof |
| 01/27/2009 | US7482636 Light emitting device |
| 01/27/2009 | US7482202 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 01/27/2009 | US7481057 Low cost solar energy extraction |
| 01/22/2009 | WO2009011419A1 Device having electronic component mounted therein and method for manufacturing such device |
| 01/22/2009 | WO2008112128A3 Light emitting diode for harsh environments |
| 01/22/2009 | US20090021299 Semiconductor Device and Display Device Utilizing the Same |
| 01/22/2009 | US20090021298 Method and apparatus to select a parameter/mode based on a time measurement |
| 01/22/2009 | DE112007000267T5 Halbleiteranordnung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 01/21/2009 | EP2017892A2 Light emitting device and method of manufacturing the same |
| 01/21/2009 | EP2017891A1 Semiconductor module |
| 01/21/2009 | EP2017890A2 White light LED device |
| 01/21/2009 | EP2016628A2 Thermal isolation of electronic devices in submount used for leds lighting applications |
| 01/21/2009 | EP2016619A2 Double-sided solar module |
| 01/21/2009 | EP2016607A2 Semiconductor components and systems having encapsulated through wire interconnects (twi) and wafer level methods of fabrication |
| 01/21/2009 | EP1697745A4 Method for bonding plastic micro chip |
| 01/21/2009 | EP1639644B1 Integrated circuit package having stacked integrated circuits and method therefor |
| 01/21/2009 | EP1540769B1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 01/21/2009 | CN201185189Y High-power LED encapsulation structure |
| 01/21/2009 | CN201185188Y LED chip packaging structure capable of generating crossrange light permeating a rugged surface |
| 01/21/2009 | CN101351882A Electronic module, and method for producing one |
| 01/21/2009 | CN101351874A Soldering method and semiconductor module manufacturing method |
| 01/21/2009 | CN101350382A High power white light LED and chip thereof |
| 01/21/2009 | CN101350346A Light emitting device and method of manufacturing the same |
| 01/21/2009 | CN101350345A 半导体器件 Semiconductor devices |
| 01/21/2009 | CN101350344A Semiconductor device package and fabricating method thereof |
| 01/21/2009 | CN101350343A 30W high-power integrated encapsulation LED |
| 01/21/2009 | CN101350334A Semiconductor assembly having a housing |
| 01/21/2009 | CN101349389A Light source for vehicle headlight and vehicle headlight |
| 01/21/2009 | CN100454590C LED, LED module set and backlight system |
| 01/21/2009 | CN100454537C Electronic apparatus and method for manufacturing the same |
| 01/21/2009 | CN100454536C Semiconductor chip encapsulation structure and its application device |
| 01/21/2009 | CN100454535C Method and system for hermetically sealing packages for optics |
| 01/20/2009 | US7480883 Multiple voltage integrated circuit and design method therefor |
| 01/20/2009 | US7479825 Clock forming method for semiconductor integrated circuit and program product for the method |
| 01/20/2009 | US7479731 Multicolor light-emitting lamp and light source |